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Infineon Technologies S70FL01GSAGMFA013
- Part No.:
- S70FL01GSAGMFA013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFA013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,591
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Product details
Overview
S70FL01GSAGMFA013 from Infineon is a 1 Gbit (128 Mbyte) dual-die stacked SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two independent S25FL512S dies sharing a common SOIC-16 package, supporting Quad I/O, DDR read modes, and AutoBoot from preselected address.
For engineers reviewing the S70FL01GSAGMFA013 datasheet, S70FL01GSAGMFA013 pinout, S70FL01GSAGMFA013 application, or S70FL01GSAGMFA013 equivalent, key selection criteria include dual-die addressing behavior, chip-select–separated erase/program operations, CFI-compatibility with S25FL-P family, and absence of VIO support in this variant.
Technical Context
The device integrates two independent 512 Mbit S25FL512S dies in a single SOIC-16 package, each with dedicated CS# (CS1#, CS2#), status/configuration registers, and block protection logic. Operations are die-isolated: sector erase, page program, and register access require separate commands per chip select.
It supports SPI modes 0 and 3, DDR read (Fast DDR/Dual DDR/Quad DDR), extended 32-bit addressing, and AutoBoot execution at power-up/reset. VIO pin is RFU - I/O voltage is fixed to VCC (2.7–3.6 V), eliminating external I/O rail dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Quad/Dual/Single mode support; no VIO - I/O tied to VCC |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate command per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at max operating temperature |
| Operating voltage | VCC = 2.7 V to 3.6 V; no separate VIO supply - simplifies power design |
| Temperature grade | AEC-Q100 Grade 2: −40°C to +105°C - qualified for under-hood automotive use |
| Security features | 2048-byte OTP array; hardware/software block protection; ASP with password control |
Pinout & Package
Package: 16-lead SOIC (300 mil), Pb-free, industrial+automotive qualified. Pin functions validated per Infineon datasheet 001-98295 Rev. *O (pp.5–6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required for all operations targeting Die 1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required for all operations targeting Die 2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; internal pull-up enabled when unused |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; internal pull-up enabled when unused |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in standard/Dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Edge-triggered clock input; supports up to 104 MHz SDR and 80 MHz DDR |
| RESET# | Hardware Reset | Asynchronous active-low reset; internal pull-up; optional connection |
| VCC | Core Supply | 2.7–3.6 V core and I/O supply; no VIO pin functionality in this variant |
| VSS | Ground | Common reference for core and interface signals |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one SOIC-16 package - enables 1 Gbit density without BGA footprint |
| Die-isolated operation | CS1# and CS2# enable independent control of erase, program, and register access per die - prevents cross-die corruption |
| AutoBoot capability | Executes Normal or Quad Read automatically at power-up/reset from user-configurable address - reduces boot firmware latency |
| CFI and footprint compatibility | Command set and pinout match S25FL-P family - allows drop-in replacement where dual-die behavior is managed in firmware |
| Advanced sector protection | Individual sector lock via OTP, password, or boot code - supports secure firmware update partitioning |
Applications
| Automotive Instrument Cluster | ADAS Domain Controller |
|---|---|
Use Scenario: Storing calibrated sensor fusion algorithms and display graphics assets in a safety-critical digital dashboard. IC Role / Device Role / Timing Role: Non-volatile code/data storage with AEC-Q100 Grade 2 qualification and 20-year retention. Use Value: Dual-die isolation ensures critical boot code (Die 1) remains protected while application updates occur on Die 2. | Use Scenario: Holding real-time perception model weights and calibration parameters for radar/vision fusion. IC Role / Device Role / Timing Role: High-reliability SPI flash supporting Quad DDR reads at ≤80 MHz for low-latency inference loading. Use Value: 100K endurance enables frequent over-the-air (OTA) model updates without premature wear-out. |
| Industrial PLC Firmware | Medical Imaging Boot Loader |
Use Scenario: Hosting deterministic control logic and HMI configuration data in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Industrial-grade (−40°C to +85°C) flash with uniform sector erase for field-upgradable firmware partitions. Use Value: Hardware block protection prevents accidental overwrite of safety-critical runtime code during maintenance updates. | Use Scenario: Securing certified boot loader and cryptographic keys in FDA-cleared diagnostic imaging equipment. IC Role / Device Role / Timing Role: OTP-enabled secure storage with ASP and password-controlled sector locking. Use Value: 2048-byte OTP array stores immutable root-of-trust keys; freeze bit prevents runtime modification of protection settings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI101 | Single 512 Mbit die; SOIC-16; identical command set and timing; no CS2# or dual-die management overhead | Lower density; no need for die-aware firmware; simpler initialization sequence | Select when 512 Mbit suffices and dual-die complexity must be avoided |
| S70FL01GSAGMFA010 | Same dual-die stack but in 24-ball BGA (ZSA024); identical electrical specs; different package and thermal profile | Requires BGA layout and reflow; better thermal dissipation in high-power systems | Select when board space constraints favor BGA or thermal performance exceeds SOIC limits |
Compared with S25FL512SAGMFI101, the S70FL01GSAGMFA013 doubles density in same SOIC footprint but demands die-aware firmware; compared with S70FL01GSAGMFA010, it offers identical functionality in through-hole assembly-friendly SOIC, easing prototyping and repair.
Availability
S70FL01GSAGMFA013 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, industrial PLC firmware, and medical imaging boot loaders requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FL01GSAGMFA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and safety-critical applications.
The FL-S family targets high-reliability embedded systems requiring SPI flash with AEC-Q100 qualification, advanced security, and multi-I/O bandwidth - designed specifically for automotive, industrial, and medical edge devices.
FAQ
Is VIO supported on S70FL01GSAGMFA013?
No. The VIO pin is marked RFU (Reserved for Future Use) and has no functional connection in this variant. I/O voltage is fixed to VCC (2.7–3.6 V), eliminating the need for a separate I/O rail. This simplifies PCB power design but removes voltage-level flexibility for mixed-voltage host interfaces.
How does dual-die operation affect firmware development?
Firmware must issue separate commands to CS1# and CS2# for erase, program, and register access - no cross-die atomic operations. Sequential reads across die boundaries require explicit switching between chip selects. AutoBoot address applies identically to both dies, and status/configuration registers must be synchronized manually to avoid inconsistent protection states.
What is the maximum supported clock frequency in DDR mode?
The device supports up to 80 MHz DDR clock frequency, delivering effective 160 MT/s read throughput in Quad DDR mode. This is specified in Section 11.1 (DDR AC characteristics) of the datasheet and validated across the full −40°C to +105°C temperature range for AEC-Q100 Grade 2 operation.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. It is intended for immutable data such as cryptographic keys, device identifiers, or calibration constants that must survive field updates and power cycles without alteration.
S70FL01GSAGMFA013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFA013 FAQ
1.How can I place an order for S70FL01GSAGMFA013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFA013 reliable?
The price and inventory of S70FL01GSAGMFA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFA013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFA013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFA013 transactions.
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4.How is shipping managed for S70FL01GSAGMFA013?
S70FL01GSAGMFA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFA013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFA013?
For technical support, including S70FL01GSAGMFA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFA013 requirements.
6.How does Aetrix verify that S70FL01GSAGMFA013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFA013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFA013?
All S70FL01GSAGMFA013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFA013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFA013 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFA013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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