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Infineon Technologies S70FL01GSDSBHMC13
- Part No.:
- S70FL01GSDSBHMC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSDSBHMC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,940
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Product details
Overview
S70FL01GSDSBHMC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, uniform 256-kbyte sectors, and support for Quad DDR read commands. It implements two stacked S25FL512S dies in a single BGA-24 package and targets boot code storage in industrial and automotive embedded systems requiring high-density nonvolatile storage with AEC-Q100 Grade 2 qualification.
For engineers reviewing the S70FL01GSDSBHMC13 datasheet, S70FL01GSDSBHMC13 pinout, S70FL01GSDSBHMC13 application, or S70FL01GSDSBHMC13 equivalent, key selection considerations include dual-die addressing via CS1#/CS2#, independent status/configuration register management per die, sector erase isolation, and absence of VIO support in this variant.
Technical Context
The S70FL01GSDSBHMC13 integrates two independent 512 Mbit S25FL512S dies sharing a common SOIC/BGA footprint but requiring separate chip select (CS1# and CS2#) activation. Each die maintains its own status register, configuration register, bank address register, and block protection logic - no cross-die command propagation is supported.
It supports SPI modes 0 and 3, DDR read operations, AutoBoot from preselected addresses, and CFI-compliant identification. Programming uses 512-byte page buffers with Quad-input Page Program (QPP); erase is limited to per-die 256-kbyte sector commands - bulk erase across both dies is not implemented.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), realized as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read modes |
| Supply voltage | Core: 2.7–3.6 V; I/O: 1.65–3.6 V; VIO is RFU (not functional) |
| Erase granularity | Uniform 256-kbyte sectors; erase must be issued separately per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C), Industrial Plus qualified |
| Security features | 2048-byte OTP array; hardware/software block protection; Advanced Sector Protection (ASP) |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates first 512 Mbit die; required for all operations targeting die #1 |
| CS2# | Chip Select 2 | Activates second 512 Mbit die; required for all operations targeting die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad-mode data line 0; internal pull-up enabled |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad-mode data line 1; internal pull-up enabled |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer in single/dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Drives SPI timing; supports up to 133 MHz in DDR mode |
| RESET# | Hardware Reset | Asynchronous reset to standby state; internal pull-up; optional connection |
| VCC | Core Power Supply | 2.7–3.6 V supply for flash core and logic; decoupling required |
| VSS | Ground | Reference ground for core and I/O circuits |
| DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Reserved for test or internal use; must not connect to host signals or PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package enable 1 Gbit density while maintaining pin compatibility with 512 Mbit variants |
| Independent die control | Each die has dedicated CS#, status/config registers, and sector protection - enables selective update or redundancy management |
| Quad DDR read capability | Enables up to 2× throughput vs. SDR in high-speed boot code fetch scenarios without increasing clock frequency |
| AutoBoot function | Automatically executes Normal or Quad read at power-up/reset from user-configurable address - reduces host firmware initialization overhead |
| Advanced Sector Protection (ASP) | Supports individual sector locking via boot code or password, enabling secure firmware partitioning and field update safety |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver-assist firmware, and OTA update staging area in AEC-Q100 Grade 2 qualified head unit. IC Role / Device Role / Timing Role: Nonvolatile boot memory with AutoBoot execution and ASP-protected critical calibration sectors. Use Value: Enables deterministic boot within 100 ms after power-on and prevents unauthorized modification of safety-critical display assets. | Use Scenario: Holding ladder logic runtime images, configuration databases, and firmware rollback partitions in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: Dual-die SPI flash providing isolated storage domains for active/fallback firmware images. Use Value: Allows atomic firmware swap by programming one die while executing from the other - zero-downtime updates. |
| Medical Imaging Boot Loader | Telecom Baseband Processor Code Storage |
Use Scenario: Hosting verified boot loader and cryptographic keys for MRI subsystem processors operating in −40°C to +85°C ambient. IC Role / Device Role / Timing Role: Secure, long-retention boot memory with OTP key storage and hardware write protection. Use Value: Meets IEC 62304 Class C software lifecycle requirements via 20-year data retention and tamper-resistant sector locking. | Use Scenario: Storing DSP microcode, calibration tables, and protocol stacks for 5G small cell baseband SoCs. IC Role / Device Role / Timing Role: High-bandwidth Quad DDR flash supporting burst reads during real-time signal processing startup. Use Value: Delivers >100 MB/s effective read bandwidth to eliminate boot latency bottlenecks in time-sensitive radio stack initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI000 | Single 512 Mbit die; no CS2#; identical command set and pinout except missing CS2# and associated DNU pins | Limited to half the density; no dual-die redundancy or independent die update capability | Select when 512 Mbit suffices and board layout rework for CS2# routing is undesirable |
| S70FL01GSAGMFI000 | Same dual-die architecture but in 16-lead SOIC package; lacks BGA thermal performance and board space efficiency | Higher thermal resistance; unsuitable for high-power-density automotive modules with strict footprint constraints | Select only for legacy SOIC-based designs where BGA rework is prohibited |
Compared with S25FL512SAGMFI000 and S70FL01GSAGMFI000, the S70FL01GSDSBHMC13 uniquely delivers 1 Gbit density in a thermally optimized BGA package with dual independent chip selects - essential for fail-safe firmware architectures and space-constrained automotive ECUs.
Availability
S70FL01GSDSBHMC13 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging subsystems, and telecom baseband modules requiring stable component supply with AEC-Q100 Grade 2 qualification and long-term lifecycle support.
Supply support for S70FL01GSDSBHMC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The FL-S family targets high-reliability embedded systems requiring SPI flash with extended temperature operation, security features, and multi-die scalability - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 compliance and 20-year data retention.
FAQ
Does S70FL01GSDSBHMC13 support simultaneous read/write across both dies?
No. The device requires sequential access: CS1# must be asserted to operate on die #1, and CS2# for die #2. Simultaneous programming or reading across dies is not supported due to shared I/O bus and independent status register architecture - each die must be addressed individually.
Is VIO pin functional on this part?
No. The VIO pin is marked RFU (Reserved for Future Use) and is not connected internally. Per Section 7 of the datasheet, VIO is not supported in the S70FL01GS series - all I/O signaling operates from the core VCC supply range (2.7–3.6 V).
Can AutoBoot execute from either die?
Yes. AutoBoot is configurable per die via the Configuration Register. The host can set separate AutoBoot addresses for die #1 (using CS1#) and die #2 (using CS2#), enabling flexible dual-image boot strategies such as primary/backup or A/B firmware partitioning.
What happens if FREEZE bit is set in one die but not the other?
The FREEZE bit operates independently per die. If set to 1 in die #1, its block protection settings become locked until power-on-reset; die #2 remains modifiable. This allows asymmetric protection states - e.g., locking calibration sectors in die #1 while keeping application update sectors in die #2 writable.
S70FL01GSDSBHMC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSDSBHMC13 FAQ
1.How can I place an order for S70FL01GSDSBHMC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSDSBHMC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSDSBHMC13 reliable?
The price and inventory of S70FL01GSDSBHMC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSDSBHMC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSDSBHMC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSDSBHMC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSDSBHMC13?
S70FL01GSDSBHMC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSDSBHMC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSDSBHMC13?
For technical support, including S70FL01GSDSBHMC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSDSBHMC13 requirements.
6.How does Aetrix verify that S70FL01GSDSBHMC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSDSBHMC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSDSBHMC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSDSBHMC13?
All S70FL01GSDSBHMC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSDSBHMC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSDSBHMC13 part is unused and in its original packaging.
Return procedure for S70FL01GSDSBHMC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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