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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S70FL01GSAGBHMC10

Name: S70FL01GSAGBHMC10
Brand: Infineon Technologies
SKU: S70FL01GSAGBHMC10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S70FL01GSAGBHMC10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-TBGA

Datasheet:: S70FL01GSAGBHMC10.pdf

Description:: IC FLASH 1GBIT SPI/QUAD 24BGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S70FL01GSAGBHMC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase granularity. It supports Normal/Fast/Dual/Quad/DDR read modes, 512-byte page programming, and delivers 1.5 Mbytes/s write and 0.5 Mbytes/s erase throughput. Used in automotive instrument clusters for firmware storage with AEC-Q100 Grade 2 qualification (−40°C to +105°C).

For engineers reviewing the S70FL01GSAGBHMC10 datasheet, S70FL01GSAGBHMC10 pinout, S70FL01GSAGBHMC10 application, or S70FL01GSAGBHMC10 equivalent, key selection criteria include dual-die stack management, independent CS1#/CS2# die addressing, Quad I/O command compatibility with S25FL-P family, and OTP array security for boot code protection.

Technical Context

This device integrates two S25FL512S dies in a single package, requiring separate chip select (CS1# and CS2#) control for independent die access. Each die maintains autonomous status/configuration/bank address/security registers, with no cross-die sequential reads or bulk erase commands supported.

It implements Infineon's 65 nm MirrorBit® Eclipse™ architecture with hardware/software block protection, ASP, and 2048-byte OTP array. VIO is RFU-only VCC (2.7–3.6 V) and VSS are active power supplies; all I/O pins support 1.65–3.6 V operation.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory size	1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies
Interface	SPI Multi-I/O with Quad and DDR modes; compatible with S25FL-P command set and footprint
Erase granularity	Uniform 256-kbyte sectors; no full-chip bulk erase-requires separate sector erase per die
Programming speed	1.5 Mbytes/s max; uses 512-byte page buffer and Quad-input page programming (QPP)
Data retention	Minimum 20 years at 85°C; validated for automotive Grade 2 (−40°C to +105°C)
Endurance	100,000 program-erase cycles per sector, per die
Security	2048-byte one-time-programmable (OTP) array; hardware/software block protection with FREEZE bit lock

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free. VIO pin is RFU (not connected internally); NC and DNU pins must not be used for PCB routing.

Pin/Terminal	Circuit Role	Design Meaning
CS1#	Chip Select 1	Active-low enable for first 512 Mbit die; required to initiate any operation on Die 1
CS2#	Chip Select 2	Active-low enable for second 512 Mbit die; required to initiate any operation on Die 2
SI/IO0	Serial Input / IO0	Single-bit input or Quad I/O line 0; supports standard SPI and Quad I/O protocols
SO/IO1	Serial Output / IO1	Single-bit output or Quad I/O line 1; enables Dual/Quad read modes
WP#/IO2	Write Protect / IO2	Hardware write protection in standard mode; becomes IO2 in Quad mode; internal pull-up
HOLD#/IO3	Hold / IO3	Pauses ongoing serial transfer in standard/Dual mode; becomes IO3 in Quad mode; internal pull-up
RESET#	Hardware Reset	Active-low global reset; returns both dies to standby; internal pull-up allows floating if unused
VCC	Core Supply	2.7–3.6 V core power; powers logic and memory array of both dies
VSS	Ground	Common ground reference for both dies and I/O circuitry

Key Features

Feature	Design Value
Dual-die stack architecture	Two independent S25FL512S dies sharing one BGA package-enables 1 Gbit density without redesigning PCB layout from 512 Mbit footprints
AutoBoot capability	Executes preconfigured Normal or Quad read at power-up/reset from user-selected address-reduces boot latency in safety-critical automotive systems
Common Flash Interface (CFI)	Provides standardized configuration data at known offsets (e.g., byte 27h = 1Bh for device size)-enables runtime detection and driver portability across FL-S families
Independent die register control	Status, Configuration, Bank Address, and Security registers are fully duplicated per die-requires explicit per-die register writes to maintain functional consistency
AEC-Q100 Grade 2 qualification	Validated for −40°C to +105°C operation with full parametric testing-meets thermal stress requirements for engine bay and ADAS ECU deployments

Applications

Automotive Instrument Cluster

ADAS Domain Controller Firmware Storage

Use Scenario: Stores graphical UI assets, calibration tables, and real-time gauge rendering code in digital dashboards.

IC Role / Device Role / Timing Role: Non-volatile firmware and asset repository accessed via Quad SPI during boot and runtime updates.

Use Value: 20-year data retention ensures lifetime integrity of safety-critical display content without field recalls.

Use Scenario: Holds sensor fusion algorithms, camera calibration profiles, and OTA update staging area in centralized ADAS ECUs.

IC Role / Device Role / Timing Role: High-bandwidth, secure code storage with OTP-protected boot loader and ASP-enabled sector lockdown.

Use Value: Dual-die independence allows concurrent read from one die while programming the other-minimizing update downtime.

Industrial PLC Program Memory

Medical Imaging System Boot Image

Use Scenario: Retains ladder logic programs, I/O mapping, and firmware patches in programmable logic controllers operating in factory environments.

IC Role / Device Role / Timing Role: Reliable, long-life program storage with hardware write protection against accidental overwrites during maintenance.

Use Value: 100,000-cycle endurance supports frequent firmware revisions across 15+ year product lifecycles.

Use Scenario: Stores certified boot images and DICOM protocol stacks in FDA-cleared diagnostic imaging equipment.

IC Role / Device Role / Timing Role: Secure, tamper-resistant boot medium with OTP array holding cryptographic keys and signature verification code.

Use Value: FREEZE bit locking prevents unauthorized modification of protected sectors-even after power cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S25FL512SAGMFI00	Single-die 512 Mbit; identical command set, timing, and package (ZSA024), but half capacity	No dual-die coordination overhead; simpler register management and no CS2# requirement	Select when 512 Mbit suffices and system software lacks dual-die arbitration logic
MX25L1G45GM2I-12G	Monolithic 1 Gbit die; no CS2#, no per-die register separation; supports continuous 1 Gbit sequential reads	Eliminates die boundary handling in bootloader and file system drivers	Select when unified address space and simplified driver stack outweigh need for Infineon-specific security features

Compared with S25FL512SAGMFI00, S70FL01GSAGBHMC10 doubles density without changing footprint but adds die management complexity; compared with MX25L1G45GM2I-12G, it trades seamless addressing for hardened automotive qualification and OTP-based boot security.

Availability

S70FL01GSAGBHMC10 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, industrial PLCs, and medical imaging systems requiring stable component supply with AEC-Q100 compliance and long-term data integrity.

Supply support for S70FL01GSAGBHMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded systems requiring SPI flash with extended temperature operation, robust security, and automotive qualification-designed specifically for ECU firmware, telematics, and safety-critical boot storage.

FAQ

What is the function of CS1# and CS2# on the S70FL01GSAGBHMC10?

CS1# and CS2# are independent chip select inputs that enable access to each of the two internal 512 Mbit flash dies. CS1# controls the first die; CS2# controls the second. Both must be asserted separately-no command affects both dies simultaneously. This architecture requires explicit die selection in firmware before any read, write, or erase operation.

Does the S70FL01GSAGBHMC10 support continuous sequential reads across the full 1 Gbit address space?

No. Sequential reads cannot cross the boundary between the two internal dies. Reading beyond the end of Die 1 (address 0x00000000–0x07FFFFFF) will not wrap to Die 2. To access the full 1 Gbit, host firmware must issue separate read commands using CS1# for addresses 0x00000000–0x07FFFFFF and CS2# for 0x08000000–0x0FFFFFFF.

Is VIO pin functional on the S70FL01GSAGBHMC10?

No. The VIO pin is marked RFU (Reserved for Future Use) and is not connected internally. Section 7 of the datasheet explicitly states VIO is unsupported in this device. Only VCC (2.7–3.6 V) supplies core and I/O logic; all I/O pins operate within 1.65–3.6 V relative to VSS, regardless of VIO state.

How does the OTP array enhance security in automotive applications?

The 2048-byte OTP array stores immutable data such as cryptographic keys, boot loader signatures, or calibration checksums. Once programmed, bits cannot be erased or rewritten-ensuring root-of-trust integrity. In automotive use, this prevents unauthorized firmware modifications and enables secure boot chain validation required by ISO 26262 ASIL-B/C systems.

S70FL01GSAGBHMC10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FL-S

Package/Case:: 24-TBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: SPI - Quad I/O

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 24-BGA (8x6)

S70FL01GSAGBHMC10 FAQ

1.How can I place an order for S70FL01GSAGBHMC10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70FL01GSAGBHMC10 reliable?

The price and inventory of S70FL01GSAGBHMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHMC10 is usually 5 days.

3.What payment methods are accepted for S70FL01GSAGBHMC10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHMC10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70FL01GSAGBHMC10?

S70FL01GSAGBHMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70FL01GSAGBHMC10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70FL01GSAGBHMC10?

For technical support, including S70FL01GSAGBHMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHMC10 requirements.

6.How does Aetrix verify that S70FL01GSAGBHMC10 is sourced from the original manufacturer or authorized distributors?

All S70FL01GSAGBHMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHMC10 meets industry standards.

7.What is the process for return or replacement of S70FL01GSAGBHMC10?

All S70FL01GSAGBHMC10 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHMC10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70FL01GSAGBHMC10 part is unused and in its original packaging.

Return procedure for S70FL01GSAGBHMC10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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