Infineon Technologies S70FL01GSAGMFV013

Overview

S70FL01GSAGMFV013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, uniform 256-kbyte sector erase, and 100,000 program-erase cycles. It implements two stacked S25FL512S dies, supports Quad DDR read, AutoBoot at preselected address, and OTP array (2048 bytes) for secure configuration storage in industrial and automotive embedded systems.

For engineers reviewing the S70FL01GSAGMFV013 datasheet, S70FL01GSAGMFV013 pinout, S70FL01GSAGMFV013 application, or S70FL01GSAGMFV013 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, VIO not supported, and absence of full-device bulk erase - all critical for boot firmware partitioning and AEC-Q100 Grade 2 (−40°C to +105°C) system validation.

Technical Context

The S70FL01GSAGMFV013 integrates two independent S25FL512S dies in a single package, each with its own status register, configuration register, bank address register, and block protection logic. Access is strictly segregated: CS1# selects Die #1 (0x00000000–0x07FFFFFF), CS2# selects Die #2 (0x08000000–0x0FFFFFFF), and no automatic cross-die sequential reads are supported.

It supports SPI modes 0 and 3, DDR timing with data learning, and extended 32-bit addressing. Security relies on per-die ASP, OTP array, and TBPROT/BPNV bit control - with FREEZE bit requiring power-on-reset to clear if set on either die.

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Compared with S25FL128SAGMFI101 and MX25L1G45GM2I-12G, the S70FL01GSAGMFV013 uniquely delivers die-level isolation, independent status/config registers, and AutoBoot - essential for safety-critical dual-image systems where firmware integrity and deterministic boot timing are non-negotiable.

Availability

S70FL01GSAGMFV013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging controllers, and 5G baseband radios requiring stable component supply across AEC-Q100 Grade 2 and Industrial Plus temperature grades.

Supply support for S70FL01GSAGMFV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life SPI flash - optimized for automotive ADAS, industrial automation, and medical devices demanding AEC-Q100 compliance and 20-year data retention.

FAQ

Does S70FL01GSAGMFV013 support true 4-byte addressing across the full 1 Gbit range?

Yes - it implements extended 32-bit addressing, enabling direct access to the full 0x00000000–0x0FFFFFFF address space. However, due to dual-die architecture, addresses 0x00000000–0x07FFFFFF map to Die #1 (CS1#), and 0x08000000–0x0FFFFFFF map to Die #2 (CS2#). No single command crosses the die boundary.

Can CS1# and CS2# be asserted simultaneously for parallel read operations?

No - simultaneous assertion of CS1# and CS2# is undefined and not supported. The device requires strict time-multiplexed access: only one chip select may be active at a time to avoid bus contention and internal state conflict between the two independent dies.

Is the 2048-byte OTP array shared between both dies or duplicated?

The OTP array is duplicated - each die contains its own independent 2048-byte OTP region. Programming is performed separately per die using standard SPI commands issued under CS1# or CS2#, and contents are not mirrored or synchronized.

What happens if the FREEZE bit is set on one die but not the other?

If FREEZE is set on Die #1 only, block protection bits (TBPROT/BPNV) for Die #1 become locked until power-on-reset; Die #2 remains fully configurable. This enables asymmetric protection schemes - e.g., locking boot sectors on Die #1 while keeping Die #2 open for field updates - but requires explicit per-die RESET# assertion to clear.