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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S70FL01GSAGBHVC10

Name: S70FL01GSAGBHVC10
Brand: Infineon Technologies
SKU: S70FL01GSAGBHVC10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S70FL01GSAGBHVC10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-TBGA

Datasheet:: S70FL01GSAGBHVC10.pdf

Description:: IC FLASH 1GBIT SPI/QUAD 24BGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S70FL01GSAGBHVC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, QPP programming, and CFI configuration for embedded boot and firmware storage.

For engineers reviewing the S70FL01GSAGBHVC10 datasheet, S70FL01GSAGBHVC10 pinout, S70FL01GSAGBHVC10 application, or S70FL01GSAGBHVC10 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, absence of VIO support, simultaneous die operation limitations, and OTP array size for secure firmware partitioning.

Technical Context

The S70FL01GSAGBHVC10 integrates two independent S25FL512S dies sharing one BGA-24 footprint, each with dedicated status/configuration registers, sector protection, and erase control. It requires separate chip-select activation (CS1# or CS2#) per die and does not support cross-die sequential reads or bulk erase in a single command.

It supports SPI modes 0/3, DDR timing with learning register, AutoBoot from preselected address, and hardware/software block protection using TBPROT/BPNV bits. The device omits VIO functionality - VIO/RFU pin is reserved and unused - and relies solely on VCC (2.7–3.6 V) for core and I/O power.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory capacity	1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies
Interface	SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read commands
Programming speed	1.5 Mbytes/s with 512-byte page buffer and Quad-input page programming
Erase granularity	Uniform 256-kbyte sectors; no full-chip bulk erase without per-die commands
Endurance & retention	≥100,000 program-erase cycles; ≥20 years data retention at max operating temperature
Security features	2048-byte OTP array; ASP, individual sector protection, and FREEZE bit per die
Operating voltage	VCC = 2.7–3.6 V; VIO not supported - VIO/RFU pin is reserved
Temperature grade	AEC-Q100 Grade 2: −40°C to +105°C

Pinout & Package

Package: 24-ball BGA, 8 × 6 mm, ZSA024 footprint (5 × 5 ball array), Pb-free.

Pin/Terminal	Circuit Role	Design Meaning
CS1#	Chip Select 1	Activates first 512 Mbit die; required for all operations targeting Die #1
CS2#	Chip Select 2	Activates second 512 Mbit die; required for all operations targeting Die #2
SI/IO0	Serial Input / IO0	Data input in single/dual mode; IO0 in quad mode; shared across both dies
SO/IO1	Serial Output / IO1	Data output in single/dual mode; IO1 in quad mode; shared across both dies
WP#/IO2	Write Protect / IO2	Hardware write protection in non-quad mode; IO2 in quad mode; internal pull-up
HOLD#/IO3	Hold / IO3	Pauses ongoing serial transfer; IO3 in quad-I/O mode; internal pull-up
SCK	Serial Clock	Drives SPI timing; common to both dies; polarity/phase modes 0 and 3 supported
RESET#	Hardware Reset	Asynchronous reset; returns device to standby; internal pull-up; optional connection
VCC	Core Power Supply	2.7–3.6 V supply for logic and memory array; powers both dies
VSS	Ground	Common ground reference for both dies and interface signals
VIO/RFU	Reserved	No functional connection; not supported in S70FL01GS; must not be used for routing
DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2)	Do Not Use	Internally reserved for test; internal pull-down; must remain unconnected or tied to VSS
NC (B3)	No Connect	No internal signal; safe for PCB routing but voltage ≤ VCC

Key Features

Feature	Design Value
Dual-die stack architecture	Two independent S25FL512S dies in one BGA package enable 1 Gbit density while maintaining S25FL-P family compatibility
AutoBoot execution	Automatically executes Normal or Quad read at power-up/reset from user-configurable address, simplifying boot loader initialization
Common Flash Interface (CFI)	Provides standardized configuration data at known offsets (e.g., byte 27h = 1Bh), enabling host firmware to auto-detect geometry and capabilities
Independent die management	Status, configuration, bank address, security, and block protection registers are duplicated per die and require separate access
OTP array for firmware partitioning	2048-byte one-time-programmable space allows secure storage of keys, calibration data, or immutable boot code segments

Applications

Automotive ADAS Controller Boot

Industrial PLC Firmware Storage

Use Scenario: Storing boot code and safety-critical firmware for radar/EPS ECUs requiring AEC-Q100 Grade 2 compliance and 20-year data retention.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with AutoBoot capability and OTP-secured bootloader signature verification.

Use Value: Dual-die isolation prevents corruption propagation between firmware partitions; FREEZE bit ensures irreversible protection of safety-critical sectors after field update.

Use Scenario: Holding programmable logic controller firmware, configuration tables, and real-time OS images in factory automation systems operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: High-reliability SPI flash for deterministic firmware load during cold start and field firmware updates over CAN or Ethernet.

Use Value: 100,000-cycle endurance supports frequent OTA updates; Quad DDR read enables sub-100 ms boot time from 128 Mbyte image.

Medical Imaging System Calibration Data

5G Baseband Radio Firmware

Use Scenario: Storing calibrated sensor coefficients and DICOM metadata lookup tables in MRI/CT scanners where data integrity must survive 15+ years of thermal cycling.

IC Role / Device Role / Timing Role: Secure, long-retention non-volatile storage for mission-critical calibration parameters accessed at system power-on.

Use Value: OTP array stores factory-calibrated values immune to accidental overwrite; CFI enables host to validate memory geometry before loading correction algorithms.

Use Scenario: Hosting FPGA bitstreams and DSP firmware in massive MIMO radio units deployed in outdoor enclosures with −40°C to +105°C thermal profiles.

IC Role / Device Role / Timing Role: High-speed SPI flash supporting fast reconfiguration of RF front-end FPGAs during beamforming recalibration.

Use Value: Dual-die architecture allows parallel firmware load to separate processing domains; QPP programming enables <5 s field update of 64 Mbyte bitstream.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S25FL128SAGMFI000	Single-die 128 Mbyte (1 Gbit) FL-S flash; identical SOIC-16 and BGA-24 footprints; no dual-die stacking or CS2# pin	Lacks dual-die isolation and per-die register control; unsuitable for applications requiring die-level fault containment	Select when simpler single-die management suffices and AutoBoot from fixed address is acceptable
MX25L1G45GM2I-12G	1 Gbit Macronix SPI flash; supports octal DDR; no CFI; different OTP layout (1024-byte); no AEC-Q100 Grade 2 rating	Not qualified for automotive temp range; lacks FREEZE bit and ASP; CFI-dependent host initialization fails	Select only for industrial-grade designs where octal interface bandwidth outweighs automotive qualification and security needs

Compared with S25FL128SAGMFI000, the S70FL01GSAGBHVC10 adds die-level independence and fault isolation at the cost of more complex register management; compared with MX25L1G45GM2I-12G, it delivers certified automotive reliability and standardized CFI-based detection but trades off octal interface speed.

Availability

S70FL01GSAGBHVC10 is available at Aetrix Electronics and suitable for automotive ADAS controllers, industrial PLCs, medical imaging systems, and 5G baseband radios requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.

Supply support for S70FL01GSAGBHVC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The S70FL01GS belongs to Infineon's FL-S SPI flash product line, designed specifically for high-reliability automotive and industrial applications demanding extended temperature operation, robust security, and seamless migration from legacy S25FL families.

FAQ

Is VIO pin functional on the S70FL01GSAGBHVC10?

No. The VIO/RFU pin is reserved and not supported in this device. Section 7 of the datasheet explicitly states VIO is RFU (Reserved for Future Use) and must not be connected to any voltage source or signal. Core and I/O functions operate solely from VCC (2.7–3.6 V).

Can S70FL01GSAGBHVC10 be used as a drop-in replacement for S25FL512S?

No. While built from two S25FL512S dies, the S70FL01GSAGBHVC10 requires explicit CS1#/CS2# control and separate register access per die. It lacks single-die simplicity and cannot emulate a 512 Mbit part without firmware-level abstraction of dual-die addressing and state management.

What happens if CS1# and CS2# are asserted simultaneously?

The device does not define behavior for simultaneous CS1# and CS2# assertion. Per Section 4.2, only one die may be accessed at a time. Concurrent chip select may result in undefined command interpretation, bus contention, or failed status register reads. Design must ensure strict mutual exclusion between CS1# and CS2# activation.

How is the 2048-byte OTP array organized and accessed?

The OTP array occupies physical addresses 0x00000000–0x000007FF in each die and is programmed using standard SPI Write Enable + Page Program commands. Once locked via Status Register bit SRWD, further writes are disabled. OTP contents persist across power cycles and are readable via standard Read commands, but cannot be erased.

S70FL01GSAGBHVC10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FL-S

Package/Case:: 24-TBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: SPI - Quad I/O

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-BGA (8x6)

S70FL01GSAGBHVC10 FAQ

1.How can I place an order for S70FL01GSAGBHVC10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHVC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70FL01GSAGBHVC10 reliable?

The price and inventory of S70FL01GSAGBHVC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHVC10 is usually 5 days.

3.What payment methods are accepted for S70FL01GSAGBHVC10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHVC10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70FL01GSAGBHVC10?

S70FL01GSAGBHVC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70FL01GSAGBHVC10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70FL01GSAGBHVC10?

For technical support, including S70FL01GSAGBHVC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHVC10 requirements.

6.How does Aetrix verify that S70FL01GSAGBHVC10 is sourced from the original manufacturer or authorized distributors?

All S70FL01GSAGBHVC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHVC10 meets industry standards.

7.What is the process for return or replacement of S70FL01GSAGBHVC10?

All S70FL01GSAGBHVC10 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHVC10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70FL01GSAGBHVC10 part is unused and in its original packaging.

Return procedure for S70FL01GSAGBHVC10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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