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Infineon Technologies S70FL01GSAGBHIC10
- Part No.:
- S70FL01GSAGBHIC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHIC10.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:676
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Product details
Overview
S70FL01GSAGBHIC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply (2.7–3.6 V), and industrial-plus temperature grade (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 (ZSA024, 8 × 6 mm) package, supports Quad DDR read up to 1.5 Mbytes/s programming and 0.5 Mbytes/s erase, and features OTP array (2048 bytes), ASP, and CFI-compliant configuration for embedded boot storage.
For engineers reviewing the S70FL01GSAGBHIC10 datasheet, S70FL01GSAGBHIC10 pinout, S70FL01GSAGBHIC10 application, or S70FL01GSAGBHIC10 equivalent, key selection considerations include dual-die addressing behavior, independent CS1#/CS2# control, absence of VIO support, sector-wise erase per die, and compatibility with S25FL-P family command sets and footprint.
Technical Context
The S70FL01GSAGBHIC10 integrates two independent 512 Mbit S25FL512S dies sharing one BGA-24 package but requiring separate chip select (CS1# and CS2#) activation. Each die maintains autonomous status/configuration registers, block protection bits, and ASP registers - no cross-die auto-sequencing is supported.
It supports SPI modes 0/3, DDR read/write, extended 32-bit addressing, and AutoBoot from preselected address on power-up/reset. VIO pin is RFU (not functional); I/O voltage is tied to VCC (1.65–3.6 V), and all timing parameters are specified under SDR/DDR AC test conditions per Rev. *O datasheet.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read and QPP programming |
| Core Voltage | 2.7 V to 3.6 V - enables direct integration with 3.3 V system rails without level shifting |
| Temperature Grade | Industrial Plus (−40°C to +105°C) - qualified for extended thermal environments in industrial edge controllers |
| Erase Granularity | Uniform 256-kbyte sectors - requires separate sector erase commands per die |
| Endurance & Retention | 100,000 program-erase cycles minimum; 20-year data retention at max operating temperature |
| Security | 2048-byte OTP array + Advanced Sector Protection (ASP) with password- or boot-code-controlled individual sector lock |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free. VIO is RFU (not connected internally); NC pins are safe for PCB routing; DNU pins must remain unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates top die only; required to access first 512 Mbit address space |
| CS2# | Chip Select 2 | Activates bottom die only; required to access second 512 Mbit address space |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; supports standard and multi-I/O command protocols |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; used in Dual/Quad read and DDR modes |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in single/dual mode; becomes IO2 in Quad mode |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer in single/dual mode; becomes IO3 in Quad-I/O |
| RESET# | Hardware Reset | Asynchronous active-low reset with internal pull-up; returns device to standby state |
| VCC | Core Power Supply | Supplies both dies; 2.7–3.6 V range supports wide-margin 3.3 V systems |
| VSS | Ground | Common reference for both dies; requires low-impedance PCB plane |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package enable 1 Gbit density while maintaining S25FL-P footprint compatibility |
| AutoBoot execution | Executes Normal or Quad Read automatically at power-up/reset from user-configurable address - reduces host firmware initialization overhead |
| Common Flash Interface (CFI) | Provides standardized configuration metadata (e.g., geometry, timing, vendor ID) enabling runtime detection and driver portability across flash families |
| Independent die control | Each die has dedicated CS#, status/config registers, and block protection - allows asymmetric configuration for partitioned firmware/storage use cases |
| Quad-input page programming (QPP) | Enables high-throughput programming (1.5 Mbytes/s) even with low-frequency clocks by using all four I/O lines for data input |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating continuously in factory-floor environments with ambient temperatures up to +105°C. IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic read latency during cold start and field firmware updates via SPI. Use Value: 20-year data retention and 100K-cycle endurance ensure long-term reliability without refresh; dual-die layout allows segregated storage of bootloader (die 1) and application image (die 2). | Use Scenario: Holding certified boot code and sensor calibration data for automotive camera/radar ECUs requiring AEC-Q100 Grade 2 qualification (−40°C to +105°C). IC Role / Device Role / Timing Role: Secure, fast-read SPI flash supporting Quad DDR reads for sub-100 ms boot time compliance. Use Value: ASP and OTP enable hardware-enforced integrity of safety-critical boot code; independent CS1#/CS2# allow parallel validation of primary and backup images. |
| Edge Gateway OTA Storage | Medical Imaging System Configuration |
Use Scenario: Hosting over-the-air update packages and rollback partitions in cellular-connected industrial gateways deployed remotely for years. IC Role / Device Role / Timing Role: High-density, secure storage for versioned firmware bundles with atomic update capability via sector-level erase control. Use Value: Uniform 256-kbyte sectors simplify OTA partitioning; OTP stores cryptographic keys offline, isolating them from field-updatable regions. | Use Scenario: Storing DICOM configuration profiles, calibration tables, and regulatory audit logs in portable ultrasound and MRI subsystems requiring traceable, tamper-resistant storage. IC Role / Device Role / Timing Role: CFI-compliant non-volatile memory enabling plug-and-play driver initialization and runtime parameter persistence across power cycles. Use Value: CFI data allows host OS to auto-detect geometry and timing without hardcoded assumptions; 20-year retention meets medical device lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI00 | Single-die 128 Mbyte (1 Gbit) SPI flash; no dual-die stack; supports VIO (1.65–3.6 V independent I/O rail) | Lacks CS2# and die-separation control; simpler address mapping but no per-die security isolation | Select when VIO decoupling is required or when dual-die management complexity must be avoided |
| S70FL01GSAGBHIA10 | Same dual-die architecture and pinout, but Industrial grade (−40°C to +85°C) instead of Industrial Plus | Lower max operating temperature; identical timing, security, and command set | Select for cost-sensitive industrial applications where +105°C operation is not required |
Compared with S25FL128SAGMFI00, the S70FL01GSAGBHIC10 provides die-level security partitioning and thermal margin for harsh environments; compared with S70FL01GSAGBHIA10, it extends operational life in thermally constrained enclosures without changing PCB layout or firmware.
Availability
S70FL01GSAGBHIC10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image hosting, and edge gateway OTA storage requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FL01GSAGBHIC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification aligned to ISO/TS 16949 and AEC-Q100.
The FL-S family targets high-reliability embedded systems requiring SPI flash with enhanced security, extended temperature operation, and seamless migration from legacy S25FL-A/K/P series - optimized for boot code, firmware, and configuration storage.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSAGBHIC10?
CS1# selects the top 512 Mbit die; CS2# selects the bottom 512 Mbit die. Both are active-low and mutually exclusive - only one die responds per transaction. Sequential reads across die boundaries require explicit switching between CS1# and CS2#, as automatic wraparound is not supported.
Does the S70FL01GSAGBHIC10 support independent configuration of each die's security registers?
Yes. Each die has its own ASP register, Password Register, PPB Lock/Access Registers, and FREEZE bit. Settings must be written separately to each die; Infineon recommends mirroring values across both dies to avoid inconsistent protection states during die switching.
Can VIO be used to supply a different voltage than VCC on this part?
No. VIO is marked RFU (Reserved for Future Use) and is not functional in the S70FL01GSAGBHIC10. I/O voltage is derived solely from VCC (2.7–3.6 V), and the VIO pin must be left unconnected or tied to VSS per datasheet guidance.
How does AutoBoot work, and what address does it target by default?
AutoBoot executes a Normal or Quad Read command automatically after power-up or RESET#, targeting a user-programmable 24-bit address stored in the Configuration Register. The default address is 0x000000, but it can be reconfigured via Write Configuration Register (WRCR) command to point to custom boot vector locations.
S70FL01GSAGBHIC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHIC10 FAQ
1.How can I place an order for S70FL01GSAGBHIC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHIC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHIC10 reliable?
The price and inventory of S70FL01GSAGBHIC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHIC10 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHIC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHIC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHIC10?
S70FL01GSAGBHIC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHIC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHIC10?
For technical support, including S70FL01GSAGBHIC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHIC10 requirements.
6.How does Aetrix verify that S70FL01GSAGBHIC10 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHIC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHIC10 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHIC10?
All S70FL01GSAGBHIC10 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHIC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHIC10 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHIC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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