Infineon Technologies S70FL01GSDPMFI010

Overview

S70FL01GSDPMFI010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, QPP programming, and AutoBoot at power-up.

For engineers reviewing the S70FL01GSDPMFI010 datasheet, S70FL01GSDPMFI010 pinout, S70FL01GSDPMFI010 application, or S70FL01GSDPMFI010 equivalent, key selection considerations include dual-die addressing constraints, independent status/configuration register management per die, sector erase isolation, and absence of VIO support - all critical for boot code integrity and automotive firmware storage validation.

Technical Context

The device integrates two independent S25FL512S flash dies sharing one BGA-24 package, each accessible via dedicated chip select (CS1# and CS2#), requiring separate command issuance for programming, erase, and register access. Sequential reads across die boundaries are unsupported without explicit CS switching.

It implements Infineon's 65 nm MirrorBit® Flash technology with Eclipse™ architecture, enabling DDR-capable SPI operation, extended 32-bit addressing, and CFI-compliant configuration data. All security registers (ASP, PPB, password) and protection bits (TBPROT, FREEZE) operate independently per die, mandating synchronized bit-setting for consistent behavior.

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density SPI flash applications.

Compared with S25FL128SAGMFI200 and MX25L1G45GM2I-12G, the S70FL01GSDPMFI010 uniquely provides AEC-Q100 Grade 2 qualification, dual-die isolation for fault-tolerant firmware partitioning, and 2048-byte OTP - making it the only option supporting certified automotive boot integrity with independent die-level security control.

Availability

S70FL01GSDPMFI010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot loaders, and avionics display systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.

Supply support for S70FL01GSDPMFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The FL-S flash product line targets automotive, industrial, and medical applications requiring high reliability, extended temperature operation, and secure firmware storage - built on MirrorBit® Flash technology for endurance and data retention.

FAQ

Does S70FL01GSDPMFI010 support simultaneous read/write across both dies?

No. The device requires sequential access: CS1# must be asserted to operate on Die 1, and CS2# for Die 2. Simultaneous die operation is not supported - each die must be addressed and managed independently for all commands including read, program, erase, and register access.

What is the function of the DNU pins, and can they be left unconnected?

DNU (Do Not Use) pins have internal pull-down resistors and are reserved for factory test. They must not be connected to any host signal or used for PCB routing. Leaving them unconnected is compliant and recommended - tying them to VSS is acceptable but unnecessary.

Is VIO supply supported on this part, and what happens if it is driven?

VIO is not supported on S70FL01GSDPMFI010 and is marked RFU (Reserved for Future Use). Driving VIO has no functional effect; the pin is internally disconnected from I/O circuitry. It may be left floating or tied to VSS without impact on operation or reliability.

How does AutoBoot work, and can the target address be changed after programming?

AutoBoot executes a preconfigured Normal or Quad Read command at power-up or reset from a fixed address stored in nonvolatile configuration registers. That address is programmable via standard SPI commands and persists across power cycles - allowing field updates to boot source location without hardware change.