Infineon Technologies S70FL01GSDPBHIC13

Overview

S70FL01GSDPBHIC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die stacked SPI Multi-I/O Flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, and support for Normal/Fast/Dual/Quad/DDR read modes. It implements two independent S25FL512S die accessed via CS1# and CS2#, enabling 100,000 program-erase cycles and 20-year data retention for industrial and automotive boot code storage.

For engineers reviewing the S70FL01GSDPBHIC13 datasheet, S70FL01GSDPBHIC13 pinout, S70FL01GSDPBHIC13 application, or S70FL01GSDPBHIC13 equivalent, key selection criteria include dual-die addressing behavior, independent status/configuration register management per die, Quad I/O timing compliance, and AEC-Q100 Grade 2 (−40°C to +105°C) qualification for engine control units.

Technical Context

The S70FL01GSDPBHIC13 integrates two identical S25FL512S dies in a single package, each with independent CS#, status registers, configuration registers, and block protection logic. Access requires explicit chip select routing-CS1# for Die 1 (0x00000000–0x07FFFFFF), CS2# for Die 2 (0x08000000–0x0FFFFFFF)-with no automatic cross-die sequential reads.

It supports SPI modes 0 and 3, DDR read commands, and Quad-input page programming (QPP). VIO is RFU; I/O voltage range is 1.65 V–3.6 V, while core VCC operates from 2.7 V–3.6 V. OTP array (2048 bytes) and Advanced Sector Protection (ASP) are implemented per die.

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI Flash memory applications.

Compared with S25FL128SAGMFIG00 and MX25L1G45GM2I-12G, the S70FL01GSDPBHIC13 uniquely provides dual-die independence with per-die register control, AEC-Q100 Grade 2 rating, and ASP-enabled sector locking-critical for functional safety and firmware update resilience in automotive and avionics.

Availability

S70FL01GSDPBHIC13 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging controllers, and avionics display systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.

Supply support for S70FL01GSDPBHIC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The FL-S Flash product line delivers high-performance, secure, and AEC-Q100-qualified SPI NOR Flash targeting boot code, firmware, and configuration storage in safety-critical embedded systems.

FAQ

What is the function of CS1# and CS2# on the S70FL01GSDPBHIC13?

CS1# selects the first 512 Mbit die (0x00000000–0x07FFFFFF), while CS2# selects the second die (0x08000000–0x0FFFFFFF). Each die has independent status, configuration, and protection registers. Commands issued under CS1# affect only Die 1; those under CS2# affect only Die 2. No single command accesses both dies simultaneously.

Does the S70FL01GSDPBHIC13 support true uniform 256-kbyte sector erase across the full 1 Gbit address space?

No. Erase commands must be issued separately to each die. A sector erase targets one 256-kbyte sector within Die 1 or Die 2-not across the boundary. Full-chip bulk erase is not supported; instead, two independent bulk erase commands (one per CS#) are required to clear the entire 1 Gbit array.

Can the S70FL01GSDPBHIC13 be used as a drop-in replacement for S25FL512S in existing designs?

No. While built from two S25FL512S dies, the S70FL01GSDPBHIC13 uses a different pinout (24-ball BGA vs. SOIC-16), adds CS2#, and requires explicit dual-die address management. Its 1 Gbit capacity and dual-CS interface necessitate firmware and layout changes-not pin-compatible substitution.

How does the AutoBoot feature operate, and where is the boot address stored?

AutoBoot executes a preconfigured Normal or Quad Read command at power-up or reset from an address stored in the Configuration Register's BOOT_ADD bits (bits [23:8]). The address is user-programmable and retained across power cycles. AutoBoot activates only if the AUTOBOOT_EN bit (CR[0]) is set to 1 before reset.