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Infineon Technologies S70FL01GSDPMFV013
- Part No.:
- S70FL01GSDPMFV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSDPMFV013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,270
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Product details
Overview
S70FL01GSDPMFV013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (−40°C to +105°C). It implements two stacked S25FL512S dies for high-density nonvolatile storage in automotive infotainment boot code and ADAS firmware image storage.
For engineers reviewing the S70FL01GSDPMFV013 datasheet, S70FL01GSDPMFV013 pinout, S70FL01GSDPMFV013 application, or S70FL01GSDPMFV013 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, Quad DDR read support, OTP array size (2048 bytes), sector protection granularity, and VIO pin deprecation in this variant.
Technical Context
The S70FL01GSDPMFV013 integrates two independent S25FL512S flash dies in a single package, each with dedicated chip select (CS1# and CS2#), status/configuration registers, and block protection logic. Access is strictly per-die: no cross-die sequential reads or bulk erase commands are supported.
It supports SPI modes 0 and 3, DDR timing, 32-bit extended addressing, and CFI-compliant configuration data. The VIO pin is RFU (not connected internally), and all I/Os operate from the core VCC supply (2.7–3.6 V), eliminating separate I/O voltage rail requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte) total, implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Normal/Fast/Dual/Quad/DDR read modes; no parallel bus |
| Erase granularity | Uniform 256-kbyte sectors; no 4-kbyte blocks or chip-erase command |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at 85°C |
| Supply voltage | VCC = 2.7–3.6 V; VIO not supported - all I/Os referenced to VCC |
| Temperature grade | AEC-Q100 Grade 2: −40°C to +105°C ambient operating range |
| Security features | 2048-byte OTP array; hardware/software block protection; ASP with password control |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball footprint, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Active-low enable for first 512 Mbit die; required to access lower 128 Mbyte address space |
| CS2# | Chip Select 2 | Active-low enable for second 512 Mbit die; required to access upper 128 Mbyte address space |
| SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3 | Multi-I/O bidirectional lines | Support single/dual/quad I/O protocols; IO2/IO3 become functional only in Quad mode |
| RESET# | Hardware reset input | Asynchronous active-low reset with internal pull-up; resets both dies simultaneously |
| VCC, VSS | Power and ground | Single 3.0 V core supply domain; no VIO connection - simplifies PCB power routing |
| DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Internally reserved for test; must remain unconnected or tied to VSS; not for PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die architecture | Two independent S25FL512S dies sharing one BGA package; enables 1 Gbit density without redesigning layout footprint |
| Quad DDR read capability | Up to 1.5 Mbytes/s effective throughput using double-data-rate quad I/O; reduces host CPU wait states during firmware load |
| AutoBoot function | Configurable automatic Normal or Quad read at power-up/reset from preselected address; eliminates host initialization delay for boot code fetch |
| Advanced sector protection (ASP) | Password-controlled individual sector locking; prevents unauthorized firmware overwrite while allowing field updates to unprotected regions |
| CFI-compliant identification | Standardized Common Flash Interface data at known offsets; enables generic flash programming tools to auto-detect geometry and command set |
Applications
| Automotive Infotainment Boot Storage | ADAS Camera Firmware Image |
|---|---|
Use Scenario: Storing primary boot loader and OS kernel for head unit MCU on power-up. IC Role / Device Role / Timing Role: Nonvolatile storage accessed via SPI during cold start; AutoBoot executes Quad read from fixed address within 100 µs of VCC stabilization. Use Value: Eliminates external boot ROM; 20-year data retention ensures firmware integrity over vehicle lifetime. | Use Scenario: Holding calibrated firmware images for surround-view camera ECUs requiring secure field updates. IC Role / Device Role / Timing Role: Dual-die structure allows isolated storage of factory-calibrated vs. field-updated firmware partitions; ASP enforces write-protection on calibration data. Use Value: Enables OTA update of application code without risking corruption of critical calibration parameters. |
| Telematics Control Unit (TCU) Log Buffer | Electric Powertrain Gateway Firmware |
Use Scenario: Persistent storage of encrypted CAN bus diagnostic logs across ignition cycles. IC Role / Device Role / Timing Role: High-endurance flash (100k cycles) supports frequent log writes; OTP array stores encryption keys bound to hardware identity. Use Value: Meets ISO 26262 ASIL-B traceability requirements for safety-critical event logging. | Use Scenario: Storing gateway firmware supporting multiple CAN FD and Ethernet AVB interfaces. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 rating ensures operation at 105°C under hood; dual-die addressing enables modular firmware partitioning (CAN stack, Ethernet stack, security module). Use Value: Reduces BOM count by consolidating multiple smaller flashes into single 1 Gbit device with deterministic access latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFV000 | Single-die 128 Mbyte device; no CS2# or dual-die management; lower density, identical command set | Limited to systems requiring ≤128 Mbyte; no need for die-switching logic or dual-status register handling | Select when firmware size fits in one die and design simplicity outweighs density needs. |
| S70FL01GSAGMFB001 | BGA-24 package with same pinout but Industrial grade (−40°C to +85°C); lacks AEC-Q100 qualification | Not qualified for automotive under-hood or safety-critical modules; suitable for industrial HMIs or medical displays | Select for cost-sensitive industrial designs where automotive qualification is unnecessary. |
Compared with S25FL128SAGMFV000 and S70FL01GSAGMFB001, the S70FL01GSDPMFV013 uniquely delivers automotive-grade 1 Gbit density with dual-die isolation-enabling fault-containment in safety-critical firmware partitions while maintaining full command compatibility with legacy FL-S family designs.
Availability
S70FL01GSDPMFV013 is available at Aetrix Electronics and suitable for automotive infotainment boot storage, ADAS camera firmware image storage, and telematics control unit log buffering requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FL01GSDPMFV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and nonvolatile memory solutions for safety-critical and high-reliability applications.
The FL-S flash product line targets automotive and industrial systems requiring AEC-Q100 qualification, high endurance, and secure firmware storage-designed specifically for boot code, OTA updates, and mission-critical parameter retention.
FAQ
What is the purpose of the CS1# and CS2# pins on the S70FL01GSDPMFV013?
CS1# and CS2# are independent chip select inputs that enable access to the first and second 512 Mbit flash dies respectively. Each die operates autonomously: commands issued with CS1# low affect only the lower 128 Mbyte address space, while CS2# low accesses the upper 128 Mbyte. No cross-die commands (e.g., bulk erase) are supported.
Does the S70FL01GSDPMFV013 support VIO (I/O voltage) separation from VCC?
No. The VIO pin is marked RFU (Reserved for Future Use) and is not connected internally. All I/O signals (SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3) are referenced solely to VCC (2.7–3.6 V). This eliminates the need for a separate I/O voltage rail and simplifies power supply design.
How does AutoBoot function work, and what address is used?
AutoBoot executes a preconfigured Normal or Quad read command automatically after power-up or RESET#. The target address is stored in a dedicated configuration register (CR2[7:0]) and is user-programmable. The feature initiates within 100 µs of VCC reaching valid level, enabling immediate boot code fetch without host CPU intervention.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses. Once a bit is set to '0', it cannot be changed back to '1'. It is intended for storing immutable values such as cryptographic keys, device serial numbers, or calibration constants bound to hardware identity.
S70FL01GSDPMFV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSDPMFV013 FAQ
1.How can I place an order for S70FL01GSDPMFV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSDPMFV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSDPMFV013 reliable?
The price and inventory of S70FL01GSDPMFV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSDPMFV013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSDPMFV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSDPMFV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSDPMFV013?
S70FL01GSDPMFV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSDPMFV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSDPMFV013?
For technical support, including S70FL01GSDPMFV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSDPMFV013 requirements.
6.How does Aetrix verify that S70FL01GSDPMFV013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSDPMFV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSDPMFV013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSDPMFV013?
All S70FL01GSDPMFV013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSDPMFV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSDPMFV013 part is unused and in its original packaging.
Return procedure for S70FL01GSDPMFV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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