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Infineon Technologies S70FL01GSAGMFI013
- Part No.:
- S70FL01GSAGMFI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFI013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,733
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Product details
Overview
S70FL01GSAGMFI013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase. It supports Quad DDR read up to 133 MHz, 100,000 program-erase cycles, and 20-year data retention. Used in industrial and automotive boot code storage where high-density serial flash with AEC-Q100 Grade 2 qualification is required.
For engineers reviewing the S70FL01GSAGMFI013 datasheet, S70FL01GSAGMFI013 pinout, S70FL01GSAGMFI013 application, or S70FL01GSAGMFI013 equivalent, key selection criteria include dual-die addressing behavior, independent CS1#/CS2# control, absence of VIO support, and sector protection register per die - all critical for reliable firmware update and secure boot implementation.
Technical Context
The S70FL01GS is a stacked dual-die device composed of two S25FL512S dies sharing one SOIC-16 or BGA-24 package. Each die operates independently via dedicated chip select lines (CS1# and CS2#), requiring separate command issuance for programming, erase, status register access, and configuration register updates.
It implements Infineon's 65 nm MirrorBit® Eclipse™ architecture with SPI Multi-I/O support including Normal/Fast/Dual/Quad/DDR read modes, AutoBoot at power-up, and Common Flash Interface (CFI) for runtime configuration discovery. VIO is RFU - I/O voltage is fixed to VCC range (2.7–3.6 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (128 Mbyte), realized as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Quad DDR support up to 133 MHz clock |
| Erase Granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance | 100,000 program-erase cycles minimum per sector |
| Data Retention | 20 years minimum at +85°C |
| Operating Voltage | VCC = 2.7 V to 3.6 V; VIO not supported (RFU) |
| Temperature Grade | AEC-Q100 Grade 2 (−40°C to +105°C) certified |
Pinout & Package
Package: 16-lead SOIC (300 mil), Pb-free, industrial+automotive qualified. Pin functions validated per Infineon datasheet 001-98295 Rev. *O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; enables independent command execution on Die 1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required for full 1 Gbit address space access |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; shared function depends on instruction mode |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; no automatic wraparound across dies |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; becomes IO2 in Quad mode |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/dual mode; becomes IO3 in Quad-I/O |
| RESET# | Hardware Reset | Asynchronous reset with internal pull-up; returns both dies to standby state |
| VSS | Ground | Common reference for core and I/O circuits |
| VCC | Core Supply | Primary 2.7–3.6 V supply; powers both dies and logic interface |
| DNU pins (pins 6, 10–12, 14–15) | Do Not Use | Internally reserved for test; must remain unconnected or tied to VSS |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in single package enable 1 Gbit density without bus widening |
| Independent die control | Separate CS1#/CS2# allows concurrent or staggered operation - essential for fail-safe firmware partitioning |
| AutoBoot functionality | Executes preconfigured Normal or Quad Read at power-up/reset, enabling deterministic boot sequence initiation |
| OTP array (2048 bytes) | Immutable storage for keys, calibration data, or security credentials - immune to field reprogramming |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector lock prevents unauthorized firmware modification |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and real-time OS image for digital instrument clusters operating across −40°C to +105°C. IC Role / Device Role / Timing Role: Primary non-volatile code storage with AEC-Q100 Grade 2 qualification and dual-die redundancy awareness. Use Value: Enables deterministic AutoBoot execution and sector-level protection against corruption during over-the-air (OTA) updates. | Use Scenario: Holds firmware, configuration tables, and diagnostic logs in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability SPI flash with 20-year data retention and 100K-cycle endurance for long-lifecycle industrial equipment. Use Value: Supports field firmware upgrades via Quad DDR reads at 133 MHz while maintaining sector isolation between application and safety-critical modules. |
| Medical Imaging Boot Memory | Avionics Data Logger |
Use Scenario: Stores certified boot firmware and calibration parameters for MRI/X-ray control systems requiring traceable data integrity. IC Role / Device Role / Timing Role: Secure, OTP-backed configuration storage with ASP and CFI-based runtime validation. Use Value: Prevents unauthorized modification via password-protected sector locks and immutable 2048-byte OTP array. | Use Scenario: Captures flight-critical telemetry and event logs in airborne data recorders with extended temperature tolerance. IC Role / Device Role / Timing Role: Dual-die SPI flash with independent CS control enables time-synchronized logging across redundant channels. Use Value: Allows simultaneous write to Die 1 (active log) and Die 2 (backup archive) using separate CS# lines without inter-die interference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI001 | Single-die 128 Mbyte device; no CS2#, no dual-die addressing complexity | Lacks 1 Gbit density and AEC-Q100 Grade 2 rating; suitable only for non-automotive cost-sensitive designs | Select when full 1 Gbit capacity and automotive qualification are unnecessary |
| MX25L1G45GM2I-12G | Micron 1 Gbit SPI flash; single-die with 4-byte addressing; no native dual-CS architecture | Requires external multiplexing for multi-image storage; lacks ASP and OTP features | Choose for simpler layout where die independence and advanced security are not required |
Compared with S25FL128SAGMFI001 and MX25L1G45GM2I-12G, the S70FL01GSAGMFI013 uniquely delivers AEC-Q100 Grade 2 compliance, hardware-enforced dual-die isolation via CS1#/CS2#, and integrated OTP + ASP - making it the only option for safety-aware automotive boot memory with scalable firmware partitioning.
Availability
S70FL01GSAGMFI013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.
Supply support for S70FL01GSAGMFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions.
The FL-S family targets high-reliability embedded systems needing SPI flash with enhanced security, extended temperature operation, and automotive qualification - specifically designed for boot code, firmware, and configuration storage in safety-critical environments.
FAQ
Does S70FL01GSAGMFI013 support true 1 Gbit continuous addressing?
No. The device comprises two independent 512 Mbit dies accessed via CS1# and CS2#. Sequential reads across die boundaries require explicit switching between chip selects; there is no hardware-level address wraparound or unified 32-bit linear addressing across both dies.
Is VIO pin functional on this part?
No. The VIO pin is marked RFU (Reserved for Future Use) and is not supported in the S70FL01GSAGMFI013. I/O voltage is fixed to the VCC supply range (2.7–3.6 V); no separate I/O rail is implemented or required.
How does block protection work across the two dies?
Each die maintains its own independent Block Protection registers (TBPROT, BPNV, FREEZE). Protection settings must be written separately to each die. If FREEZE is set on either die, it remains locked until power-on-reset - requiring coordinated reset sequencing in dual-die systems.
Can Quad DDR mode be used simultaneously on both dies?
Yes, but only one die can be active per transaction. Quad DDR commands issued under CS1# affect only Die 1; those under CS2# affect only Die 2. Simultaneous parallel DDR reads are not supported - timing and command arbitration remain per-die.
S70FL01GSAGMFI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFI013 FAQ
1.How can I place an order for S70FL01GSAGMFI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFI013 reliable?
The price and inventory of S70FL01GSAGMFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFI013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGMFI013?
S70FL01GSAGMFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFI013?
For technical support, including S70FL01GSAGMFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFI013 requirements.
6.How does Aetrix verify that S70FL01GSAGMFI013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFI013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFI013?
All S70FL01GSAGMFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFI013 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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