Infineon Technologies S70FL01GSAGMFV010

Overview

S70FL01GSAGMFV010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, uniform 256-kbyte sector erase, and 100,000 program-erase cycles. It implements two stacked S25FL512S dies, supports Quad DDR read, AutoBoot, and Common Flash Interface (CFI), and is used in industrial embedded systems requiring high-density nonvolatile storage with SPI compatibility.

For engineers reviewing the S70FL01GSAGMFV010 datasheet, S70FL01GSAGMFV010 pinout, S70FL01GSAGMFV010 application, or S70FL01GSAGMFV010 equivalent, key selection criteria include dual-die addressing behavior, independent CS1#/CS2# control per die, absence of VIO support, 256-kbyte uniform sector granularity, and OTP array size of 2048 bytes.

Technical Context

This device integrates two independent 512 Mbit S25FL512S dies in a single package, each with its own status register, configuration register, bank address register, and block protection logic. Access requires separate chip select signals (CS1# and CS2#), and sequential reads across die boundaries are unsupported without explicit switching.

It supports SPI modes 0 and 3, DDR operation, extended 32-bit addressing, and Quad-input page programming (QPP). Security features include OTP array (2048 bytes), hardware/software block protection, and Advanced Sector Protection (ASP) with password-controlled individual sector locking.

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Compared with S25FL512SAGMFI101 and MX25L1G45GMIL0, the S70FL01GSAGMFV010 uniquely delivers 1 Gbit density with backward-compatible S25FL-P footprint and dual-die isolation-critical for safety partitioning and staged firmware updates-while supporting industrial-plus and AEC-Q100 Grade 2 operation.

Availability

S70FL01GSAGMFV010 is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive ADAS firmware image, and medical imaging FPGA configuration requiring stable component supply across long-lifecycle programs.

Supply support for S70FL01GSAGMFV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The S70FL01GS belongs to Infineon's FL-S SPI flash family, designed specifically for high-reliability embedded systems needing scalable density, AEC-Q100 qualification, and advanced security features like ASP and OTP.

FAQ

What is the function of CS1# and CS2# on the S70FL01GSAGMFV010?

CS1# selects the first 512 Mbit die (lower 512 Mbyte address space), and CS2# selects the second 512 Mbit die (upper 512 Mbyte address space). Both are mandatory for full 1 Gbit access; they cannot be tied together. Each die maintains independent status/configuration registers and must be erased or programmed separately.

Does the S70FL01GSAGMFV010 support VIO (I/O voltage supply)?

No. VIO is marked "RFU" (Reserved for Future Use) and has no internal connection in this device. All I/O signaling operates from the core VCC supply (2.7–3.6 V). The VIO/RFU pin (BGA pin A3) must be left unconnected or tied to VSS per Infineon's recommendation-no external voltage should be applied.

Can sequential reads cross between the two dies in the S70FL01GSAGMFV010?

No. Sequential reads are not supported across the boundary from the end of die 1 to the start of die 2. To read across the full 1 Gbit address space, the host must issue separate read commands using CS1# for addresses 0x00000000–0x07FFFFFF and CS2# for 0x08000000–0x0FFFFFFF, with explicit handover logic.

How is block protection managed across the dual dies?

Each die maintains independent block protection registers (TBPROT, BPNV, FREEZE). Settings must be written separately to both dies. Infineon recommends mirroring protection configurations to ensure consistent behavior during die switching. If FREEZE is set on either die, it remains locked until power-on-reset is applied to that specific die.