Infineon Technologies S70FL01GSDPBHVC10

Overview

S70FL01GSDPBHVC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, and support for Quad DDR read commands. It implements two stacked S25FL512S dies in a single BGA-24 package, enabling high-density nonvolatile storage for boot code and firmware in industrial and automotive systems.

For engineers reviewing the S70FL01GSDPBHVC10 datasheet, S70FL01GSDPBHVC10 pinout, S70FL01GSDPBHVC10 application, or S70FL01GSDPBHVC10 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, 100,000 program-erase cycles, OTP array size, AEC-Q100 Grade 2 qualification, and absence of VIO support.

Technical Context

This device uses Infineon's 65 nm MirrorBit® Flash technology with Eclipse™ architecture and operates as a dual-die stack-each die functions independently with separate status, configuration, and bank address registers. Chip select signals CS1# and CS2# isolate access to each 512 Mbit die, requiring explicit per-die command issuance for programming, erase, and register updates.

It supports SPI modes 0 and 3, DDR read operations, auto-boot from preselected addresses, and Common Flash Interface (CFI) data for runtime configuration discovery. The device lacks VIO support-VIO/RFU pin is reserved for future use and must not be connected.

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Compared with S25FL128SAGMFI000 and S70FL01GSDBHI010, the S70FL01GSDPBHVC10 uniquely delivers AEC-Q100 Grade 2 qualification in BGA-24 with dual-die isolation-critical for automotive fail-safe firmware partitioning and thermal-constrained embedded systems.

Availability

S70FL01GSDPBHVC10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging subsystems, and enterprise networking equipment requiring stable component supply, long-lifecycle support, and AEC-Q100 compliance.

Supply support for S70FL01GSDPBHVC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The FL-S SPI flash product line delivers high-density, low-power, and AEC-Q100-qualified nonvolatile memory optimized for boot code storage, firmware updates, and secure configuration in safety-critical embedded systems.

FAQ

Does S70FL01GSDPBHVC10 support simultaneous read from both dies?

No. The device does not support true simultaneous read across both dies. Each die must be accessed individually using CS1# or CS2#. Sequential reads spanning die boundaries require two separate read commands-one per chip select-and cannot be performed atomically across the 1 Gbit address space.

What is the function of the VIO/RFU pin on this part?

The VIO/RFU pin is reserved for future use and has no functional connection in the S70FL01GSDPBHVC10. Section 7 of the datasheet explicitly states VIO is not supported. It must not be connected to any voltage source or signal; leaving it unconnected is compliant with Infineon's recommendations.

How is the 1 Gbit capacity physically realized?

The capacity is achieved by stacking two identical S25FL512S 512 Mbit dies in a single BGA-24 package. Each die operates independently with its own CS#, status register, configuration register, and erase/program logic-effectively doubling density while preserving SPI command compatibility and footprint.

Can the OTP array be reprogrammed after initial write?

No. The 2048-byte OTP (One-Time Programmable) array is permanently locked after programming. Once a byte is written, it cannot be altered. This ensures cryptographic keys, calibration data, or device identifiers remain immutable-critical for security and traceability in automotive and medical applications.