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Infineon Technologies S70FL01GSAGBHVC13
- Part No.:
- S70FL01GSAGBHVC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHVC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,150
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Product details
Overview
S70FL01GSAGBHVC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, uniform 256-kbyte sector erase, and 100,000 program-erase cycles. It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, AutoBoot, and CFI configuration for embedded boot code storage in automotive and industrial controllers.
For engineers reviewing the S70FL01GSAGBHVC13 datasheet, S70FL01GSAGBHVC13 pinout, S70FL01GSAGBHVC13 application, or S70FL01GSAGBHVC13 equivalent, key selection considerations include dual-die addressing behavior, independent CS1#/CS2# die control, absence of VIO support, and mandatory per-die status/configuration register management.
Technical Context
The S70FL01GSAGBHVC13 integrates two independent S25FL512S flash dies sharing a common SOIC/BGA footprint but requiring separate chip select (CS1# and CS2#) activation. Each die maintains autonomous status, configuration, bank address, and security registers - no cross-die auto-sequencing is supported.
It supports SPI modes 0 and 3, DDR read commands (Fast DDR/Dual DDR/Quad DDR), and extended 32-bit addressing. Sequential reads across die boundaries require explicit CS# switching; bulk erase and programming must be issued per die. VIO pin is RFU and not functional.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read modes |
| Erase granularity | Uniform 256-kbyte sectors; no full-chip bulk erase - requires separate erase per die |
| Endurance | 100,000 program-erase cycles minimum per sector |
| Data retention | 20 years minimum at +85°C |
| Supply voltage | VCC = 2.7 V to 3.6 V; VIO is RFU - not connected or powered |
| Temperature grade | Automotive AEC-Q100 Grade 2 (−40°C to +105°C) |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates first 512 Mbit die; required for all operations targeting die #1 |
| CS2# | Chip Select 2 | Activates second 512 Mbit die; required for all operations targeting die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; used for command/address/data in standard/quad mode |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; bidirectional in Quad mode |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer in standard/Dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Edge-triggered clock input; supports up to 104 MHz SDR and 52 MHz DDR |
| VCC | Core Power Supply | 2.7–3.6 V core supply; powers both dies and logic interface |
| VSS | Ground | Common reference for all signals and core power |
| RESET# | Hardware Reset | Active-low asynchronous reset; returns device to standby; internal pull-up |
| DNU pins (A1, A2, B1, B2, C1, D1, E1, E2) | Do Not Use | Reserved for test; internal pull-down; must not connect to host signals or PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package enable 1 Gbit density without changing footprint or signal count |
| AutoBoot functionality | Executes preconfigured Normal or Quad read at power-up/reset from user-defined address - reduces boot firmware latency |
| Common Flash Interface (CFI) | Provides standardized JEDEC-compliant geometry and parameter tables for automatic host configuration detection |
| Advanced Sector Protection (ASP) | Enables individual sector lock/unlock via password or boot code - supports secure firmware update partitioning |
| OTP array | 2048-byte one-time-programmable area for immutable keys, calibration data, or device identity storage |
Applications
| Automotive ADAS Controller Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Non-volatile boot memory with AutoBoot execution and CFI-based host initialization. Use Value: Enables deterministic cold-boot timing under −40°C to +105°C; OTP stores cryptographic keys for secure boot verification. | Use Scenario: Holds field-upgradable firmware and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability SPI flash supporting Quad DDR reads for fast firmware load during restart. Use Value: 100K-cycle endurance and 20-year retention ensure >10-year field life without refresh; ASP protects critical configuration sectors. |
| Medical Imaging System Image Buffer | Telecom Baseband Processor Code Storage |
Use Scenario: Stores FPGA configuration bitstreams and diagnostic image lookup tables in portable ultrasound devices. IC Role / Device Role / Timing Role: Dual-die SPI flash providing 128 Mbyte capacity with independent die access for parallel firmware/image loading. Use Value: CS1#/CS2# separation allows concurrent read from one die while programming the other - improves system responsiveness. | Use Scenario: Hosts baseband processor microcode and protocol stacks in 5G small cell radios operating in extended temperature environments. IC Role / Device Role / Timing Role: Automotive-grade flash used in industrial-temperature telecom infrastructure for long-term code stability. Use Value: AEC-Q100 Grade 2 rating ensures operation up to +105°C ambient - eliminates derating in sealed outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | Single-die 128 Mbyte (1 Gbit) FL-S flash; no dual-die stack; supports VIO (1.65–3.6 V) | Lacks CS2# and dual-die management overhead; simpler register mapping and sequential read behavior | Select when full 1 Gbit density is needed without dual-die complexity or die-switching latency |
| S70FL01GSAGBHVC00 | Same dual-die architecture and pinout, but rated for Industrial (−40°C to +85°C) grade only | No AEC-Q100 qualification; unsuitable for automotive thermal or reliability requirements | Select for cost-sensitive industrial applications where +105°C operation and automotive qualification are unnecessary |
Compared with S25FL128SAGMFI000, the S70FL01GSAGBHVC13 trades simplified register handling for higher density in same footprint; compared with S70FL01GSAGBHVC00, it adds AEC-Q100 Grade 2 compliance and extended temperature margin at identical pinout and dual-die functionality.
Availability
S70FL01GSAGBHVC13 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, medical imaging systems, and telecom baseband processors requiring stable component supply with AEC-Q100 Grade 2 qualification and 20-year data retention.
Supply support for S70FL01GSAGBHVC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions, with global R&D and manufacturing infrastructure.
The FL-S family targets high-reliability embedded systems requiring SPI flash with multi-I/O bandwidth, automotive qualification, and advanced security - designed specifically for boot code, firmware, and configuration storage in safety-critical applications.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSAGBHVC13?
CS1# and CS2# are independent chip select inputs that activate the first and second 512 Mbit flash dies respectively. Both must be driven separately - no shared or cascaded operation is supported. Each die responds only to its assigned CS# signal, enabling discrete addressing and independent command execution per die.
Does the S70FL01GSAGBHVC13 support VIO supply voltage?
No. The VIO pin (pin A3) is marked RFU (Reserved for Future Use) and is not functional in this device. The datasheet explicitly states VIO is not supported and must not be connected or powered. All I/O levels are referenced to VCC (2.7–3.6 V).
Can sequential reads cross between the two dies in the S70FL01GSAGBHVC13?
No. Sequential reads cannot automatically wrap from the end of die #1 to the start of die #2. To read across the 1 Gbit boundary, the host must issue a read command using CS1# for the first die's upper address range, then switch to CS2# and issue a new read command for the second die's lower address range.
How is block protection managed across the dual dies?
Each die maintains its own independent Block Protection register (TBPROT, BPNV, FREEZE bits). Protection settings must be written separately to each die. If FREEZE is set on either die, it remains latched until power-on-reset - there is no software-clear mechanism, and both dies require individual RESET# assertion to clear.
S70FL01GSAGBHVC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHVC13 FAQ
1.How can I place an order for S70FL01GSAGBHVC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHVC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHVC13 reliable?
The price and inventory of S70FL01GSAGBHVC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHVC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHVC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHVC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHVC13?
S70FL01GSAGBHVC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHVC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHVC13?
For technical support, including S70FL01GSAGBHVC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHVC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBHVC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHVC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHVC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHVC13?
All S70FL01GSAGBHVC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHVC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHVC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHVC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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