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Infineon Technologies S70FL01GSAGBHMC13
- Part No.:
- S70FL01GSAGBHMC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHMC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,843
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Product details
Overview
S70FL01GSAGBHMC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, QPP programming, and AutoBoot at power-up.
For engineers reviewing the S70FL01GSAGBHMC13 datasheet, S70FL01GSAGBHMC13 pinout, S70FL01GSAGBHMC13 application, or S70FL01GSAGBHMC13 equivalent, key selection considerations include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, VIO not supported, and absence of sequential reads across die boundaries.
Technical Context
This device is a dual-die stack of two S25FL512S flash dies sharing one BGA-24 package, each with independent chip select (CS1# and CS2#), status registers, configuration registers, and block protection logic. Access requires explicit die selection - no cross-die commands are supported.
It supports SPI modes 0/3, DDR read/write, extended 32-bit addressing, and CFI-compliant identification. The device lacks VIO support (VIO/RFU pin is reserved), operates from 2.7–3.6 V core, and uses Infineon's 65 nm MirrorBit® Eclipse™ architecture for enhanced reliability in automotive and industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read and Quad-input page programming |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate command per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at max operating temperature |
| Operating voltage | Core: 2.7–3.6 V; I/O: 1.65–3.6 V; VIO not supported |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C), qualified for automotive powertrain and ADAS |
| Security features | 2048-byte OTP array, ASP, individual sector protection via boot code/password, TBPROT/BPNV control per die |
Pinout & Package
Package: 24-ball BGA (8 × 6 mm, ZSA024 footprint, 5 × 5 ball array), Pb-free, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to access lower 512 Mbyte address space |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to access upper 512 Mbyte address space |
| SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3 | Multi-I/O bidirectional signals | Support single/dual/quad I/O modes; IO2/IO3 become functional only in Quad mode |
| RESET# | Hardware reset input | Active-low asynchronous reset with internal pull-up; resets both dies simultaneously |
| VCC, VSS | Power and ground | Core supply only; no separate VIO rail - VIO/RFU pin is reserved and unused |
| DNU pins (A1, A2, B1, B2, C1, D1, E1) | Do Not Use | Internally reserved for test; must not be connected to host system or used for PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package enable 1 Gbit density without increasing footprint or interface complexity |
| AutoBoot execution | Automatically executes Normal or Quad read at preselected address on power-up or reset - reduces boot firmware latency |
| Independent die control | Each die has dedicated CS#, status/config registers, and block protection - enables flexible partitioning of storage space |
| Quad DDR read capability | Enables up to 80 MB/s effective read throughput (at 80 MHz clock with DDR) for high-speed code XIP applications |
| Advanced sector protection (ASP) | Per-die password- or boot-code-controlled locking of individual sectors - critical for secure firmware update partitions |
Applications
| Automotive Powertrain ECUs | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine control maps and real-time diagnostic logs in diesel/gasoline ECU modules. IC Role / Device Role / Timing Role: Non-volatile code and data storage with AEC-Q100 Grade 2 qualification and 20-year retention at 105°C. Use Value: Dual-die isolation allows separate locking of calibration data (die 1) and log buffers (die 2), preventing accidental overwrite during field updates. | Use Scenario: Holding firmware images, configuration tables, and recipe data in modular industrial controllers with long product lifecycles. IC Role / Device Role / Timing Role: High-reliability SPI flash supporting Quad DDR reads for fast boot and deterministic firmware load times. Use Value: 256-kbyte uniform sectors simplify OTA update partitioning; OTP array stores cryptographic keys for secure boot verification. |
| ADAS Camera Module Boot Memory | Railway Signaling System Log Storage |
Use Scenario: Booting image signal processor (ISP) firmware and storing runtime calibration parameters in front-facing camera modules. IC Role / Device Role / Timing Role: Low-latency Quad read memory with AutoBoot support and −40°C to +105°C operation. Use Value: Independent CS1#/CS2# control enables concurrent ISP boot (die 1) and parameter logging (die 2), eliminating bus arbitration delays. | Use Scenario: Archiving safety-critical event logs and configuration snapshots in EN 5012x-certified signaling hardware. IC Role / Device Role / Timing Role: Long-retention, high-endurance flash with sector-level write protection for tamper-resistant logging. Use Value: ASP and TBPROT bits per die allow immutable log archives (die 1) and reconfigurable operational data (die 2) under same physical package. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | Single-die 128 Mbyte (1 Gbit) FL-S flash; identical pinout but no CS2# or dual-die control logic | Lacks die-isolated erase/program and independent status registers; unsuitable for partitioned firmware+log architectures | Select when full 1 Gbit density is needed without dual-die management overhead |
| MX25L1G45GM2I-10G | 1 Gbit SPI flash from Macronix; supports single-die Quad DDR but no AutoBoot or ASP; different CFI layout and OTP size (1024 B) | No AEC-Q100 qualification; limited to industrial grade (−40°C to +85°C); no dual-CS architecture | Select for cost-sensitive industrial designs where automotive qualification and die-level security are not required |
Compared with S25FL128SAGMFI000 and MX25L1G45GM2I-10G, the S70FL01GSAGBHMC13 uniquely delivers die-isolated control, AEC-Q100 Grade 2 operation, and ASP-enabled sector locking - essential for safety-critical automotive and railway applications requiring fault-containment between firmware and runtime data partitions.
Availability
S70FL01GSAGBHMC13 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLC firmware storage, and ADAS camera module boot memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70FL01GSAGBHMC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
The S70FL01GS belongs to Infineon's FL-S family of SPI Multi-I/O flash memories, designed specifically for automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and advanced security features like ASP and OTP.
FAQ
Does S70FL01GSAGBHMC13 support true single-command bulk erase across the full 1 Gbit capacity?
No. Due to its dual-die stack architecture, bulk erase must be issued separately to each die using CS1# and CS2#. There is no single command that erases both dies simultaneously - this ensures fault containment but requires host firmware to manage two independent erase sequences.
Can S70FL01GSAGBHMC13 be used in place of a single-die 1 Gbit SPI flash without modifying the host controller firmware?
No. Host firmware must explicitly manage CS1# and CS2# to access lower and upper 512 Mbyte regions. Sequential reads across die boundaries are unsupported, and status/configuration registers must be polled per die - direct drop-in replacement is not possible without driver-level adaptation.
What is the function of the VIO/RFU pin on S70FL01GSAGBHMC13?
The VIO/RFU pin is reserved for future use and has no active function. Infineon explicitly states VIO is not supported in this device. It must not be connected to any voltage source or signal line and should remain floating or tied per board-level noise mitigation guidelines - it does not supply I/O voltage.
How does AutoBoot work when both CS1# and CS2# are asserted simultaneously?
AutoBoot executes only on the die selected by the active chip select. If both CS1# and CS2# are low at power-up, behavior is undefined per datasheet - the device may respond unpredictably or default to CS1#. Reliable AutoBoot requires exactly one chip select to be asserted during reset, with the target address preconfigured in the corresponding die's configuration register.
S70FL01GSAGBHMC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHMC13 FAQ
1.How can I place an order for S70FL01GSAGBHMC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHMC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHMC13 reliable?
The price and inventory of S70FL01GSAGBHMC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHMC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHMC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHMC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHMC13?
S70FL01GSAGBHMC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHMC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHMC13?
For technical support, including S70FL01GSAGBHMC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHMC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBHMC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHMC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHMC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHMC13?
All S70FL01GSAGBHMC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHMC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHMC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHMC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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