Infineon Technologies S70FL01GSAGMFI011

Overview

S70FL01GSAGMFI011 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, and support for Normal/Fast/Dual/Quad/DDR read modes. It implements two stacked S25FL512S dies, each independently accessible via CS1# and CS2#, and features OTP array (2048 bytes), hardware/software block protection, and AEC-Q100 Grade 2 qualification (−40°C to +105°C).

For engineers reviewing the S70FL01GSAGMFI011 datasheet, S70FL01GSAGMFI011 pinout, S70FL01GSAGMFI011 application, or S70FL01GSAGMFI011 equivalent, key selection criteria include dual-die addressing behavior, independent status/configuration register management per die, sector erase isolation, and absence of VIO support in this variant.

Technical Context

This device is a dual-die stack of two S25FL512S flash dies sharing a common SOIC-16 or BGA-24 package. Each die operates independently: CS1# selects die 1, CS2# selects die 2; no cross-die sequential reads or bulk erase are supported. Status, configuration, bank address, security, and block protection registers are physically separate per die.

It supports SPI clock polarity/phase modes 0 and 3, DDR read/write, 32-bit extended addressing, and Quad-input page programming (QPP). VIO pin is RFU - I/O voltage is tied to VCC (2.7–3.6 V), eliminating need for separate I/O rail.

Key Specifications

Pinout & Package

Available in Pb-free 16-lead SOIC (300 mil) and 24-ball BGA (ZSA024, 8 × 6 mm). Pin functions are identical across packages; VIO is reserved for future use and unconnected internally.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density SPI flash applications.

Compared with S25FL512SAGMFI001, the S70FL01GSAGMFI011 doubles density while retaining footprint compatibility but requires explicit per-die command sequencing; versus MX25L1G45GM2I-12G, it trades DTR performance and simpler architecture for AEC-Q100 Grade 2 compliance and hardened sector protection.

Availability

S70FL01GSAGMFI011 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant non-volatile storage.

Supply support for S70FL01GSAGMFI011 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded systems needing SPI-compatible flash with advanced security, extended temperature operation, and scalable density - especially where AEC-Q100 qualification and long data retention are mandatory.

FAQ

Does S70FL01GSAGMFI011 support simultaneous access to both dies?

No. The device requires sequential access: CS1# activates die 1, CS2# activates die 2. Simultaneous read/write across dies is not supported. Host software must manage die selection explicitly and avoid interleaving commands between chip selects without completing prior operations.

Is VIO pin functional in this part number?

No. The VIO pin is marked RFU (Reserved for Future Use) and is not connected internally. I/O voltage is derived solely from VCC (2.7–3.6 V); no separate I/O supply rail is required or supported.

How does AutoBoot work with dual-die configuration?

AutoBoot executes a preconfigured Normal or Quad read command at a fixed address upon power-up or RESET#. That command targets only the die selected by the asserted chip select (CS1# or CS2#) at boot time - the host must ensure correct CS# assertion before reset to determine which die initiates AutoBoot.

Can sector protection settings be synchronized automatically between the two dies?

No. Block protection bits (TBPROT, BPNV, FREEZE) are stored separately in each die's status register. Host firmware must issue identical protection commands to both CS1# and CS2# to maintain consistency; mismatched settings may cause unpredictable write/erase behavior during die switching.