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Infineon Technologies S70FL01GSAGBHBC10
- Part No.:
- S70FL01GSAGBHBC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHBC10.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:213
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Product details
Overview
S70FL01GSAGBHBC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, 100,000 program-erase cycles endurance, and 20-year data retention. It implements two stacked S25FL512S dies in a single BGA-24 (8 × 6 mm, ZSA024) package and supports Quad DDR read, AutoBoot, and Common Flash Interface (CFI) for configuration discovery in embedded boot applications.
For engineers reviewing the S70FL01GSAGBHBC10 datasheet, S70FL01GSAGBHBC10 pinout, S70FL01GSAGBHBC10 application, or S70FL01GSAGBHBC10 equivalent, key selection considerations include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, VIO not supported, and absence of simultaneous cross-die sequential reads - all critical for bootloader partitioning and firmware update reliability.
Technical Context
This device is a dual-die stack of two S25FL512S flash memories sharing one BGA-24 package but operating independently: each die has its own CS# (CS1# and CS2#), status/configuration registers, and block protection logic. Access requires explicit chip select routing and separate command issuance per die.
It supports SPI modes 0/3, DDR read/write, extended 32-bit addressing, and Quad I/O commands compatible with S25FL-P family footprints. The device lacks VIO support (VIO/RFU pin is reserved), uses only VCC (2.7–3.6 V) for core and I/O, and operates across industrial (−40°C to +85°C) and automotive AEC-Q100 Grade 2 (−40°C to +105°C) temperature ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Read speed | Quad DDR read up to 133 MHz clock → ~266 MB/s effective throughput |
| Programming speed | 1.5 Mbytes/s max; 512-byte page buffer with Quad-input programming (QPP) |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at +85°C |
| Security | 2048-byte OTP array; hardware/software block protection; advanced sector protection (ASP) with password control |
| Supply voltage | VCC = 2.7 V to 3.6 V; no VIO support - all I/O referenced to VCC |
Pinout & Package
Package: 24-ball BGA, 8 × 6 mm, ZSA024 footprint (5 × 5 ball array), Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required for all operations targeting die #1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required for all operations targeting die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; bidirectional in multi-I/O modes |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; bidirectional in multi-I/O modes |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/Dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Edge-triggered SPI clock; supports modes 0 and 3; DDR enabled via config register |
| RESET# | Hardware Reset | Active-low asynchronous reset; internal pull-up; returns device to standby state |
| VCC | Core Power Supply | 2.7–3.6 V supply powering core logic and I/O buffers; sole power rail used |
| VSS | Ground | Reference ground for all signals and power domains |
| DNU (pins A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Internally reserved for test; must not connect to host signals; internal pull-down |
| RFU (pins A3, B3, C3, D3) | Reserved for Future Use | No internal connection; avoid PCB routing; may be used in future compatible devices |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die architecture with independent CS# | Enables flexible firmware partitioning (e.g., primary/backup image) without external multiplexing |
| AutoBoot execution | Automatically executes Normal or Quad Read at preselected address on power-up/reset - reduces boot latency |
| Common Flash Interface (CFI) | Provides standardized runtime query of geometry, timing, and protection settings - simplifies driver portability |
| Quad-input page programming (QPP) | Improves programming efficiency in low-clock-rate systems by using all four I/O lines for write data |
| Advanced Sector Protection (ASP) | Allows individual sector locking via boot code or password - prevents accidental overwrite of critical firmware |
Applications
| Secure Bootloader Storage | Firmware Update Partitioning |
|---|---|
|
Use Scenario: Storing immutable bootloader code that initializes CPU, validates firmware signature, and loads application image. IC Role / Device Role / Timing Role: Non-volatile storage for first-stage boot code with AutoBoot capability and hardware write protection. Use Value: Prevents corruption during power loss or failed updates; OTP array stores cryptographic keys; ASP blocks unauthorized reprogramming. |
Use Scenario: Hosting dual firmware images (active + candidate) for atomic over-the-air (OTA) updates in automotive ECUs. IC Role / Device Role / Timing Role: Dual-die structure enables isolated storage of two full firmware images, accessed via CS1# and CS2#. Use Value: Enables fail-safe rollback: if update fails, system boots from unmodified die; no cross-die erase dependency required. |
| Industrial HMI Configuration | Medical Device Calibration Data |
|
Use Scenario: Retaining UI layout, language packs, and user preferences across power cycles in factory HMIs. IC Role / Device Role / Timing Role: High-reliability serial flash for persistent configuration storage with 20-year retention at +85°C. Use Value: Eliminates need for battery-backed SRAM; uniform 256-kbyte sectors simplify wear leveling in field-upgradable UI assets. |
Use Scenario: Storing factory-calibrated sensor coefficients and safety-critical operational limits in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure non-volatile storage with OTP and block protection for calibration data integrity verification. Use Value: Ensures traceable, tamper-resistant calibration records compliant with IEC 62304; 100k-cycle endurance supports recalibration logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI000 | Single-die 512 Mbit; same architecture, pin-compatible SOIC-16 and BGA variants; no CS2# or dual-die coordination overhead | Lower density; suitable when full 1 Gbit is unnecessary and simpler die management is preferred | Select for cost-sensitive designs where dual-image redundancy isn't required and board space allows SOIC-16 |
| MX25L1G45GMIL0 | Micron 1 Gbit SPI flash; single-die; supports octal DTR mode; no dual-CS or die-stacking; different CFI layout and security register map | Lacks native dual-image isolation; requires external logic or software layer to emulate die separation | Choose when higher bandwidth (octal DTR) is prioritized over hardware-enforced firmware partitioning |
Compared with S25FL512SAGMFI000 and MX25L1G45GMIL0, the S70FL01GSAGBHBC10 uniquely delivers hardware-isolated dual-die operation in one package - enabling deterministic, lockstep firmware redundancy without software arbitration or external switching.
Availability
S70FL01GSAGBHBC10 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial HMI configuration retention, and medical device calibration data logging requiring stable component supply across extended temperature and long lifecycle programs.
Supply support for S70FL01GSAGBHBC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.
The S70FL01GS belongs to Infineon's FL-S SPI flash product line, designed specifically for high-reliability embedded boot and firmware storage in automotive, industrial, and medical systems demanding AEC-Q100 compliance and long-term data integrity.
FAQ
Does S70FL01GSAGBHBC10 support true simultaneous access to both dies?
No. The device does not support concurrent operations across CS1# and CS2#. Each die must be accessed sequentially: commands issued to CS1# affect only die #1, and those to CS2# affect only die #2. Simultaneous read/write to both dies is not possible due to shared internal bus and command decoder architecture.
Can AutoBoot be configured to execute Quad Read from either die?
Yes. AutoBoot can be set to initiate a Normal or Quad Read command from a preselected 32-bit address on power-up or reset. The target die is determined by the address range: addresses 0x00000000–0x07FFFFFF map to die #1 (CS1#), and 0x08000000–0x0FFFFFFF map to die #2 (CS2#), as defined in the CFI geometry byte.
Is VIO pin functional in this part?
No. The VIO/RFU pin (BGA pin A4) is marked RFU (Reserved for Future Use) and is not connected internally. The device operates I/O signals solely from VCC (2.7–3.6 V); no separate I/O voltage rail is supported or required.
How is block protection managed across the two dies?
Each die maintains independent block protection registers (TBPROT, BPNV, FREEZE). Protection settings must be written separately to each die. If FREEZE is set on one die, it remains locked until power-on-reset is applied to that specific die - not globally. Consistent settings across both dies are recommended for predictable behavior.
S70FL01GSAGBHBC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHBC10 FAQ
1.How can I place an order for S70FL01GSAGBHBC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHBC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHBC10 reliable?
The price and inventory of S70FL01GSAGBHBC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHBC10 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHBC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHBC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHBC10?
S70FL01GSAGBHBC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHBC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHBC10?
For technical support, including S70FL01GSAGBHBC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHBC10 requirements.
6.How does Aetrix verify that S70FL01GSAGBHBC10 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHBC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHBC10 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHBC10?
All S70FL01GSAGBHBC10 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHBC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHBC10 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHBC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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