Infineon Technologies S70FL01GSDSBHBC13

Overview

S70FL01GSDSBHBC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package and supports Quad DDR read, QPP programming, and AutoBoot at power-up for embedded boot code storage.

For engineers reviewing the S70FL01GSDSBHBC13 datasheet, S70FL01GSDSBHBC13 pinout, S70FL01GSDSBHBC13 application, or S70FL01GSDSBHBC13 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, sector-level erase independence per die, CFI-compliant configuration, and VIO pin RFU status - all critical for automotive infotainment and ADAS firmware storage designs.

Technical Context

The S70FL01GSDSBHBC13 integrates two independent S25FL512S flash dies sharing a common BGA-24 footprint but requiring separate chip select (CS1# and CS2#) control. Each die maintains autonomous status registers, configuration registers, and block protection settings, necessitating discrete command issuance per die for programming, erase, and security register updates.

It supports SPI modes 0 and 3, DDR read operations, extended 32-bit addressing, and Quad I/O commands compatible with S25FL-P family footprints. The device lacks VIO support (VIO/RFU pin is reserved), operates solely from VCC (2.7–3.6 V), and excludes sequential reads across die boundaries without explicit CS switching.

Key Specifications

Pinout & Package

Package: 24-ball BGA, 8 × 6 mm, ZSA024 footprint (5 × 5 ball array), Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Compared with S25FL128SAGMFI000 and S70FL01GSAGMFI000, the S70FL01GSDSBHBC13 uniquely combines AEC-Q100 Grade 2 qualification, BGA-24 footprint, and dual-die independence - making it optimal for space-constrained, high-reliability automotive modules requiring concurrent firmware partitioning.

Availability

S70FL01GSDSBHBC13 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera modules, infotainment head units, and industrial HMI displays requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S70FL01GSDSBHBC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The FL-S flash product line targets high-reliability embedded systems requiring SPI-compatible non-volatile storage with automotive-grade qualification, advanced security, and multi-die scalability.

FAQ

What is the function of CS1# and CS2# on the S70FL01GSDSBHBC13?

CS1# and CS2# are independent chip select inputs that activate the first and second 512 Mbit flash dies respectively. Each die operates autonomously: commands issued with CS1# low affect only die #1, and those with CS2# low affect only die #2. Simultaneous access to both dies is not supported, and cross-die sequential reads require explicit toggling between chip selects.

Does the S70FL01GSDSBHBC13 support VIO voltage scaling?

No. The VIO/RFU pin (Ball B3) is explicitly marked Reserved for Future Use and has no functional connection to internal I/O circuitry. All I/O signaling operates from the VCC supply (2.7–3.6 V) only. This differs from some S25FL-P family members that support dual-supply I/O; design must accommodate single-rail 3.0 V interface logic.

How does AutoBoot work, and can the target address be changed after programming?

AutoBoot executes a preconfigured Normal or Quad read command automatically at power-up or hardware reset from a user-defined starting address stored in configuration registers. That address is programmable via standard SPI write commands and persists across power cycles. It is typically set once during manufacturing to point to the boot header location and remains fixed unless deliberately updated using the device's write-protection unlock sequence.

What happens if the FREEZE bit is set in one die but not the other?

If the FREEZE bit is set to 1 in one die's status register, block protection settings for that die become locked until a power-on-reset occurs on that specific die. The other die remains fully configurable. Since each die has independent status registers, mismatched FREEZE states are allowed but strongly discouraged - inconsistent protection states increase risk of unintended firmware corruption during field updates and violate Infineon's recommendation to maintain identical register settings across both dies.