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Infineon Technologies S70FL01GSAGBHBC13
- Part No.:
- S70FL01GSAGBHBC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHBC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,138
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Product details
Overview
S70FL01GSAGBHBC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It integrates two S25FL512S dies in a single BGA-24 package and supports Quad DDR read, AutoBoot, and Common Flash Interface (CFI) for configuration.
For engineers reviewing the S70FL01GSAGBHBC13 datasheet, S70FL01GSAGBHBC13 pinout, S70FL01GSAGBHBC13 application, or S70FL01GSAGBHBC13 equivalent, key selection considerations include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, VIO not supported, and absence of sequential read across die boundaries.
Technical Context
The S70FL01GSAGBHBC13 implements a dual-die stack architecture where each die operates independently: separate chip selects (CS1# and CS2#), dedicated status/configuration registers, and isolated block protection logic. Sector erase, programming, and DDR learning must be executed per die.
It supports SPI modes 0 and 3, quad I/O command set compatible with S25FL-P family, and AutoBoot execution from preselected address on power-up/reset. CFI data is provided per die, with byte 27h indicating device size as 1Bh (227 bytes = 128 Mbyte).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Programming speed | 1.5 Mbytes/s with 512-byte page buffer and Quad-input Page Program (QPP) |
| Data retention | Minimum 20 years at 85°C; validated per JEDEC JESD22-A117 |
| Endurance | 100,000 program-erase cycles per sector, per die |
| Operating voltage | VCC: 2.7 V to 3.6 V; VIO not supported (RFU in this device) |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C); industrial and automotive qualified |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to access lower 128 Mbyte address space |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to access upper 128 Mbyte address space |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; supports standard SPI and multi-I/O protocols |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; enables dual/quad read modes |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in single/dual mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer in single/dual mode; IO3 in Quad-I/O; internal pull-up |
| SCK | Serial Clock | Drives all SPI timing; supports DDR clocking with phase-aligned sampling |
| RESET# | Hardware Reset | Asynchronous active-low reset; returns device to standby; internal pull-up |
| VCC | Core Power Supply | 2.7–3.6 V supply for flash core and logic; decoupling required per layout guidelines |
| VSS | Ground | Reference for all I/O and core signals; low-inductance connection critical for noise immunity |
| DNU | Do Not Use | Reserved for test; internal pull-down; must not be connected to host system signals |
| NC | No Connect | Unbonded pad; safe for PCB routing but voltage must not exceed VCC |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies sharing one BGA package; enables 1 Gbit density without redesigning board layout |
| Quad DDR read capability | Enables up to 80 MB/s effective throughput using double-data-rate on four I/O lines |
| AutoBoot function | Executes Normal or Quad Read automatically at power-up/reset from user-configurable address, reducing boot firmware overhead |
| OTP array | 2048-byte one-time-programmable area for secure keys, calibration data, or unique identifiers |
| Advanced sector protection (ASP) | Individual sector lock via boot code or password; FREEZE bit prevents accidental unlock until power-on-reset |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated display assets, gauge configurations, and over-the-air (OTA) update staging area in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile firmware and asset storage with AEC-Q100 Grade 2 reliability and fast Quad DDR read for UI rendering latency reduction. Use Value: Dual-die independence allows parallel firmware validation (die 1 = active, die 2 = update candidate), minimizing downtime during OTA updates. |
Use Scenario: Holding real-time control firmware, safety-critical configuration tables, and field-upgradable logic in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability code storage with 20-year data retention and 100K-cycle endurance under frequent reprogramming cycles. Use Value: Independent status registers per die enable deterministic firmware rollback by validating checksums before switching CS# activation. |
| Medical Imaging Boot Loader | Avionics Data Recorder |
|
Use Scenario: Secure boot loader storage with cryptographic signature verification and tamper-resistant OTP key storage in diagnostic imaging systems. IC Role / Device Role / Timing Role: Trusted boot source with hardware write protection (WP#) and ASP-enabled sector locking for regulatory compliance (IEC 62304). Use Value: FREEZE bit ensures boot sector integrity remains locked after initial provisioning-prevents runtime modification even during maintenance mode. |
Use Scenario: Capturing high-fidelity flight telemetry and storing black-box logs with guaranteed write persistence under vibration and thermal stress. IC Role / Device Role / Timing Role: High-endurance non-volatile storage supporting cyclic logging with 256-kbyte sector granularity for efficient wear leveling. Use Value: Uniform sector size and independent erase per die allow time-sliced logging across both dies, extending total usable lifetime beyond 100K cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI000 | Single-die 512 Mbit; identical command set, same SOIC/BGA footprints, no CS2# or dual-die coordination logic | Lacks dual-die features: no simultaneous die operation, no cross-die AutoBoot address mapping, no independent status registers | Select when 512 Mbit capacity suffices and simplified register management is preferred for cost-sensitive designs |
| MX25L1G45GMIL0 | Micron 1 Gbit SPI flash; single-die architecture; supports octal DTR mode; no AEC-Q100 qualification | Higher bandwidth (octal DTR) but lacks automotive temperature grade and dual-die redundancy for fail-safe firmware partitioning | Select for consumer-grade high-throughput applications where AEC-Q100 compliance and die-level isolation are not required |
Compared with S25FL512SAGMFI000 and MX25L1G45GMIL0, the S70FL01GSAGBHBC13 uniquely delivers automotive-grade dual-die isolation-enabling fault-containment in safety-critical boot paths and deterministic die-swapping for zero-downtime firmware updates.
Availability
S70FL01GSAGBHBC13 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics data recorders requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for S70FL01GSAGBHBC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.
The FL-S family targets high-reliability embedded systems requiring SPI flash with extended temperature range, security features, and automotive qualification-designed specifically for mission-critical boot and firmware storage.
FAQ
Does S70FL01GSAGBHBC13 support true single-command 1 Gbit bulk erase?
No. Due to its dual-die stack architecture, bulk erase must be issued separately to each die using CS1# and CS2#. There is no unified command that erases both dies simultaneously. This design ensures fault isolation but requires host firmware to manage two independent erase sequences with appropriate inter-die timing delays.
Can sequential reads cross from the end of die 1 to the start of die 2?
No. Sequential reads are not supported across die boundaries. Reading beyond the 128 Mbyte boundary of die 1 will wrap within that die. To access contiguous addresses spanning both dies, the host must issue separate read commands-first using CS1#, then CS2#-and manually concatenate the data in software.
Is VIO pin functional on S70FL01GSAGBHBC13?
No. The VIO pin is marked RFU (Reserved for Future Use) and is not supported in this device. It must be left unconnected or tied to VSS per datasheet guidance. All I/O signaling operates from the VCC supply (2.7–3.6 V), and no separate I/O voltage rail is used or required.
How does block protection behave across the two dies?
Each die maintains fully independent block protection settings-including TBPROT, BPNV, and FREEZE bits. Protection ranges are defined relative to each die's local address space. If FREEZE is set on one die, it remains locked until that die undergoes a power-on-reset; setting FREEZE on one die has no effect on the other die's protection state.
S70FL01GSAGBHBC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHBC13 FAQ
1.How can I place an order for S70FL01GSAGBHBC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHBC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHBC13 reliable?
The price and inventory of S70FL01GSAGBHBC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHBC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHBC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHBC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHBC13?
S70FL01GSAGBHBC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHBC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHBC13?
For technical support, including S70FL01GSAGBHBC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHBC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBHBC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHBC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHBC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHBC13?
All S70FL01GSAGBHBC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHBC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHBC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHBC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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