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Infineon Technologies S70FL01GSAGMFI010
- Part No.:
- S70FL01GSAGMFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFI010.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,703
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Product details
Overview
S70FL01GSAGMFI010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase granularity. It supports Quad DDR read modes up to 133 MHz, delivers 1.5 Mbytes/s programming throughput, and guarantees 100,000 program-erase cycles and 20-year data retention for industrial and automotive applications including infotainment boot storage.
For engineers reviewing the S70FL01GSAGMFI010 datasheet, S70FL01GSAGMFI010 pinout, S70FL01GSAGMFI010 application, or S70FL01GSAGMFI010 equivalent, key selection criteria include dual-die address boundary handling, independent CS1#/CS2# die control, OTP security array size, sector protection granularity, and AEC-Q100 Grade 1 (−40°C to +125°C) qualification status.
Technical Context
The S70FL01GS is a stacked dual-die device composed of two independent S25FL512S dies sharing a common SOIC-16 or BGA-24 package. Each die operates autonomously with dedicated chip select (CS1# and CS2#), separate status/configuration registers, and independent block protection logic - requiring explicit per-die command issuance for erase, program, and register access.
It implements Infineon's 65 nm MirrorBit® Eclipse™ architecture with SPI Multi-I/O support (Single/Dual/Quad/DDR modes), extended 32-bit addressing, AutoBoot capability at preselected addresses, and Common Flash Interface (CFI) metadata. VIO is RFU and not functional in this variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Single/Dual/Quad/DDR read and Quad-input page program |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at max operating temperature |
| Supply voltage | VCC: 2.7 V to 3.6 V; VIO not supported (RFU) |
| Temperature grade | AEC-Q100 Grade 1 (−40°C to +125°C), Industrial Plus (−40°C to +105°C), Industrial (−40°C to +85°C) |
| Security features | 2048-byte OTP array; hardware/software block protection; advanced sector protection (ASP) |
Pinout & Package
Available in Pb-free 16-lead SOIC (300 mil) and 24-ball BGA (8 × 6 mm, ZSA024 footprint). Pin functions are identical across packages; VIO is reserved-for-future-use (RFU) and must not be connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates first 512 Mbit die; required for all operations targeting die #1 |
| CS2# | Chip Select 2 | Activates second 512 Mbit die; required for all operations targeting die #2 |
| SI/IO0 | Serial Input / IO0 | Data input in single/dual mode; IO0 in quad mode; internal pull-up enabled |
| SO/IO1 | Serial Output / IO1 | Data output in single/dual mode; IO1 in quad mode; internal pull-up enabled |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; IO2 in quad mode; internal pull-up enabled |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer in single/dual mode; IO3 in quad mode; internal pull-up enabled |
| RESET# | Hardware Reset | Asynchronous reset to standby state; internal pull-up; may be left floating if unused |
| VCC | Core Power Supply | 2.7–3.6 V supply for flash core and logic; decoupling required per datasheet layout guidelines |
| VSS | Ground | Reference ground for core and I/O circuits; low-inductance connection critical for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package enable 1 Gbit density while maintaining pin compatibility with 512 Mbit family |
| AutoBoot execution | Automatically executes Normal or Quad Read at power-up/reset from user-configurable start address - reduces host firmware initialization overhead |
| Quad DDR read support | Enables 133 MHz clock operation with double-data-rate transfers, achieving up to 266 MB/s effective throughput for high-speed code XIP |
| Independent die control | CS1# and CS2# allow deterministic, non-overlapping access to each die - essential for fault-isolated firmware partitioning |
| OTP security array | 2048-byte one-time-programmable region for secure keys, calibration data, or unique identifiers - irreversible and tamper-resistant |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated gauge graphics, driver-assist firmware, and OTA update staging area in AEC-Q100 Grade 1 instrument clusters. IC Role / Device Role / Timing Role: Primary nonvolatile code/data storage with AutoBoot-initiated display initialization on power-up. Use Value: Dual-die isolation allows concurrent firmware validation (die #1) and active runtime execution (die #2), enabling safe over-the-air updates without system downtime. |
Use Scenario: Holding real-time OS kernel, motion control algorithms, and configuration profiles in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability boot and runtime storage with sector-level protection against accidental overwrite during field reprogramming. Use Value: 256-kbyte uniform sectors and ASP enable precise firmware module locking - preventing corruption of safety-critical motion control routines during partial updates. |
| Medical Imaging Boot Loader | Avionics Display System |
|
Use Scenario: Secure boot loader storage for FDA-cleared diagnostic ultrasound systems requiring traceable firmware revision history and cryptographic signature verification. IC Role / Device Role / Timing Role: Trusted root-of-trust storage for signed bootloader images; OTP stores public key hash and revocation list anchors. Use Value: 2048-byte OTP array provides immutable, factory-programmed security roots - meeting IEC 62304 Class C software lifecycle requirements. |
Use Scenario: Storing certified flight display firmware, font assets, and configuration tables in DO-178C Level A avionics displays with extended temperature operation. IC Role / Device Role / Timing Role: Radiation-tolerant, high-retention storage for mission-critical display boot sequences and fail-safe UI recovery images. Use Value: AEC-Q100 Grade 1 qualification (−40°C to +125°C) and 20-year retention ensure reliable operation across aircraft thermal cycles and long service intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SDSMFV101 | Single-die 512 Mbit; no CS2#; no dual-die boundary management overhead | Suitable for cost-sensitive designs where 1 Gbit density is unnecessary and simpler command sequencing is preferred | Select when full 1 Gbit capacity is not required and die-switching complexity must be avoided |
| MX25L1G45GM2I-12G | Monolithic 1 Gbit die; single CS#; no inter-die address discontinuity; different CFI and OTP layout | Better suited for continuous linear address mapping and legacy bootloader compatibility without die-aware firmware | Choose for seamless 32-bit address space and reduced firmware porting effort versus dual-die coordination |
Compared with S25FL512SDSMFV101, the S70FL01GSAGMFI010 doubles density but adds die-select latency and firmware complexity; compared with MX25L1G45GM2I-12G, it offers Infineon's AEC-Q100 Grade 1 rating and MirrorBit reliability at the cost of non-contiguous addressing across die boundaries.
Availability
S70FL01GSAGMFI010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and avionics displays requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualified flash memory.
Supply support for S70FL01GSAGMFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
The FL-S SPI flash product line targets automotive, industrial, and medical applications demanding AEC-Q100 qualification, extended temperature operation, and robust security features like OTP and ASP.
FAQ
Does S70FL01GSAGMFI010 support true 1 Gbit contiguous addressing?
No. The device consists of two independent 512 Mbit dies accessed via CS1# and CS2#. Address space is not contiguous across die boundaries - sequential reads spanning die #1 end and die #2 start require explicit CS# switching and address reset. This is documented in Section 4.3 of the datasheet.
What is the function of VIO pin on S70FL01GSAGMFI010?
VIO is marked RFU (Reserved for Future Use) and has no functional role in this device. Section 7 of the datasheet explicitly states VIO is not supported and must not be connected. Powering or routing VIO may cause undefined behavior or violate electrical specifications.
Can both dies be erased simultaneously with a single Bulk Erase command?
No. Bulk Erase is not supported across both dies in a single command. Each die requires its own independent Bulk Erase command issued under its respective CS# (CS1# or CS2#), as stated in Section 4.4. Attempting to issue Bulk Erase without asserting the correct CS# will have no effect on the unselected die.
Is the 2048-byte OTP array shared between the two dies?
No. The OTP array is implemented per die - each 512 Mbit die contains its own 2048-byte OTP region. Programming OTP on die #1 does not affect die #2, and both regions must be programmed independently using their respective CS# lines and command sequences.
S70FL01GSAGMFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFI010 FAQ
1.How can I place an order for S70FL01GSAGMFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFI010 reliable?
The price and inventory of S70FL01GSAGMFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFI010 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGMFI010?
S70FL01GSAGMFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFI010?
For technical support, including S70FL01GSAGMFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFI010 requirements.
6.How does Aetrix verify that S70FL01GSAGMFI010 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFI010 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFI010?
All S70FL01GSAGMFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFI010 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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