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Infineon Technologies S70FL01GSAGMFA010
- Part No.:
- S70FL01GSAGMFA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFA010.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:954
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Product details
Overview
S70FL01GSAGMFA010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package for high-density embedded code storage in automotive ADAS ECUs.
For engineers reviewing the S70FL01GSAGMFA010 datasheet, S70FL01GSAGMFA010 pinout, S70FL01GSAGMFA010 application, or S70FL01GSAGMFA010 equivalent, key selection criteria include dual-die addressing behavior, independent CS1#/CS2# control, DDR read support, OTP array size (2048 bytes), and sector protection granularity across stacked dies.
Technical Context
The S70FL01GSAGMFA010 integrates two independent 512 Mbit S25FL512S dies sharing a common SOIC/BGA footprint but requiring separate chip select (CS1# and CS2#) activation. Each die maintains autonomous status/configuration registers, security registers (ASP, PPB), and block protection settings.
It supports SPI modes 0/3, Quad I/O commands (QPP, Quad Read), DDR data transfer, AutoBoot from preselected address, and Common Flash Interface (CFI) for runtime configuration discovery. VIO is RFU - only VCC (2.7–3.6 V) and VSS are active supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Quad/Dual/DDR read and write; supports modes 0 and 3 |
| Program speed | 1.5 Mbytes/s max, using 512-byte page buffer and Quad-input programming |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate command per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at +85°C |
| Security | 2048-byte OTP array; hardware/software block protection; ASP with password control |
| Operating temp | AEC-Q100 Grade 2: −40°C to +105°C; industrial grade also supported |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free. Pinout validated per Infineon datasheet Rev. *O (2022-05-02), Figure 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates first 512 Mbit die; required for all operations on Die #1 |
| CS2# | Chip Select 2 | Activates second 512 Mbit die; required for all operations on Die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; internal pull-up enabled when unused |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; internal pull-up enabled when unused |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Drives SPI timing; supports up to 104 MHz SDR and 80 MHz DDR |
| VCC | Core Supply | 2.7–3.6 V core power; no separate VIO - VIO pin is RFU |
| VSS | Ground | Reference return for all signals and core supply |
| RESET# | Hardware Reset | Active-low asynchronous reset; internal pull-up; optional connection |
| DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Reserved for test; internal pull-down; must not connect to host signals or PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one BGA package enable 1 Gbit density without redesigning PCB layout |
| Independent die control | Separate CS1#/CS2# enables selective access; avoids inter-die read continuity gaps |
| Quad I/O + DDR support | Up to 4× bandwidth vs. standard SPI; DDR mode doubles throughput for sequential code fetch |
| AutoBoot functionality | Executes Normal or Quad Read automatically at power-up/reset from user-defined address |
| Advanced sector protection | Individual sector lock via boot code or 2048-byte OTP password; FREEZE bit prevents accidental unlock |
Applications
| Automotive ADAS ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot firmware and real-time sensor processing code in radar control units requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic AutoBoot execution and secure OTA update partitioning. Use Value: Dual-die isolation allows concurrent firmware validation (Die #1) and live execution (Die #2), reducing update downtime. | Use Scenario: Holding ladder logic programs and configuration data in modular industrial controllers operating continuously at +70°C ambient. IC Role / Device Role / Timing Role: High-reliability program memory with 20-year retention and 100k-cycle endurance under thermal cycling stress. Use Value: Uniform 256-kbyte sectors simplify field firmware patching; OTP array secures calibration constants against overwrite. |
| Medical Imaging Boot Loader | Avionics Display System |
Use Scenario: Hosting certified boot loader and diagnostic self-test modules in FDA-regulated ultrasound systems. IC Role / Device Role / Timing Role: Secure, tamper-resistant initialization memory with CFI-based runtime configuration verification. Use Value: ASP + password protection ensures bootloader integrity; independent die status registers allow audit of each memory segment. | Use Scenario: Storing display firmware and font assets in DO-178C-compliant cockpit displays with extended temperature operation. IC Role / Device Role / Timing Role: High-speed Quad DDR read capability delivers low-latency graphics asset loading during flight-critical transitions. Use Value: 80 MHz DDR interface sustains >320 MB/s effective throughput for rapid UI rendering without external cache. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI101 | Single 512 Mbit die; identical register map and command set; no CS2# or dual-die coordination overhead | Lower density; suitable where 1 Gbit is unnecessary and simpler die management is preferred | Select when design does not require >512 Mbit or dual-die redundancy features |
| MX66L1G45GMI-10G | 1 Gbit Macronix device; supports octal DTR mode; no dual-die architecture; different OTP size (1024 bytes) | Lacks AEC-Q100 Grade 2 rating; no AutoBoot or ASP with password; uses different CFI structure | Choose for cost-sensitive non-automotive designs needing higher peak bandwidth via octal mode |
Compared with S25FL512SAGMFI101 and MX66L1G45GMI-10G, the S70FL01GSAGMFA010 uniquely provides automotive-grade dual-die isolation with coordinated security registers, enabling safe firmware A/B partitioning and certified fail-safe boot - capabilities absent in both alternatives.
Availability
S70FL01GSAGMFA010 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for S70FL01GSAGMFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions.
The FL-S family targets high-reliability embedded systems requiring SPI flash with advanced security, automotive qualification, and multi-I/O performance - especially where code integrity and long-term data retention are critical.
FAQ
Does S70FL01GSAGMFA010 support true single-command bulk erase across both dies?
No. Due to its dual-die stack architecture, bulk erase must be issued separately to each die using CS1# and CS2#. There is no unified command that erases both dies simultaneously - this is a hardware constraint confirmed in Section 4.4 of the datasheet.
Can the VIO pin be used for I/O voltage scaling on this part?
No. The VIO pin is marked RFU (Reserved for Future Use) in the S70FL01GSAGMFA010. As stated in Section 7 and Figure 2 note, VIO is not supported - only VCC (2.7–3.6 V) powers all I/O circuits. Connecting VIO to any voltage violates the device specification.
How does AutoBoot behave when CS1# and CS2# are asserted simultaneously?
AutoBoot executes only from the die selected by the active chip select. If both CS1# and CS2# are low, behavior is undefined and not guaranteed - the datasheet mandates single-die selection. AutoBoot address is configured per die in their respective configuration registers, and simultaneous assertion may cause bus contention or invalid state.
Is the 2048-byte OTP array shared between the two dies or duplicated?
The 2048-byte OTP array is duplicated - each die has its own independent 2048-byte OTP region. Programming OTP on Die #1 does not affect Die #2, and both arrays must be programmed separately. This is consistent with the independent register architecture described in Sections 4.5–4.9 of the datasheet.
S70FL01GSAGMFA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFA010 FAQ
1.How can I place an order for S70FL01GSAGMFA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFA010 reliable?
The price and inventory of S70FL01GSAGMFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFA010 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFA010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGMFA010?
S70FL01GSAGMFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFA010?
For technical support, including S70FL01GSAGMFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFA010 requirements.
6.How does Aetrix verify that S70FL01GSAGMFA010 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFA010 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFA010?
All S70FL01GSAGMFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFA010 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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