Infineon Technologies S70FL01GSAGMFB010
- Part No.:
- S70FL01GSAGMFB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFB010.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,313
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Product details
Overview
S70FL01GSAGMFB010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, and support for Normal/Fast/Dual/Quad/DDR read modes. It implements two stacked S25FL512S dies, each independently accessible via CS1# and CS2#, and targets boot code storage in industrial and automotive embedded systems requiring high endurance and long data retention.
For engineers reviewing the S70FL01GSAGMFB010 datasheet, S70FL01GSAGMFB010 pinout, S70FL01GSAGMFB010 application, or S70FL01GSAGMFB010 equivalent, key selection criteria include dual-die addressing behavior, independent status/configuration register management per die, Quad I/O timing compliance, and AEC-Q100 Grade 2 qualification for extended temperature operation up to +105°C.
Technical Context
The device uses Infineon's 65 nm MirrorBit® Flash technology with Eclipse™ architecture and operates as two independent 512 Mbit FL-S flash arrays sharing a common SOIC-16 or BGA-24 package. Each die supports full SPI command sets including AutoBoot, CFI interrogation, and OTP array programming.
It requires separate chip-select control (CS1# and CS2#) for die access, mandates independent status/config register writes per die, and does not support cross-die sequential reads or bulk erase - both operations must be issued individually to each die.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit S25FL512S dies |
| Interface | SPI Multi-I/O with support for single/dual/quad/DDR read and quad-input page program |
| Erase granularity | Uniform 256-kbyte sectors; no full-chip bulk erase - erase commands must target each die separately |
| Endurance | 100,000 program-erase cycles minimum per sector |
| Data retention | 20 years minimum at +85°C |
| Supply voltage | Core VCC: 2.7 V to 3.6 V; VIO not supported (RFU) |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C), Industrial Plus, and Industrial options available |
Pinout & Package
Package: 16-lead SOIC (300 mils), Pb-free, with dual-die internal structure and dedicated chip select lines for independent die access.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates first 512 Mbit die; required to issue commands to Die #1 |
| CS2# | Chip Select 2 | Activates second 512 Mbit die; required to issue commands to Die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; used for command/address/data input in all modes |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; used for data output in all read modes |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; becomes Quad I/O line 2 in Quad mode |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer in single/dual mode; becomes Quad I/O line 3 in Quad mode |
| SCK | Serial Clock | Drives all SPI transactions; supports DDR clocking with phase/polarity modes 0 and 3 |
| RESET# | Hardware Reset | Asynchronous reset with internal pull-up; returns device to standby state and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package, enabling scalable capacity without redesigning PCB layout |
| AutoBoot functionality | Executes preconfigured Normal or Quad read at power-up/reset from user-defined address, reducing boot latency |
| Common Flash Interface (CFI) | Provides standardized configuration data (e.g., geometry, timing, vendor ID) for host firmware auto-detection |
| OTP array | 2048-byte one-time-programmable area for secure keys, calibration data, or device-specific identifiers |
| Advanced Sector Protection (ASP) | Enables password- or boot-code-controlled individual sector locking, supporting secure firmware update workflows |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and GUI assets for digital instrument clusters operating across −40°C to +105°C. IC Role / Device Role / Timing Role: Non-volatile boot memory with AEC-Q100 Grade 2 qualification and AutoBoot execution on power-up. Use Value: Eliminates external boot ROM initialization delay; supports Quad I/O reads for fast GUI asset loading during cluster startup. | Use Scenario: Holds field-upgradable firmware and configuration tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: High-endurance SPI flash with 100K cycle rating and 20-year data retention for mission-critical control logic. Use Value: Enables over-the-air firmware updates without hardware replacement; OTP array secures cryptographic keys used in update authentication. |
| Medical Imaging Control Board | Avionics Display System |
Use Scenario: Stores FPGA configuration bitstreams and safety-critical diagnostic routines in portable ultrasound and MRI control modules. IC Role / Device Role / Timing Role: Dual-die SPI flash providing redundant storage paths via CS1#/CS2# for fault-tolerant boot sequencing. Use Value: Independent die access allows parallel verification of configuration integrity before system activation, meeting IEC 62304 Class C requirements. | Use Scenario: Provides certified boot image storage for cockpit display units requiring DO-254 compliance and extended temperature operation. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash with CFI support for automated bootloader compatibility validation. Use Value: CFI data enables host bootloader to dynamically verify memory geometry and timing parameters, reducing certification test effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI10 | Single-die 128 Mbyte (1 Gbit) FL-S flash; identical command set and pinout but no dual-die architecture | Lacks CS2# and independent die control; unsuitable for applications requiring die-level redundancy or staggered erase | Select when board space or cost constraints eliminate need for dual-die flexibility and cross-die isolation is unnecessary |
| MX25L1G45GM2I-12G | 1 Gbit SPI flash from Macronix; supports similar Quad/DDR modes but uses different security register mapping and lacks CFI support | No AutoBoot or ASP; OTP implementation differs and does not support password-based sector lock | Select only if existing firmware already implements Macronix-specific security and timing sequences |
Compared with S25FL128SAGMFI10 and MX25L1G45GM2I-12G, the S70FL01GSAGMFB010 uniquely provides dual-die independence - critical for safety-critical boot partitioning, die-level firmware rollback, and failure containment - while maintaining full command compatibility with the FL-S family.
Availability
S70FL01GSAGMFB010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging control boards, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FL01GSAGMFB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and safety-critical applications.
The S70FL01GS belongs to Infineon's FL-S SPI flash product line, designed specifically for high-reliability embedded boot memory applications requiring AEC-Q100 qualification, long data retention, and advanced security features like OTP and ASP.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSAGMFB010?
CS1# and CS2# are independent chip select inputs that activate separate 512 Mbit flash dies within the same package. CS1# controls access to Die #1; CS2# controls Die #2. Commands, status reads, and configuration updates must be issued to each die individually - no shared or broadcast operation is supported.
Does the S70FL01GSAGMFB010 support true cross-die sequential reads?
No. Sequential reads cannot span from the end of Die #1 to the start of Die #2. To read across both dies, the host must issue a read command to Die #1 using CS1#, then issue a separate read command to Die #2 using CS2#. The device does not provide automatic address wraparound between dies.
Is VIO supply used in the S70FL01GSAGMFB010?
No. VIO is marked RFU (Reserved for Future Use) in this device. The datasheet explicitly states VIO is not supported and must not be connected. All I/O signaling operates from the core VCC supply (2.7–3.6 V); no separate I/O voltage rail is required or functional.
How does the OTP array function in the S70FL01GSAGMFB010?
The 2048-byte OTP array is programmed once per sector using standard SPI program commands. Once written, bits can only be changed from '1' to '0'. It is commonly used to store immutable data such as cryptographic keys, calibration coefficients, or unique device identifiers, and is protected against accidental overwrite by status register lock bits.
S70FL01GSAGMFB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFB010 FAQ
1.How can I place an order for S70FL01GSAGMFB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFB010 reliable?
The price and inventory of S70FL01GSAGMFB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFB010 is usually 5 days.
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S70FL01GSAGMFB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFB010?
For technical support, including S70FL01GSAGMFB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFB010 requirements.
6.How does Aetrix verify that S70FL01GSAGMFB010 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFB010 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFB010?
All S70FL01GSAGMFB010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFB010 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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