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Infineon Technologies S70FL01GSAGMFM013
- Part No.:
- S70FL01GSAGMFM013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSAGMFM013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,534
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Product details
Overview
S70FL01GSAGMFM013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, QPP programming, and AutoBoot at power-up for embedded boot code storage.
For engineers reviewing the S70FL01GSAGMFM013 datasheet, S70FL01GSAGMFM013 pinout, S70FL01GSAGMFM013 application, or S70FL01GSAGMFM013 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, absence of VIO support, sector-level erase independence per die, and OTP array size of 2048 bytes for secure configuration storage.
Technical Context
The S70FL01GSAGMFM013 integrates two independent S25FL512S flash dies sharing a common SOIC/BGA footprint but requiring separate chip select (CS1# and CS2#) control. Each die maintains autonomous status, configuration, bank address, and security registers - no cross-die register synchronization occurs automatically.
It supports SPI modes 0 and 3, DDR timing with data learning, and extended 32-bit addressing. Sequential reads across die boundaries are unsupported; host firmware must issue separate read commands using CS1# and CS2# to access contiguous logical addresses spanning both dies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read modes |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate command per die |
| Endurance & retention | 100,000 program-erase cycles minimum; 20-year data retention minimum |
| Supply voltage | VCC: 2.7 V–3.6 V; VIO not supported (RFU in this device) |
| Temperature grade | AEC-Q100 Grade 2: −40°C to +105°C |
| Security features | 2048-byte OTP array; hardware/software block protection; ASP with password control |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to access lower 128 Mbyte address space |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to access upper 128 Mbyte address space |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; used for command/address/data in all modes |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; bidirectional in Dual/Quad modes |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in standard/Dual mode; IO3 in Quad-I/O mode; internal pull-up |
| RESET# | Hardware Reset | Active-low reset with internal pull-up; returns device to standby state |
| VCC | Core Power Supply | 2.7 V–3.6 V supply for flash core and logic; powers both dies |
| VSS | Ground | Common reference for all signals and power domains |
| DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Reserved for test or future use; must not be connected to host signals or PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package enable 1 Gbit density while maintaining S25FL-P family compatibility |
| AutoBoot functionality | Executes preselected Normal or Quad read at power-up/reset, enabling direct XIP or boot code fetch without host initialization |
| Quad-input page programming (QPP) | Enables high-speed programming (1.5 Mbytes/s) even with low-frequency clocks by using all four I/O lines for input |
| Common Flash Interface (CFI) | Provides standardized configuration metadata (e.g., sector map, timing parameters) readable via serial command for runtime adaptation |
| Advanced Sector Protection (ASP) | Supports individual sector locking via boot code or password, with freeze bit preventing accidental unlock until power-on-reset |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Image |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units in AEC-Q100 Grade 2 automotive systems. IC Role / Device Role / Timing Role: Non-volatile boot memory with AutoBoot execution and hardware write protection to prevent corruption during power transients. Use Value: Enables deterministic boot within <50 ms after power-on, leveraging Quad DDR read and 256-kbyte sector erase for fast firmware updates. | Use Scenario: Holds field-upgradable firmware and configuration data for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability SPI flash with 20-year data retention and 100K endurance for infrequent but mission-critical reprogramming events. Use Value: Supports secure over-the-air updates via OTP-protected keys and ASP-locked bootloader sectors, minimizing risk of unauthorized modification. |
| Medical Imaging System Configuration | Avionics Display Module Code Storage |
Use Scenario: Stores calibration tables, sensor profiles, and UI assets for portable ultrasound devices requiring long-term data integrity. IC Role / Device Role / Timing Role: Industrial-grade (−40°C to +85°C) non-volatile memory with CFI-readable geometry for dynamic memory mapping at startup. Use Value: Delivers guaranteed 20-year retention of calibration data and supports simultaneous dual-die reads for parallel asset loading during system initialization. | Use Scenario: Hosts display firmware and font assets in certified avionics modules where DO-254 compliance mandates traceable, locked memory regions. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash used as secure code store with FREEZE-bit-locked protection registers. Use Value: Ensures bootloader integrity through hardware-enforced sector locking and OTP-stored cryptographic keys, meeting RTCA/DO-254 tool qualification requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI101 | Single 512 Mbit die; no CS2#; identical command set and pinout except missing CS2# and associated DNU pins | Lower density; suitable when 512 Mbit suffices and dual-die management complexity is undesirable | Select for cost-sensitive designs where full 1 Gbit is unnecessary and simpler firmware addressing is preferred |
| S70FL01GSAGMFM010 | Same dual-die architecture and pinout, but AEC-Q100 Grade 3 (−40°C to +85°C) instead of Grade 2 | Lower temperature rating; not qualified for under-hood or high-temp industrial enclosures | Choose only if ambient operating temperature remains ≤+85°C and automotive qualification level can be reduced |
Compared with S25FL512SAGMFI101 and S70FL01GSAGMFM010, the S70FL01GSAGMFM013 uniquely delivers 1 Gbit density with AEC-Q100 Grade 2 qualification and dual-chip-select control-enabling deterministic partitioning of boot and application code across two independent dies while meeting extended temperature and reliability requirements.
Availability
S70FL01GSAGMFM013 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply, long-lifecycle support, and AEC-Q100 compliance.
Supply support for S70FL01GSAGMFM013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive applications.
The FL-S family targets high-reliability embedded systems requiring SPI flash with multi-I/O bandwidth, advanced security, and extended temperature operation-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or industrial-grade qualification.
FAQ
Does S70FL01GSAGMFM013 support true single-command 1 Gbit bulk erase?
No. Due to its dual-die stack architecture, bulk erase must be issued separately to each die using CS1# and CS2#. There is no single command that erases both dies simultaneously. This design ensures independent control and avoids unintended data loss during partial updates, but requires host firmware to manage two erase sequences.
Can VIO pin be used for I/O voltage translation on this device?
No. The VIO pin is marked RFU (Reserved for Future Use) in the S70FL01GSAGMFM013 datasheet and has no functional connection. I/O voltage levels are fixed to VCC (2.7 V–3.6 V); external level-shifting circuitry is required if interfacing with 1.8 V hosts.
How does AutoBoot behavior differ between CS1# and CS2#?
AutoBoot executes identically on both dies: it performs a preconfigured Normal or Quad read starting at a user-defined address upon power-up or RESET#. However, the target address and read mode are stored per-die in their respective configuration registers, so AutoBoot can be independently configured for CS1# and CS2# to load different code segments.
Is the 2048-byte OTP array shared between both dies or duplicated?
The 2048-byte OTP array is duplicated - each die contains its own independent 2048-byte OTP region. This allows separate secure storage of keys, calibration data, or certificates for each 512 Mbit partition, supporting isolated firmware authentication and tamper-resistant configuration per die.
S70FL01GSAGMFM013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSAGMFM013 FAQ
1.How can I place an order for S70FL01GSAGMFM013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGMFM013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGMFM013 reliable?
The price and inventory of S70FL01GSAGMFM013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGMFM013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGMFM013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGMFM013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGMFM013?
S70FL01GSAGMFM013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGMFM013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGMFM013?
For technical support, including S70FL01GSAGMFM013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGMFM013 requirements.
6.How does Aetrix verify that S70FL01GSAGMFM013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGMFM013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGMFM013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGMFM013?
All S70FL01GSAGMFM013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGMFM013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGMFM013 part is unused and in its original packaging.
Return procedure for S70FL01GSAGMFM013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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