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Infineon Technologies S70FL01GSAGMFM010
- Part No.:
- S70FL01GSAGMFM010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFM010.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,170
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Product details
Overview
S70FL01GSAGMFM010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, uniform 256-kbyte sector erase, and 100,000 program-erase cycles. It implements two stacked S25FL512S dies, supports Quad DDR read, AutoBoot at preselected address, and OTP array (2048 bytes) for secure configuration storage in automotive infotainment boot code storage.
For engineers reviewing the S70FL01GSAGMFM010 datasheet, S70FL01GSAGMFM010 pinout, S70FL01GSAGMFM010 application, or S70FL01GSAGMFM010 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, VIO not supported, and absence of full-device bulk erase - all critical for bootloader partitioning and AEC-Q100 Grade 2 (−40°C to +105°C) system validation.
Technical Context
The S70FL01GSAGMFM010 integrates two independent S25FL512S dies in a single package, each with its own status register, configuration register, bank address register, and block protection logic. Access requires separate chip select assertion (CS1# for Die 1, CS2# for Die 2), and sequential reads across die boundaries are unsupported without explicit die switching.
It supports SPI modes 0 and 3, DDR read commands (Fast DDR/Dual DDR/Quad DDR), extended 32-bit addressing, and CFI data for runtime configuration discovery. Security includes OTP array, hardware/software block protection, and Advanced Sector Protection (ASP) with password-controlled individual sector locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read modes |
| Erase granularity | Uniform 256-kbyte sectors; no full-chip bulk erase - requires separate sector erase per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at max operating temperature |
| Supply voltage | Core VCC: 2.7–3.6 V; I/O voltage not supported (VIO = RFU) |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C), validated for automotive powertrain ECUs |
| Security features | 2048-byte OTP array; ASP with password lock; TBPROT/BPNV bit control per die |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to access Die 1 exclusively |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to access Die 2 exclusively |
| SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3 | Multi-I/O bidirectional signals | Support single/dual/quad I/O modes; IO2/IO3 become functional only in Quad mode |
| RESET# | Hardware reset input | Active-low asynchronous reset with internal pull-up; resets both dies simultaneously |
| VCC, VSS | Power and ground | Single shared core supply rail; no separate I/O voltage domain (VIO = RFU) |
| DNU pins (A2, A3, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Internally reserved for test; must remain unconnected or tied to VSS; not routable on PCB |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies enable flexible partitioning - e.g., Die 1 for firmware, Die 2 for calibration data - with isolated erase/program operations |
| AutoBoot execution | Automatically executes Normal or Quad read at power-up/reset from user-defined address - eliminates host-side boot initialization latency |
| Independent register sets | Status, Configuration, Bank Address, and Security registers are fully duplicated per die - prevents cross-die configuration crosstalk during hot-swap updates |
| Advanced Sector Protection (ASP) | Enables password-locked individual sector write/erase protection - critical for safeguarding safety-critical boot code against field corruption |
| Common Flash Interface (CFI) | Provides standardized runtime identification and geometry data (with die-specific byte 27h) - enables OS-agnostic flash abstraction layer compatibility |
Applications
| Automotive Powertrain ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine control maps and real-time diagnostic logs in AEC-Q100 Grade 2 environment. IC Role / Device Role / Timing Role: Non-volatile firmware and parameter storage with deterministic read latency under thermal stress. Use Value: Dual-die isolation ensures calibration data (Die 2) remains intact during firmware update (Die 1), avoiding full-system reflash downtime. | Use Scenario: Holding ladder logic firmware and I/O configuration tables in DIN-rail mounted programmable controllers. IC Role / Device Role / Timing Role: High-reliability serial flash for field-upgradable control software with 20-year data retention. Use Value: Uniform 256-kbyte sector erase enables atomic firmware patching without erasing entire application image. |
| Medical Imaging Bootloader | Avionics Display Module |
Use Scenario: Secure boot code storage for MRI subsystem controllers requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security keys and ASP-protected boot vector table. Use Value: 2048-byte OTP array stores immutable cryptographic keys; ASP prevents unauthorized modification of boot entry point. | Use Scenario: Storing display firmware and font assets in DO-160G qualified cockpit displays. IC Role / Device Role / Timing Role: High-speed Quad DDR read supports rapid GUI asset loading during cold start. Use Value: Quad DDR read achieves >80 MB/s effective throughput - meets ARINC 661 display initialization timing budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI10 | Single 512 Mbit die; no CS2#; no dual-die coordination overhead | Limited to ≤64 Mbyte storage; unsuitable for systems requiring >512 Mbit in single-package footprint | Select when total capacity ≤64 Mbyte and die-level isolation is unnecessary |
| MX25L1G45GM2I-12G | Monolithic 1 Gbit die; supports full-chip bulk erase; no CS2# or dual-die register duplication | Lacks independent die control - cannot isolate firmware and data partitions at hardware level | Select when simplified command set and single-register management outweigh need for partitioned reliability |
Compared with S25FL512SAGMFI10 and MX25L1G45GM2I-12G, the S70FL01GSAGMFM010 uniquely enables hardware-isolated dual-partition storage with per-die security and erase control - essential for ASIL-B compliant boot architectures where firmware and calibration data must be independently verifiable and updatable.
Availability
S70FL01GSAGMFM010 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLCs, medical imaging bootloaders, and avionics display modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FL01GSAGMFM010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.
The FL-S SPI flash product line targets high-reliability embedded systems requiring AEC-Q100 qualification, deterministic read performance, and advanced security - especially in automotive, industrial, and medical applications demanding long-term data integrity.
FAQ
Does S70FL01GSAGMFM010 support full-chip bulk erase?
No. Due to its dual-die stack architecture, bulk erase must be issued separately to each die using CS1# and CS2#. A single command cannot erase both dies simultaneously. This design prevents unintended data loss during partial updates and enforces explicit partition management - critical for safety-critical firmware deployments where calibration data must remain untouched during application upgrades.
What is the function of VIO pin on S70FL01GSAGMFM010?
The VIO pin is marked RFU (Reserved for Future Use) and is not supported in this device. Section 7 of the datasheet confirms VIO has no internal connection and must not be used for I/O voltage biasing. All I/O signaling operates from the core VCC supply (2.7–3.6 V), eliminating need for dual-voltage rail design - simplifying PCB layout and reducing BOM count in space-constrained automotive modules.
How does AutoBoot work on S70FL01GSAGMFM010?
AutoBoot executes a preconfigured Normal or Quad read command automatically after power-up or RESET#, starting from a user-programmable address stored in nonvolatile configuration registers. The command runs independently on the selected die (CS1# or CS2# active), enabling zero-latency boot code fetch without host CPU intervention - reducing boot time by up to 12 ms in automotive gateway applications with strict ISO 16750-2 cold-cranking requirements.
Can S70FL01GSAGMFM010 be used in AEC-Q100 Grade 1 applications?
No. The S70FL01GSAGMFM010 is qualified for AEC-Q100 Grade 2 (−40°C to +105°C) and Grade 3 (−40°C to +85°C), but not Grade 1 (−40°C to +125°C). Its thermal resistance and retention specifications are validated only up to +105°C ambient. For Grade 1 environments such as under-hood engine control units, Infineon's S70FL01GSAGMFM012 variant (Grade 1 qualified) must be selected instead - it shares identical pinout and command set but undergoes extended high-temperature characterization.
S70FL01GSAGMFM010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFM010 FAQ
1.How can I place an order for S70FL01GSAGMFM010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFM010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFM010 reliable?
The price and inventory of S70FL01GSAGMFM010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFM010 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFM010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFM010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGMFM010?
S70FL01GSAGMFM010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFM010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFM010?
For technical support, including S70FL01GSAGMFM010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFM010 requirements.
6.How does Aetrix verify that S70FL01GSAGMFM010 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFM010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFM010 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFM010?
All S70FL01GSAGMFM010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFM010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFM010 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFM010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FL01GSAGMFM010 Tags
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M24C02-WMN6TP
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