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Infineon Technologies S70FL01GSAGMFB013
- Part No.:
- S70FL01GSAGMFB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFB013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,594
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Product details
Overview
S70FL01GSAGMFB013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, AutoBoot, and CFI configuration for embedded boot code storage in automotive ADAS controllers.
For engineers reviewing the S70FL01GSAGMFB013 datasheet, S70FL01GSAGMFB013 pinout, S70FL01GSAGMFB013 application, or S70FL01GSAGMFB013 equivalent, this page delivers verified technical context on dual-die addressing, simultaneous die operation constraints, sector protection independence per die, and VIO/RFU signal handling per Infineon's Rev. *O datasheet.
Technical Context
The S70FL01GSAGMFB013 integrates two independent S25FL512S dies sharing one BGA-24 package, each with dedicated CS#1/CS#2, separate status/configuration registers, and isolated block protection logic. It requires sequential die access-no cross-die sequential reads or bulk erase-and mandates identical register settings across dies for consistent behavior.
It supports SPI modes 0/3, DDR timing, 32-bit extended addressing, and Quad I/O commands compatible with S25FL-P family footprints. VIO is RFU (not implemented), and all DNU pins are internally pulled down and must remain unconnected in host systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), realized as dual 512 Mbit dies stacked in single package |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read modes and QPP programming |
| Erase granularity | Uniform 256-kbyte sectors; no full-chip bulk erase-requires separate sector erase per die |
| Endurance & retention | 100,000 program-erase cycles minimum; 20-year data retention at ≤+85°C |
| Supply voltage | Core VCC: 2.7–3.6 V; I/O voltage not applicable-VIO is RFU per datasheet Section 7 |
| Temperature grade | AEC-Q100 Grade 2: −40°C to +105°C, qualified for automotive powertrain and ADAS ECUs |
| Security | 2048-byte OTP array; ASP, password-controlled sector protection, and FREEZE bit per die |
Pinout & Package
Package: 24-ball BGA (8 × 6 mm, ZSA024 footprint, 5 × 5 ball array), Pb-free, industrial and automotive qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Active-low enable for first 512 Mbit die; required to access lower 512 Mbyte address space |
| CS2# | Chip Select 2 | Active-low enable for second 512 Mbit die; required to access upper 512 Mbyte address space |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; used for command/address/data in all supported modes |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; bidirectional in Quad mode with internal pull-up |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard SPI; becomes IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/dual mode; becomes IO3 in Quad mode; internal pull-up |
| RESET# | Hardware Reset | Active-low reset with internal pull-up; returns device to standby and clears status flags |
| VSS | Ground | Dedicated ground reference for core and I/O circuits; two pins (A2, C1) must be connected |
| VCC | Core Supply | 2.7–3.6 V core power; pins B1 and D2 require low-impedance decoupling |
| DNU | Do Not Use | Internally pulled down; forbidden for PCB routing or host connection per datasheet Table 2 |
| RFU | Reserved for Future Use | No internal connection; avoid PCB routing to preserve compatibility with future devices |
| NC | No Connect | Unused pad; may be used for PCB trace routing if voltage stays ≤VCC |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die architecture | Two independent S25FL512S dies in single BGA package enables 1 Gbit density without redesigning layout |
| AutoBoot functionality | Executes preconfigured Normal or Quad read at power-up/reset-enables reliable boot code execution without host initialization |
| Common Flash Interface (CFI) | Provides standardized geometry and configuration data at known offsets (e.g., byte 27h = 1Bh for size), simplifying firmware portability |
| Advanced Sector Protection (ASP) | Per-die password- or boot-code-controlled sector locking prevents unauthorized firmware overwrite in safety-critical ECUs |
| Quad DDR read support | Enables up to 80 MB/s effective throughput (at 80 MHz clock) for high-speed boot image loading in real-time systems |
Applications
| Automotive Powertrain ECU | ADAS Camera Module |
|---|---|
|
Use Scenario: Storing calibrated engine control maps and diagnostic firmware in diesel common-rail injection systems. IC Role / Device Role / Timing Role: Nonvolatile boot memory with AEC-Q100 Grade 2 qualification and 20-year retention under thermal cycling. Use Value: Dual-die isolation ensures failure in one die does not corrupt boot code in the other; FREEZE bit prevents runtime reprogramming during vehicle operation. |
Use Scenario: Holding ISP firmware and calibration data for 8 MP automotive camera modules with real-time image processing. IC Role / Device Role / Timing Role: High-throughput Quad DDR flash for rapid firmware load at startup; CFI enables dynamic parameter discovery by SoC bootloader. Use Value: 1.5 MB/s programming speed and 256-kbyte uniform sectors allow fast over-the-air (OTA) update partitioning without fragmentation overhead. |
| Industrial PLC Firmware Storage | Medical Imaging Boot Loader |
|
Use Scenario: Secure storage of ladder logic programs and safety-certified firmware in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: OTP array stores cryptographic keys; ASP enforces write-protection during field maintenance windows only. Use Value: Independent sector protection per die allows concurrent firmware update (one die active, one updating) with zero downtime. |
Use Scenario: Boot loader and DICOM protocol stack storage in portable ultrasound devices requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Industrial-grade (−40°C to +85°C) flash with 100K-cycle endurance for frequent firmware validation cycles. Use Value: AutoBoot executes verified boot image immediately post-reset-critical for meeting medical device power-on self-test (POST) timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI101 | Single-die 512 Mbit; same SOIC/BGA packages; lacks CS2# and dual-die coordination logic | Lower density; suitable for cost-sensitive non-automotive designs where 1 Gbit is unnecessary | Select when board space allows two discrete devices or when AEC-Q100 Grade 2 is not required |
| MX25L1G45GM2I-12G | Micron 1 Gbit SPI flash; single-die; no dual-CS architecture; different CFI layout and OTP implementation | Not AEC-Q100 qualified; lacks FREEZE bit and ASP; incompatible AutoBoot address mapping | Choose only for industrial consumer applications where automotive reliability and security features are not mandated |
Compared with S25FL512SAGMFI101 and MX25L1G45GM2I-12G, the S70FL01GSAGMFB013 uniquely delivers dual-die fault containment, per-die FREEZE protection, and AEC-Q100 Grade 2 compliance-making it irreplaceable in safety-critical automotive boot memory roles.
Availability
S70FL01GSAGMFB013 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, ADAS camera modules, industrial PLCs, and medical imaging boot loaders requiring stable component supply across long product lifecycles.
Supply support for S70FL01GSAGMFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.
The FL-S flash product line targets automotive and industrial applications demanding AEC-Q100 qualification, high endurance, and advanced security-designed specifically for boot code integrity and OTA update resilience in safety-critical systems.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSAGMFB013?
CS1# and CS2# are independent chip select inputs that activate the first and second 512 Mbit flash dies respectively. Each die operates autonomously: CS1# accesses addresses 0x00000000–0x07FFFFFF, CS2# accesses 0x08000000–0x0FFFFFFF. Simultaneous activation is undefined; only one die may be addressed per transaction.
Does the S70FL01GSAGMFB013 support true 1 Gbit bulk erase in a single command?
No. Due to its dual-die construction, the S70FL01GSAGMFB013 does not support full-device bulk erase. A separate sector or bulk erase command must be issued to each die via CS1# and CS2#. Attempting a single bulk erase command affects only the currently selected die.
How is the VIO pin handled in this device?
VIO is marked RFU (Reserved for Future Use) and is not implemented in the S70FL01GSAGMFB013. Per datasheet Section 7 and Table 2, VIO/RFU (pin A3) has no internal connection and must be left unconnected or tied to VSS-no I/O voltage translation capability is present.
Can AutoBoot be configured to execute a Quad read from a custom address?
Yes. AutoBoot can be set to perform either Normal or Quad read operations starting from a user-programmable 24-bit or 32-bit address stored in configuration registers. The mode and address are retained across power cycles and triggered automatically after RESET# deassertion or power-on.
S70FL01GSAGMFB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFB013 FAQ
1.How can I place an order for S70FL01GSAGMFB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFB013 reliable?
The price and inventory of S70FL01GSAGMFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFB013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGMFB013?
S70FL01GSAGMFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFB013?
For technical support, including S70FL01GSAGMFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFB013 requirements.
6.How does Aetrix verify that S70FL01GSAGMFB013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFB013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFB013?
All S70FL01GSAGMFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFB013 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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