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Infineon Technologies S70FL01GSAGBHEC13
- Part No.:
- S70FL01GSAGBHEC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHEC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,630
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Product details
Overview
S70FL01GSAGBHEC13 from Infineon Technologies (formerly Cypress) is a military-grade 1 Gbit (128 Mbyte) dual-die SPI flash memory with 2.7–3.6 V core supply, −55 °C to +125 °C operating range, and uniform 256-kbyte sector erase architecture. It implements two independent S25FL512S dies stacked in one package, each accessible via dedicated chip select (CS1# and CS2#), supporting Quad-IO, DDR, and AutoBoot read modes for embedded boot code storage.
For engineers reviewing the S70FL01GSAGBHEC13 datasheet, S70FL01GSAGBHEC13 pinout, S70FL01GSAGBHEC13 application, or S70FL01GSAGBHEC13 equivalent, key selection criteria include dual-die address boundary handling, independent status/configuration register management per die, military temperature compliance, 100 program-erase cycles, and 20-year data retention - critical for avionics, defense computing, and high-reliability firmware storage.
Technical Context
The S70FL01GSAGBHEC13 integrates two discrete S25FL512S dies in a single package, requiring separate command issuance per die via CS1# or CS2#. Each die maintains autonomous status registers, configuration registers, bank address registers, and security/DDR registers - no cross-die auto-increment or unified addressing.
It supports SPI modes 0 and 3, DDR clocking, extended 32-bit addressing, and CFI-compliant identification. Read commands include Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, and Quad DDR; programming uses 512-byte page buffers with Quad-Input Page Programming (QPP); erase operates on uniform 256-kbyte sectors per die.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (128 Mbyte) total, implemented as two independent 512 Mbit dies |
| Interface | Quad-SPI with DDR support, SPI modes 0/3, 32-bit extended addressing |
| Operating Voltage | 2.7 V to 3.6 V core supply; VIO not supported (RFU) |
| Temperature Range | Military grade: −55 °C to +125 °C ambient |
| Erase Architecture | Uniform 256-kbyte sectors per die; bulk erase requires separate command per die |
| Data Retention | Minimum 20 years at max operating temperature |
| Endurance | Minimum 100 program-erase cycles per sector |
Pinout & Package
Available in 16-lead SOIC (300 mil) and 24-ball BGA (8 × 6 mm, ZSA024 footprint). VIO pin/ball is Reserved for Future Use (RFU); RESET# is active-low and bonded out; DNU pins are internally reserved for test and must not be connected in system design.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1#, CS2# | Dedicated chip select inputs | Selects first or second die independently; no shared access or automatic die switching |
| SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3 | Multi-I/O bidirectional signals | Support single/dual/quad I/O modes; IO2/IO3 become functional only in Quad mode |
| RESET# | Hardware reset input | Active-low; internal pull-up; resets both dies simultaneously when asserted |
| VCC, VSS | Core power and ground | Single 2.7–3.6 V supply domain for both dies; no separate I/O voltage rail |
| NC, RFU, DNU | Unused/reserved terminals | No internal connection (NC), future use (RFU), or test-only (DNU); must not route signals |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies sharing one package but requiring separate CS#/command sequencing |
| AutoBoot functionality | Executes preselected Normal or Quad read at power-up/reset from configurable address - enables direct boot execution |
| Common Flash Interface (CFI) | Provides standardized configuration data (e.g., geometry byte 27h = 1Bh) for host firmware auto-detection and initialization |
| Advanced Sector Protection (ASP) | Per-die password- or boot-code-controlled individual sector locking - prevents unauthorized firmware overwrite in mission-critical systems |
| OTP array | 2048-byte One-Time-Programmable area for secure keys, calibration data, or device-specific identifiers |
Applications
| Avionics Boot Memory | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and FPGA configuration bitstreams in airborne mission computers where radiation tolerance and thermal cycling resilience are mandatory. IC Role / Device Role / Timing Role: Nonvolatile firmware storage with deterministic read latency under −55 °C to +125 °C; AutoBoot ensures immediate execution post-power-on. Use Value: Dual-die independence allows redundant firmware partitioning; 20-year retention eliminates field reprogramming logistics in deployed platforms. | Use Scenario: Holding encrypted communication stack firmware and cryptographic keys in handheld military radios exposed to desert and arctic environments. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using OTP and ASP; Quad DDR reads deliver >100 MB/s effective throughput for rapid channel reconfiguration. Use Value: Independent sector protection per die enables isolated key storage and firmware update zones - critical for FIPS 140-2 Level 3 compliance. |
| Missile Guidance System Code | Secure Satellite Payload Memory |
Use Scenario: Hosting real-time guidance algorithms and sensor calibration tables in solid-fuel missile control units subjected to high-G launch vibration and vacuum thermal extremes. IC Role / Device Role / Timing Role: High-reliability nonvolatile memory with 100-cycle endurance and MIL-STD-883 qualified packaging; RESET# enables safe cold-start recovery. Use Value: Uniform 256-kbyte sectors simplify wear leveling across mission profiles; dual-die isolation prevents single-point failure in safety-critical flight software. | Use Scenario: Storing telemetry processing firmware and orbital maneuvering parameters in LEO satellite payloads requiring zero maintenance over 15+ year missions. IC Role / Device Role / Timing Role: Radiation-hardened-by-design SPI flash with 20-year data retention; CFI support enables autonomous bootloader validation during orbit insertion. Use Value: Separate CS1#/CS2# control allows concurrent firmware verification and update staging - reducing ground-command window dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S70FL01GSDSBHI013 | Same dual-die 1 Gbit architecture, but in 24-ball BGA (ZSA024) with industrial temperature range (−40 °C to +85 °C) | Lacks military temperature qualification and extended life testing; unsuitable for flight hardware | Select only for cost-sensitive ground-test or lab prototypes where full MIL-spec is not required |
| MX25L1G45GMI-12G | Single-die 1 Gbit SPI flash; no dual-CS architecture; supports octal DDR but lacks CFI and ASP features | No per-die security or independent register control; limited to commercial-grade reliability | Use only in non-safety-critical industrial controllers where dual-die redundancy and military qualification are unnecessary |
Compared with S70FL01GSDSBHI013 and MX25L1G45GMI-12G, the S70FL01GSAGBHEC13 uniquely delivers dual-die isolation with military temperature operation, CFI-based auto-configuration, and hardware-enforced sector protection - essential for certified airborne and defense electronics where firmware integrity is non-negotiable.
Availability
S70FL01GSAGBHEC13 is available at Aetrix Electronics and suitable for avionics boot memory, tactical radio firmware storage, missile guidance system code, and secure satellite payload memory requiring stable component supply across extended product lifecycles.
Supply support for S70FL01GSAGBHEC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and secure microcontrollers for automotive, industrial, and aerospace markets.
The S70FL01GSAGBHEC13 belongs to Infineon's high-reliability flash memory portfolio derived from Cypress' MirrorBit® Eclipse™ architecture, designed specifically for mission-critical firmware storage in environments demanding extended temperature operation and long-term data integrity.
FAQ
What is the physical memory organization of the S70FL01GSAGBHEC13?
The device contains two physically independent 512 Mbit S25FL512S dies stacked in one package. Each die has its own 64 Mbyte address space, accessed exclusively via CS1# or CS2#. There is no hardware-level address wraparound between dies - sequential reads across die boundaries require explicit CS# toggling and manual address offset calculation.
Does the S70FL01GSAGBHEC13 support VIO (Versatile I/O voltage)?
No. The VIO pin (pin 14 in SOIC, ball E4 in BGA) is marked RFU (Reserved for Future Use) and has no internal connection. The device operates solely from the 2.7–3.6 V VCC supply. Any attempt to apply voltage to VIO may damage the part, and PCB layout must isolate this terminal from signal routing.
How does block protection work across the two dies?
Each die maintains fully independent block protection settings via its own status register TBPROT and BPNV bits. Protection ranges are configured separately per die, and the FREEZE bit must be cleared individually after power-on-reset on each die. Default state protects no sectors; top-address protection must be explicitly enabled per die.
Can the S70FL01GSAGBHEC13 be used as a drop-in replacement for S25FL512S?
No. While built from two S25FL512S dies, the S70FL01GSAGBHEC13 requires distinct command sequencing due to dual-CS architecture, separate status register access, and absence of continuous 128 Mbyte addressing. Host firmware must manage CS1#/CS2# toggling, duplicate configuration writes, and handle die-boundary read transitions explicitly.
S70FL01GSAGBHEC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHEC13 FAQ
1.How can I place an order for S70FL01GSAGBHEC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHEC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHEC13 reliable?
The price and inventory of S70FL01GSAGBHEC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHEC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHEC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHEC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHEC13?
S70FL01GSAGBHEC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHEC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHEC13?
For technical support, including S70FL01GSAGBHEC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHEC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBHEC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHEC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHEC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHEC13?
All S70FL01GSAGBHEC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHEC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHEC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHEC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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