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Infineon Technologies S70FL01GSAGBHEC10
- Part No.:
- S70FL01GSAGBHEC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHEC10.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,041
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Product details
Overview
S70FL01GSAGBHEC10 from Infineon Technologies (formerly Cypress) is a military-grade 1 Gbit (128 Mbyte) dual-die SPI flash memory with 2.7–3.6 V core supply, −55 °C to +125 °C operating range, and support for Quad I/O, DDR, and AutoBoot. It implements two stacked S25FL512S dies accessed independently via CS1# and CS2#, enabling high-density nonvolatile storage in avionics, radar, and hardened embedded systems.
For engineers reviewing the S70FL01GSAGBHEC10 datasheet, S70FL01GSAGBHEC10 pinout, S70FL01GSAGBHEC10 application, or S70FL01GSAGBHEC10 equivalent, key selection criteria include dual-die addressing behavior, sector-erase independence per die, CFI-compatibility with S25FL-P family, and absence of VIO support - all critical for deterministic boot and field-upgrade reliability in MIL-STD-810 environments.
Technical Context
The S70FL01GSAGBHEC10 integrates two independent 512 Mbit S25FL512S dies in a single package, each with its own status/configuration registers, block protection logic, and erase/program control paths. Chip selects CS1# and CS2# isolate access to individual dies; no cross-die sequential reads or bulk erase commands are supported.
It supports SPI modes 0 and 3, DDR clocking, 32-bit extended addressing, and AutoBoot from preselected addresses. All security features - OTP array (2048 B), ASP, and hardware/software block protection - operate per-die, requiring synchronized register writes to maintain functional consistency across both arrays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (128 Mbyte) total, implemented as two independent 512 Mbit dies |
| Supply Voltage | 2.7 V to 3.6 V core - enables operation across wide input rail tolerances in military power systems |
| Temperature Range | −55 °C to +125 °C (Military E grade) - qualified per MIL-PRF-38535 requirements |
| Interface | SPI with Quad I/O and DDR support - delivers up to 104 MHz Quad SDR or 80 MHz Quad DDR read throughput |
| Erase Granularity | Uniform 256 kbyte sectors - requires separate sector erase commands per die |
| Endurance & Retention | 100 program-erase cycles minimum; 20-year data retention - validated under accelerated life testing at max temperature |
| Security | 2048-byte OTP array + Advanced Sector Protection (ASP) with password control - provides immutable firmware signing keys and selective sector lockdown |
Pinout & Package
Available in 16-lead SOIC (300 mil) and 24-ball BGA (8 × 6 mm, ZSA024 footprint). VIO pin (SOIC pin 14 / BGA ball E4) is RFU and not connected internally.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; must be asserted low to enable command execution on Die 1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; independent control required for dual-die management |
| SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3 | Quad I/O Signals | Support single/dual/quad I/O modes; IO2 and IO3 become active only in Quad mode |
| RESET# | Hardware Reset Input | Active-low asynchronous reset; internal pull-up allows floating if unused - critical for deterministic cold-start recovery |
| VCC, VSS | Core Power & Ground | Dedicated 3.0 V core supply pins; no VIO rail - simplifies power design but limits I/O voltage flexibility |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Die Architecture | Two independent S25FL512S dies with separate CS#, status registers, and erase/program control - enables redundancy-aware firmware partitioning |
| AutoBoot Function | Configurable automatic Normal or Quad read at power-up/reset from user-defined address - eliminates external boot controller dependency |
| Common Flash Interface (CFI) | CFI data compliant with JEDEC JESD68; byte 27h = 1Bh confirms 230 byte device size - enables standardized bootloader detection and configuration |
| Advanced Sector Protection (ASP) | Password-protected individual sector lock/unlock per die - prevents unauthorized field updates to safety-critical partitions |
| Quad-Input Page Programming (QPP) | Enables high-speed programming on slow-clock hosts (e.g., 10 MHz SCK) - reduces boot time in resource-constrained controllers |
Applications
| Avionics Boot Memory | Radar Signal Processing Storage |
|---|---|
Use Scenario: Stores certified flight software and configuration tables in DO-254-compliant airborne computing modules. IC Role / Device Role / Timing Role: Nonvolatile boot source with AutoBoot and CFI identification - ensures deterministic initialization without host CPU intervention. Use Value: Dual-die isolation prevents corruption propagation between primary and backup firmware images during radiation-induced SEUs. | Use Scenario: Captures and retains real-time pulse-Doppler processing results in ground-based phased-array radar front ends. IC Role / Device Role / Timing Role: High-throughput Quad DDR read buffer for waveform reconstruction - sustains >600 MB/s effective bandwidth at 80 MHz clock. Use Value: 256 kbyte uniform sectors allow atomic overwrite of radar frame buffers without disrupting adjacent mission-critical calibration data. |
| Tactical Radio Firmware Vault | Hardened Industrial PLC Configuration |
Use Scenario: Secures cryptographic keys and protocol stacks in NSA-certified HF/VHF radios operating in contested EM environments. IC Role / Device Role / Timing Role: OTP + ASP-enabled secure storage - enforces hardware-rooted trust chain for over-the-air updates. Use Value: 2048-byte OTP array stores immutable root-of-trust keys; ASP password lock prevents tampering during field maintenance. | Use Scenario: Maintains calibrated I/O mapping and safety logic parameters in SIL-3-rated programmable logic controllers deployed in oil refinery control rooms. IC Role / Device Role / Timing Role: Radiation-tolerant, long-retention configuration store - survives 20+ years of thermal cycling at 125 °C ambient. Use Value: −55 °C to +125 °C rating and 20-year data retention guarantee uninterrupted operation across extreme industrial lifecycle demands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI000 | Single 512 Mbit die, same 24-ball BGA (ZSA024) footprint, identical register set and command set | Lacks dual-die capacity and CS2# interface - suitable only where 512 Mbit density suffices | Select when system firmware fits within one die and board layout rework for CS2# routing is impractical |
| S70FL01GSAGBHEC00 | Same dual-die architecture and pinout, but commercial temperature grade (0 °C to +70 °C) | Not qualified for military thermal cycling or extended storage life - excludes use in sealed, uncooled enclosures | Select for cost-sensitive ground-test or lab prototypes where full MIL-spec qualification is unnecessary |
Compared with S25FL512SAGMFI000 and S70FL01GSAGBHEC00, the S70FL01GSAGBHEC10 uniquely delivers guaranteed 1 Gbit density with military-grade thermal endurance and dual-die fault isolation - essential for systems where firmware integrity must survive simultaneous radiation events across redundant channels.
Availability
S70FL01GSAGBHEC10 is available at Aetrix Electronics and suitable for avionics boot memory, radar signal processing storage, and tactical radio firmware vault applications requiring stable component supply across extended product lifecycles.
Supply support for S70FL01GSAGBHEC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor, and memory solutions for industrial, automotive, and aerospace markets.
The S70FL01GSAGBHEC10 belongs to Infineon's military-grade SPI flash memory product line, designed specifically for high-reliability, radiation-tolerant, and long-lifecycle embedded systems where deterministic boot, secure firmware update, and extended data retention are mandatory.
FAQ
Does S70FL01GSAGBHEC10 support simultaneous read/write across both dies?
No. The device requires sequential access: CS1# must be asserted to access Die 1, and CS2# to access Die 2. Simultaneous operations - including concurrent reads, writes, or erases - are not supported due to shared internal bus arbitration and independent status register domains.
Is the VIO pin functional on this part?
No. Pin 14 (SOIC) and ball E4 (BGA) are marked RFU (Reserved for Future Use) and internally unconnected. The S70FL01GSAGBHEC10 operates exclusively from the VCC rail (2.7–3.6 V); no separate I/O voltage supply is implemented or supported.
How does AutoBoot behave after power-on-reset?
AutoBoot executes a preconfigured Normal or Quad Read command from a user-programmed start address immediately after power stabilization or RESET# deassertion. The command type and address are stored in nonvolatile configuration registers and persist across power cycles without host intervention.
Can sector protection settings be synchronized automatically between the two dies?
No. Block protection bits (TBPROT, BPNV, FREEZE) reside in each die's dedicated status register and must be written separately via CS1# and CS2#. Infineon recommends identical bit values across both dies to ensure consistent protection behavior during die-switching operations.
S70FL01GSAGBHEC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHEC10 FAQ
1.How can I place an order for S70FL01GSAGBHEC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHEC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHEC10 reliable?
The price and inventory of S70FL01GSAGBHEC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHEC10 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHEC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHEC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHEC10?
S70FL01GSAGBHEC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHEC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHEC10?
For technical support, including S70FL01GSAGBHEC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHEC10 requirements.
6.How does Aetrix verify that S70FL01GSAGBHEC10 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHEC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHEC10 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHEC10?
All S70FL01GSAGBHEC10 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHEC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHEC10 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHEC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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