Infineon Technologies S70FL01GSDPMFI013

Overview

S70FL01GSDPMFI013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sector erase, 100,000 program-erase cycles endurance, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two stacked S25FL512S dies, each independently accessible via CS1# and CS2#, supporting Quad DDR read at up to 1.5 Mbytes/s programming throughput.

For engineers reviewing the S70FL01GSDPMFI013 datasheet, S70FL01GSDPMFI013 pinout, S70FL01GSDPMFI013 application, or S70FL01GSDPMFI013 equivalent, key selection considerations include dual-die address boundary handling, independent status/configuration register management per die, simultaneous die access limitations, and absence of full-device bulk erase support.

Technical Context

The S70FL01GSDPMFI013 integrates two identical S25FL512S dies in a single package, each with independent chip select (CS1# and CS2#), status registers, configuration registers, and block protection logic. No automatic cross-die sequential addressing is supported - reads spanning die boundaries require explicit switching between CS1# and CS2#.

It supports SPI modes 0 and 3, DDR read commands, extended 32-bit addressing, and Quad-input page programming (QPP). VIO is not implemented (RFU); I/O voltage range is 1.65 V–3.6 V, matched to core VCC (2.7 V–3.6 V). OTP array size is 2048 bytes with hardware/software block protection and Advanced Sector Protection (ASP).

Key Specifications

Pinout & Package

Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free. Pinout reflects dual-die architecture with dedicated chip selects and isolated control paths.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Compared with S25FL128SAGMFI000 and S70FL01GSAGMFI010, the S70FL01GSDPMFI013 uniquely delivers BGA-based dual-die isolation with AEC-Q100 Grade 2 compliance - essential for safety-aware partitioned firmware architectures requiring physical die separation and thermal robustness.

Availability

S70FL01GSDPMFI013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging devices, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S70FL01GSDPMFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded systems requiring SPI flash with enhanced security, extended temperature operation, and automotive qualification - designed specifically for code storage and firmware update in safety-critical platforms.

FAQ

What is the maximum clock frequency supported in Quad DDR mode?

The S70FL01GSDPMFI013 supports up to 80 MHz SCK in Quad DDR mode, delivering effective 320 MB/s read bandwidth. This is specified in the DDR AC characteristics table (Section 11.1 of datasheet 001-98295 Rev. *O), with setup/hold timing validated across −40°C to +105°C.

Can CS1# and CS2# be asserted simultaneously for parallel reads?

No. Simultaneous assertion of CS1# and CS2# is undefined and not supported. The device requires strict time-multiplexed access: only one chip select may be active at a time to prevent bus contention and internal state conflict between the two dies.

Is the 2048-byte OTP array shared between both dies or per-die?

The 2048-byte OTP array is implemented once per die - totaling 4096 bytes across the device - with independent locking and programming control. Each die's OTP must be programmed separately using its respective CS# line, and lock bits are not synchronized between dies.

Does the device support XIP (eXecute-In-Place) from SPI flash?

Yes, the S70FL01GSDPMFI013 supports XIP via Quad DDR read mode with low-latency continuous read commands. Its 256-kbyte uniform sector size and fast DDR access enable deterministic instruction fetch timing, validated for use with ARM Cortex-M7 and RISC-V cores in automotive boot applications.