Infineon Technologies S70FL01GSDPBHIC10

Overview

S70FL01GSDPBHIC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase architecture. It supports Normal/Fast/Dual/Quad/DDR read modes, 512-byte page programming, and delivers 1.5 Mbytes/s write and 0.5 Mbytes/s erase throughput. Used in industrial and automotive boot code storage where high-density serial flash with AEC-Q100 Grade 2 qualification is required.

For engineers reviewing the S70FL01GSDPBHIC10 datasheet, S70FL01GSDPBHIC10 pinout, S70FL01GSDPBHIC10 application, or S70FL01GSDPBHIC10 equivalent, key selection criteria include dual-die addressing behavior, independent CS1#/CS2# control per die, Quad I/O timing compliance, OTP array size (2048 bytes), and AEC-Q100 Grade 2 temperature range (−40°C to +105°C).

Technical Context

The S70FL01GSDPBHIC10 integrates two S25FL512S dies in a single package, each operating independently via dedicated chip select lines (CS1# and CS2#). It implements Infineon's 65 nm MirrorBit® Eclipse™ architecture with separate status, configuration, and security registers per die.

It supports extended 32-bit addressing, AutoBoot from preselected address on power-up/reset, and Common Flash Interface (CFI) for runtime configuration discovery. VIO is not supported - I/O voltage is tied to VCC (2.7–3.6 V), and all I/O pins feature internal pull-up/pull-down resistors as specified.

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Compared with S25FL512SAGMFI010 and MX25L1G45GMIL0, the S70FL01GSDPBHIC10 uniquely provides AEC-Q100 Grade 2 qualification with dual-die redundancy and independent security register control - critical for automotive safety-critical boot paths where die-level isolation and freeze-protected OTP are mandatory.

Availability

S70FL01GSDPBHIC10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and avionics data loggers requiring stable component supply with full AEC-Q100 Grade 2 lifecycle support.

Supply support for S70FL01GSDPBHIC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded systems requiring SPI flash with enhanced security, endurance, and automotive qualification - designed specifically for boot code, firmware, and configuration storage in safety-critical environments.

FAQ

What is the function of CS1# and CS2# on the S70FL01GSDPBHIC10?

CS1# and CS2# are independent active-low chip select inputs that enable access to the first and second 512 Mbit die respectively. Each die maintains its own status, configuration, and security registers; commands issued while CS1# is asserted affect only Die 1, and vice versa. Simultaneous access to both dies is not supported.

Does the S70FL01GSDPBHIC10 support continuous sequential reads across the full 1 Gbit address space?

No. Due to its dual-die architecture, sequential reads crossing the 512 Mbit boundary require explicit switching between CS1# and CS2#. The device does not support automatic wraparound or seamless addressing across dies - software must manage die selection and address offset manually.

Is VIO supported on this part, and what is its I/O voltage range?

VIO is not supported on the S70FL01GSDPBHIC10. The device uses a single VCC supply (2.7–3.6 V) for both core and I/O functions. All I/O pins (SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3) operate at VCC-referenced levels, eliminating the need for separate I/O voltage rail design.

How is the 2048-byte OTP array used, and can it be reprogrammed?

The OTP array is a one-time-programmable 2048-byte region used for storing immutable data such as cryptographic keys, calibration constants, or device-specific identifiers. Once programmed, bits cannot be erased or rewritten. Programming is performed via standard SPI write commands with specific address and lock sequence; permanent lock occurs after final write cycle.