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Infineon Technologies S70FL01GSDPBHVC13
- Part No.:
- S70FL01GSDPBHVC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSDPBHVC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,498
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Product details
Overview
S70FL01GSDPBHVC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, supporting Quad I/O, DDR, and extended 32-bit addressing. It implements two stacked S25FL512S dies in a single BGA-24 package, enabling independent chip-select access to each die via CS1# and CS2#, and delivers 1.5 Mbytes/s programming and 0.5 Mbytes/s erase throughput. It is used in automotive infotainment boot storage requiring AEC-Q100 Grade 2 (−40°C to +105°C) operation.
For engineers reviewing the S70FL01GSDPBHVC13 datasheet, S70FL01GSDPBHVC13 pinout, S70FL01GSDPBHVC13 application, or S70FL01GSDPBHVC13 equivalent, key selection considerations include dual-die address boundary handling, independent status/configuration register management per die, sector erase isolation, and AEC-Q100 Grade 2 qualification for under-hood embedded systems.
Technical Context
The S70FL01GSDPBHVC13 integrates two identical 512 Mbit S25FL512S dies in a monolithic BGA-24 package, with separate chip select lines (CS1#, CS2#) enabling discrete die access but no cross-die sequential reads. Each die maintains autonomous status, configuration, security, and block protection registers - requiring independent command issuance and bit-level synchronization for consistent behavior.
It supports SPI modes 0/3, Quad I/O read/write, Fast/Quad/DDR read variants, AutoBoot from preselected address, and CFI data for runtime configuration discovery. VIO is RFU; I/O voltage range is fixed at 1.65–3.6 V, matched to core VCC (2.7–3.6 V), eliminating level-shifting requirements in mixed-voltage host systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Quad/Dual/Single-bit and DDR support; no native octal or QPI |
| Programming speed | 1.5 Mbytes/s max, using 512-byte page buffer and Quad-input programming |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance & retention | 100,000 program-erase cycles minimum; 20-year data retention at ≤85°C |
| Operating temperature | AEC-Q100 Grade 2: −40°C to +105°C, qualified for automotive powertrain modules |
| Security features | 2048-byte OTP array; hardware/software block protection; ASP with password-controlled sector lock |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free, with VIO pin marked RFU (not functional).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; must be asserted to access Die 1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; must be asserted to access Die 2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; bidirectional during Quad operations |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; bidirectional during Quad operations |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Edge-triggered clock for all SPI transactions; supports up to 80 MHz SDR / 40 MHz DDR |
| VCC | Core Supply | 2.7–3.6 V core power; powers both dies and logic interface |
| VSS | Ground | Common return for core and I/O circuitry; requires low-impedance PCB plane |
| RESET# | Hardware Reset | Asynchronous active-low reset; returns device to standby; internal pull-up |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one BGA-24 package, enabling scalable 1 Gbit density without board layout change from 512 Mbit designs |
| Independent die control | Separate CS#, status/config registers, and erase/program commands per die - eliminates cross-die interference but requires explicit die management in firmware |
| AutoBoot execution | Automatically executes Normal or Quad Read at power-up/reset from user-configurable address, reducing boot loader latency in automotive ECUs |
| CFI-compliant identification | Provides standardized geometry, timing, and feature tables via RDID command, enabling OS/driver auto-configuration without hard-coded parameters |
| Advanced sector protection | Individual sector lock via password or boot code, with FREEZE bit preventing accidental unlock until power-on-reset - critical for secure firmware partitioning |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated gauge graphics, driver profile settings, and OTA update staging area in digital instrument clusters. IC Role / Device Role / Timing Role: Nonvolatile boot and runtime code/data storage with AEC-Q100 Grade 2 qualification and 105°C operation. Use Value: Dual-die structure allows segregated storage of safety-critical boot code (Die 1) and user-configurable assets (Die 2), enforced by independent ASP locks. | Use Scenario: Holds ladder logic firmware, I/O mapping tables, and calibration coefficients in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability SPI flash for deterministic firmware load at cold start and field updates over RS-485/Ethernet. Use Value: 20-year data retention and 100K-cycle endurance ensure >15-year field life without refresh, even with daily firmware patch cycles. |
| ADAS Camera Module | Medical Imaging Control Board |
Use Scenario: Stores image processing firmware, lens calibration data, and real-time object detection models in front-facing ADAS cameras. IC Role / Device Role / Timing Role: Low-latency Quad DDR read capability enables sub-50 ms boot time for ISO 26262 ASIL-B compliant systems. Use Value: Independent CS# control allows parallel firmware verification (Die 1) and active execution (Die 2), improving boot integrity validation time. | Use Scenario: Retains FPGA configuration bitstreams, DICOM protocol stacks, and regulatory audit logs in portable ultrasound control boards. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP array for cryptographic keys and device-specific calibration signatures. Use Value: 2048-byte OTP space stores immutable root-of-trust keys, while ASP prevents unauthorized overwrite of FDA-mandated audit trails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI200 | Single-die 128 Mbyte (1 Gbit), same SOIC-16/BGA-24 footprints, no dual-die stacking | Lacks independent die control and CS2#; simpler firmware but no die-level redundancy or segregation | Select when system requires only single-flash behavior and does not need die-isolated erase/program or AutoBoot per die |
| MX25L1G45GM2I-12G | 1 Gbit single-die SPI flash, 1.8 V core, supports octal DTR mode; no AEC-Q100 qualification | Lower voltage operation and higher bandwidth, but unqualified for automotive temperature grades or safety-critical use | Select for cost-sensitive industrial IoT gateways where AEC-Q100 is unnecessary and 1.8 V supply is available |
Compared with S25FL128SAGMFI200 and MX25L1G45GM2I-12G, the S70FL01GSDPBHVC13 uniquely provides AEC-Q100 Grade 2 qualification, dual-die isolation for fault containment, and independent die-level security controls - making it the only option for ASIL-B boot storage requiring die-segregated firmware partitions.
Availability
S70FL01GSDPBHVC13 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS camera modules, and industrial PLC firmware storage requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70FL01GSDPBHVC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and nonvolatile memory solutions for safety-critical and high-reliability applications.
The FL-S family targets automotive and industrial systems needing SPI flash with AEC-Q100 qualification, advanced security, and multi-die scalability - designed specifically for ECU boot storage, OTA update staging, and firmware partitioning in ASIL-B environments.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSDPBHVC13?
CS1# and CS2# are dedicated chip select inputs that independently enable communication with each of the two stacked 512 Mbit flash dies. Asserting CS1# accesses Die 1 (addresses 0x00000000–0x07FFFFFF); asserting CS2# accesses Die 2 (0x08000000–0x0FFFFFFF). Both cannot be asserted simultaneously, and cross-die sequential reads require explicit switching between selects.
Does the S70FL01GSDPBHVC13 support true 32-bit addressing across both dies?
Yes - the device implements extended 32-bit addressing with a unified 0x00000000–0x0FFFFFFF address space. However, due to dual-die architecture, sequential reads crossing the 128 Mbyte boundary (0x07FFFFFF → 0x08000000) require manual die switching via CS1# and CS2#; automatic wraparound is not supported.
Can the OTP array be reprogrammed after initial programming?
No - the 2048-byte OTP (One Time Program) array is permanently programmable. Once a byte is written from FFh to any other value, it cannot be altered again. This ensures cryptographic keys, device IDs, or calibration signatures remain immutable throughout product lifetime.
Is VIO pin functional on the S70FL01GSDPBHVC13?
No - the VIO pin is marked RFU (Reserved for Future Use) and has no internal connection. It must not be driven or used for PCB routing. The device operates with a single 2.7–3.6 V VCC supply, and I/O voltage tracking is inherent - no separate VIO rail is required or supported.
S70FL01GSDPBHVC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSDPBHVC13 FAQ
1.How can I place an order for S70FL01GSDPBHVC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSDPBHVC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSDPBHVC13 reliable?
The price and inventory of S70FL01GSDPBHVC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSDPBHVC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSDPBHVC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSDPBHVC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSDPBHVC13?
S70FL01GSDPBHVC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSDPBHVC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSDPBHVC13?
For technical support, including S70FL01GSDPBHVC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSDPBHVC13 requirements.
6.How does Aetrix verify that S70FL01GSDPBHVC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSDPBHVC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSDPBHVC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSDPBHVC13?
All S70FL01GSDPBHVC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSDPBHVC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSDPBHVC13 part is unused and in its original packaging.
Return procedure for S70FL01GSDPBHVC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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