Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S70FL01GSAGMFB010

Part No.:
S70FL01GSAGMFB010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS70FL01GSAGMFB010.pdf
Description:
IC FLASH 1GBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,313

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S70FL01GSAGMFB010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, and support for Normal/Fast/Dual/Quad/DDR read modes. It implements two stacked S25FL512S dies, each independently accessible via CS1# and CS2#, and targets boot code storage in industrial and automotive embedded systems requiring high endurance and long data retention.

For engineers reviewing the S70FL01GSAGMFB010 datasheet, S70FL01GSAGMFB010 pinout, S70FL01GSAGMFB010 application, or S70FL01GSAGMFB010 equivalent, key selection criteria include dual-die addressing behavior, independent status/configuration register management per die, Quad I/O timing compliance, and AEC-Q100 Grade 2 qualification for extended temperature operation up to +105°C.

Technical Context

The device uses Infineon's 65 nm MirrorBit® Flash technology with Eclipse™ architecture and operates as two independent 512 Mbit FL-S flash arrays sharing a common SOIC-16 or BGA-24 package. Each die supports full SPI command sets including AutoBoot, CFI interrogation, and OTP array programming.

It requires separate chip-select control (CS1# and CS2#) for die access, mandates independent status/config register writes per die, and does not support cross-die sequential reads or bulk erase - both operations must be issued individually to each die.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density1 Gbit (128 Mbyte), implemented as two independent 512 Mbit S25FL512S dies
InterfaceSPI Multi-I/O with support for single/dual/quad/DDR read and quad-input page program
Erase granularityUniform 256-kbyte sectors; no full-chip bulk erase - erase commands must target each die separately
Endurance100,000 program-erase cycles minimum per sector
Data retention20 years minimum at +85°C
Supply voltageCore VCC: 2.7 V to 3.6 V; VIO not supported (RFU)
Temperature gradeAEC-Q100 Grade 2 (−40°C to +105°C), Industrial Plus, and Industrial options available

Pinout & Package

Package: 16-lead SOIC (300 mils), Pb-free, with dual-die internal structure and dedicated chip select lines for independent die access.

Pin/TerminalCircuit RoleDesign Meaning
CS1#Chip Select 1Activates first 512 Mbit die; required to issue commands to Die #1
CS2#Chip Select 2Activates second 512 Mbit die; required to issue commands to Die #2
SI/IO0Serial Input / IO0Single-bit input or Quad I/O line 0; used for command/address/data input in all modes
SO/IO1Serial Output / IO1Single-bit output or Quad I/O line 1; used for data output in all read modes
WP#/IO2Write Protect / IO2Hardware write protection in standard mode; becomes Quad I/O line 2 in Quad mode
HOLD#/IO3Hold / IO3Pauses ongoing serial transfer in single/dual mode; becomes Quad I/O line 3 in Quad mode
SCKSerial ClockDrives all SPI transactions; supports DDR clocking with phase/polarity modes 0 and 3
RESET#Hardware ResetAsynchronous reset with internal pull-up; returns device to standby state and clears internal state

Key Features

FeatureDesign Value
Dual-die stack architectureTwo independent S25FL512S dies in one package, enabling scalable capacity without redesigning PCB layout
AutoBoot functionalityExecutes preconfigured Normal or Quad read at power-up/reset from user-defined address, reducing boot latency
Common Flash Interface (CFI)Provides standardized configuration data (e.g., geometry, timing, vendor ID) for host firmware auto-detection
OTP array2048-byte one-time-programmable area for secure keys, calibration data, or device-specific identifiers
Advanced Sector Protection (ASP)Enables password- or boot-code-controlled individual sector locking, supporting secure firmware update workflows

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Stores boot loader and GUI assets for digital instrument clusters operating across −40°C to +105°C.

IC Role / Device Role / Timing Role: Non-volatile boot memory with AEC-Q100 Grade 2 qualification and AutoBoot execution on power-up.

Use Value: Eliminates external boot ROM initialization delay; supports Quad I/O reads for fast GUI asset loading during cluster startup.

Use Scenario: Holds field-upgradable firmware and configuration tables in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: High-endurance SPI flash with 100K cycle rating and 20-year data retention for mission-critical control logic.

Use Value: Enables over-the-air firmware updates without hardware replacement; OTP array secures cryptographic keys used in update authentication.

Medical Imaging Control BoardAvionics Display System

Use Scenario: Stores FPGA configuration bitstreams and safety-critical diagnostic routines in portable ultrasound and MRI control modules.

IC Role / Device Role / Timing Role: Dual-die SPI flash providing redundant storage paths via CS1#/CS2# for fault-tolerant boot sequencing.

Use Value: Independent die access allows parallel verification of configuration integrity before system activation, meeting IEC 62304 Class C requirements.

Use Scenario: Provides certified boot image storage for cockpit display units requiring DO-254 compliance and extended temperature operation.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash with CFI support for automated bootloader compatibility validation.

Use Value: CFI data enables host bootloader to dynamically verify memory geometry and timing parameters, reducing certification test effort.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S25FL128SAGMFI10Single-die 128 Mbyte (1 Gbit) FL-S flash; identical command set and pinout but no dual-die architectureLacks CS2# and independent die control; unsuitable for applications requiring die-level redundancy or staggered eraseSelect when board space or cost constraints eliminate need for dual-die flexibility and cross-die isolation is unnecessary
MX25L1G45GM2I-12G1 Gbit SPI flash from Macronix; supports similar Quad/DDR modes but uses different security register mapping and lacks CFI supportNo AutoBoot or ASP; OTP implementation differs and does not support password-based sector lockSelect only if existing firmware already implements Macronix-specific security and timing sequences

Compared with S25FL128SAGMFI10 and MX25L1G45GM2I-12G, the S70FL01GSAGMFB010 uniquely provides dual-die independence - critical for safety-critical boot partitioning, die-level firmware rollback, and failure containment - while maintaining full command compatibility with the FL-S family.

Availability

S70FL01GSAGMFB010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging control boards, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S70FL01GSAGMFB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and safety-critical applications.

The S70FL01GS belongs to Infineon's FL-S SPI flash product line, designed specifically for high-reliability embedded boot memory applications requiring AEC-Q100 qualification, long data retention, and advanced security features like OTP and ASP.

FAQ

What is the function of CS1# and CS2# on the S70FL01GSAGMFB010?

CS1# and CS2# are independent chip select inputs that activate separate 512 Mbit flash dies within the same package. CS1# controls access to Die #1; CS2# controls Die #2. Commands, status reads, and configuration updates must be issued to each die individually - no shared or broadcast operation is supported.

Does the S70FL01GSAGMFB010 support true cross-die sequential reads?

No. Sequential reads cannot span from the end of Die #1 to the start of Die #2. To read across both dies, the host must issue a read command to Die #1 using CS1#, then issue a separate read command to Die #2 using CS2#. The device does not provide automatic address wraparound between dies.

Is VIO supply used in the S70FL01GSAGMFB010?

No. VIO is marked RFU (Reserved for Future Use) in this device. The datasheet explicitly states VIO is not supported and must not be connected. All I/O signaling operates from the core VCC supply (2.7–3.6 V); no separate I/O voltage rail is required or functional.

How does the OTP array function in the S70FL01GSAGMFB010?

The 2048-byte OTP array is programmed once per sector using standard SPI program commands. Once written, bits can only be changed from '1' to '0'. It is commonly used to store immutable data such as cryptographic keys, calibration coefficients, or unique device identifiers, and is protected against accidental overwrite by status register lock bits.

S70FL01GSAGMFB010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S70FL01GSAGMFB010 FAQ

1.How can I place an order for S70FL01GSAGMFB010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70FL01GSAGMFB010 reliable?

The price and inventory of S70FL01GSAGMFB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFB010 is usually 5 days.

3.What payment methods are accepted for S70FL01GSAGMFB010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFB010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70FL01GSAGMFB010?

S70FL01GSAGMFB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70FL01GSAGMFB010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70FL01GSAGMFB010?

For technical support, including S70FL01GSAGMFB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFB010 requirements.

6.How does Aetrix verify that S70FL01GSAGMFB010 is sourced from the original manufacturer or authorized distributors?

All S70FL01GSAGMFB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFB010 meets industry standards.

7.What is the process for return or replacement of S70FL01GSAGMFB010?

All S70FL01GSAGMFB010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFB010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70FL01GSAGMFB010 part is unused and in its original packaging.

Return procedure for S70FL01GSAGMFB010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S70FL01GSAGMFB010 Tags

  • S70FL01GSAGMFB010
  • S70FL01GSAGMFB010 PDF
  • S70FL01GSAGMFB010 Datasheet
  • S70FL01GSAGMFB010 Specifications
  • S70FL01GSAGMFB010 Images
  • Infineon Technologies
  • Infineon Technologies S70FL01GSAGMFB010
  • Buy S70FL01GSAGMFB010
  • S70FL01GSAGMFB010 Price
  • S70FL01GSAGMFB010 Distributor
  • S70FL01GSAGMFB010 Supplier
  • S70FL01GSAGMFB010 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER