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Infineon Technologies S70FL01GSAGBHIC13
- Part No.:
- S70FL01GSAGBHIC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHIC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,431
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Product details
Overview
S70FL01GSAGBHIC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, AutoBoot, and Common Flash Interface (CFI) for configuration.
For engineers reviewing the S70FL01GSAGBHIC13 datasheet, S70FL01GSAGBHIC13 pinout, S70FL01GSAGBHIC13 application, or S70FL01GSAGBHIC13 equivalent, key selection considerations include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, VIO not supported, and absence of sequential reads across die boundaries.
Technical Context
The S70FL01GSAGBHIC13 integrates two independent 512 Mbit S25FL512S dies in a monolithic BGA-24 package, each with its own command interface, status register, configuration register, and block protection logic. Chip selects CS1# and CS2# enable discrete access to each die; simultaneous operation is prohibited.
It supports SPI modes 0 and 3, DDR read commands (Fast DDR/Dual DDR/Quad DDR), and extended 32-bit addressing. AutoBoot executes preconfigured Normal or Quad Read at power-up/reset. VIO pin is RFU - I/O voltage is tied to VCC (2.7–3.6 V), eliminating separate I/O rail design complexity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Single/Dual/Quad/DDR read and write commands |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate command per die |
| Endurance & retention | 100,000 program-erase cycles minimum; 20-year data retention minimum |
| Operating temperature | Industrial Plus (−40°C to +105°C); AEC-Q100 Grade 2 qualified |
| Supply voltage | VCC = 2.7 V to 3.6 V; VIO not supported (RFU) |
| Security features | 2048-byte OTP array; hardware/software block protection; advanced sector protection (ASP) |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to access lower 512 Mbyte address space |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to access upper 512 Mbyte address space |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; no internal pull-down |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; no internal pull-down |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in standard/Dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Edge-triggered clock input; supports up to 104 MHz SDR and 80 MHz DDR |
| RESET# | Hardware Reset | Active-low reset with internal pull-up; returns device to standby state |
| VCC | Core Power Supply | 2.7–3.6 V supply for core and I/O; no separate VIO rail |
| VSS | Ground | Common reference for all signals and supplies |
| DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Reserved for test; internal pull-down; must not connect to host signals or PCB routing |
| RFU pins (A3, B3, C3, D3) | Reserved for Future Use | No internal connection; avoid PCB routing to preserve compatibility with future variants |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die architecture | Two independent S25FL512S dies sharing one BGA-24 package; enables 1 Gbit density without increasing footprint |
| AutoBoot functionality | Executes configurable Normal or Quad Read at predefined address on power-up/reset - eliminates boot firmware polling overhead |
| Independent die control | Separate CS#, status registers, configuration registers, and block protection per die - ensures deterministic partitioning for safety-critical applications |
| Quad DDR read support | Enables 80 MHz DDR clock → 160 MB/s effective read throughput - critical for fast boot and code execution from flash |
| OTP and ASP security | 2048-byte one-time-programmable array plus password-controlled individual sector protection - meets automotive secure boot requirements |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated gauge graphics, firmware, and over-the-air (OTA) update images in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile code/data storage with AEC-Q100 Grade 2 qualification and 20-year retention. Use Value: Dual-die isolation allows concurrent OTA staging (upper die) and active runtime execution (lower die), reducing update downtime. | Use Scenario: Holds ladder logic firmware, configuration parameters, and diagnostic logs in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability SPI flash with 100K-cycle endurance for frequent field updates. Use Value: Independent CS1#/CS2# control enables segregated firmware (CS1#) and log buffer (CS2#), preventing corruption during simultaneous access. |
| Medical Imaging Boot Memory | Avionics Display System |
Use Scenario: Stores boot loader, FPGA bitstream, and DICOM image lookup tables in portable ultrasound devices. IC Role / Device Role / Timing Role: Fast Quad DDR read (160 MB/s) accelerates FPGA configuration and UI rendering. Use Value: AutoBoot triggers immediate Quad Read at fixed address, cutting boot time by >35% vs. polled initialization. | Use Scenario: Provides certified firmware and display assets for cockpit multifunction displays (MFDs). IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash with hardware block protection for DO-254 compliance. Use Value: OTP array stores cryptographic keys; ASP enforces read/write lock on safety-critical display calibration sectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI010 | Single-die 512 Mbit; same pinout but no CS2# or dual-die control logic | Lacks die-isolated update capability; unsuitable for concurrent boot/staging | Select when 512 Mbit capacity suffices and dual-die coordination adds unnecessary complexity |
| MX25L1G45GMIL0 | 1 Gbit single-die; no CS2#, no dual-die architecture; different command set (no AutoBoot) | Does not support die-level erase or independent status registers; no AEC-Q100 Grade 2 rating | Select for cost-sensitive industrial applications where automotive qualification and die-level control are not required |
Compared with S25FL512SAGMFI010 and MX25L1G45GMIL0, the S70FL01GSAGBHIC13 uniquely delivers die-isolated command execution, AutoBoot, and AEC-Q100 Grade 2 qualification - essential for automotive and safety-critical embedded systems requiring concurrent firmware staging and execution.
Availability
S70FL01GSAGBHIC13 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging devices, and avionics display systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for S70FL01GSAGBHIC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The FL-S family targets high-reliability embedded systems requiring SPI flash with multi-I/O bandwidth, automotive qualification, and advanced security - designed specifically for ADAS, digital cockpits, and industrial control.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSAGBHIC13?
CS1# selects the first 512 Mbit die (lower 512 Mbyte address space), while CS2# selects the second 512 Mbit die (upper 512 Mbyte address space). Each die operates independently: status registers, configuration bits, and block protection must be managed separately per chip select. Simultaneous access is not supported.
Does the S70FL01GSAGBHIC13 support continuous sequential reads across both dies?
No. Sequential reads crossing the 512 Mbyte boundary (from end of die 1 to start of die 2) are not supported. To read across both dies, the host must issue separate read commands using CS1# for the first die and CS2# for the second die, with explicit address management.
Is the VIO pin functional on this device?
No. The VIO pin is marked RFU (Reserved for Future Use) and is not supported in the S70FL01GSAGBHIC13. I/O voltage is derived solely from VCC (2.7–3.6 V). Connecting VIO to any voltage source may cause undefined behavior or damage.
How does AutoBoot work, and what address does it use?
AutoBoot executes a preconfigured Normal or Quad Read command automatically after power-up or RESET#. The target address is stored in non-volatile configuration registers and can be programmed by the user. Default behavior is disabled; enabling AutoBoot requires writing to specific configuration bits before power cycle.
S70FL01GSAGBHIC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHIC13 FAQ
1.How can I place an order for S70FL01GSAGBHIC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHIC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHIC13 reliable?
The price and inventory of S70FL01GSAGBHIC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHIC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHIC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHIC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHIC13?
S70FL01GSAGBHIC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHIC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHIC13?
For technical support, including S70FL01GSAGBHIC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHIC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBHIC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHIC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHIC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHIC13?
All S70FL01GSAGBHIC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHIC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHIC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHIC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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