Infineon Technologies S70FL01GSDSMFB010
- Part No.:
- S70FL01GSDSMFB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSDSMFB010.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,478
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Product details
Overview
S70FL01GSDSMFB010 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase granularity. It supports Normal/Fast/Dual/Quad/DDR read modes, 512-byte page programming, and delivers 1.5 Mbytes/s write and 0.5 Mbytes/s erase throughput. Used in industrial and automotive boot code storage where high-density serial flash with AEC-Q100 Grade 2 qualification is required.
For engineers reviewing the S70FL01GSDSMFB010 datasheet, S70FL01GSDSMFB010 pinout, S70FL01GSDSMFB010 application, or S70FL01GSDSMFB010 equivalent, key selection criteria include dual-die addressing behavior, independent CS1#/CS2# control per die, Quad I/O timing compliance, OTP array size (2048 bytes), and AEC-Q100 Grade 2 (−40°C to +105°C) qualification for automotive ECUs.
Technical Context
The S70FL01GSDSMFB010 implements a dual-die stack of two S25FL512S 512 Mbit dies sharing one SOIC-16 package, each with independent status/configuration registers, sector protection, and chip select lines (CS1# and CS2#). It requires separate command issuance per die for programming, erase, and register access.
It supports SPI modes 0 and 3, DDR read/write, 32-bit extended addressing, and AutoBoot from preselected address on power-up/reset. VIO is RFU - only VCC (2.7–3.6 V) and VSS are active supplies; all I/O pins tolerate 1.65–3.6 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Single/Dual/Quad/DDR read and Quad-input page programming |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance | 100,000 program-erase cycles minimum per sector |
| Data retention | 20 years minimum at +85°C |
| Operating temperature | AEC-Q100 Grade 2: −40°C to +105°C |
| Security features | 2048-byte OTP array; hardware/software block protection; advanced sector protection (ASP) |
Pinout & Package
Package: 16-lead SOIC (300 mils), Pb-free, industrial+ and automotive qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Active-low enable for first 512 Mbit die; must be asserted to access Die 1 |
| CS2# | Chip Select 2 | Active-low enable for second 512 Mbit die; must be asserted to access Die 2 |
| SCK | Serial Clock | Input clock for SPI interface; supports up to 80 MHz SDR / 40 MHz DDR |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; internal pull-up enabled when unused |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; internal pull-up enabled when unused |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in single/dual mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/dual mode; IO3 in Quad mode; internal pull-up |
| RESET# | Hardware Reset | Active-low reset; internal pull-up; resets both dies simultaneously |
| VCC | Core Supply | 2.7–3.6 V core power; powers logic and memory arrays |
| VSS | Ground | Digital ground reference for all signals and supplies |
| NC | No Connect | Unbonded pin; safe for PCB routing but no voltage > VCC allowed |
| DNU | Do Not Use | Reserved for test; internal pull-down; must not connect to host signals |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die architecture | Two independent S25FL512S dies in single SOIC-16 package, enabling 1 Gbit density without wider bus or parallel interface |
| Independent die control | Separate CS1#/CS2#, status/config registers, and erase/program commands per die - avoids cross-die interference |
| AutoBoot functionality | Executes Normal or Quad read automatically at power-up/reset from user-configurable address - reduces boot firmware complexity |
| Common Flash Interface (CFI) | Provides standardized configuration data (e.g., geometry, timing) for host bootloader auto-detection and initialization |
| Advanced Sector Protection (ASP) | Enables individual sector lock/unlock via boot code or password - supports secure firmware update partitioning |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware in engine control units requiring AEC-Q100 Grade 2 operation. IC Role / Device Role / Timing Role: Non-volatile boot memory accessed via Quad SPI during cold start; AutoBoot executes read from fixed address within 100 µs of VCC stabilization. Use Value: Dual-die layout enables 1 Gbit density in legacy SOIC footprint, avoiding PCB redesign while meeting ASIL-B firmware integrity requirements. | Use Scenario: Holds field-upgradable firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: SPI flash used for XIP-capable firmware execution; Quad DDR reads deliver >40 MB/s effective bandwidth for deterministic task loading. Use Value: 20-year data retention and 100K-cycle endurance ensure reliable operation over 15+ year product lifecycles without field replacement. |
| Medical Imaging System Code Storage | Smart Grid RTU Configuration Memory |
Use Scenario: Stores diagnostic firmware and calibration tables in portable ultrasound devices requiring extended temperature range and low-power standby. IC Role / Device Role / Timing Role: Low-power SPI flash with deep power-down mode (10 µA typical); accessed via Fast Quad Read during system wake-up. Use Value: Industrial Plus grade (−40°C to +105°C) supports battery-powered operation in uncontrolled ambient conditions without thermal derating. | Use Scenario: Retains time-sync parameters, communication profiles, and fault logs in remote terminal units deployed in outdoor substations. IC Role / Device Role / Timing Role: Secure non-volatile memory with OTP array storing cryptographic keys and ASP-protected configuration sectors. Use Value: Hardware-based block protection prevents accidental overwrite during OTA updates, ensuring grid protocol compliance and auditability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | Single-die 128 Mbyte SPI flash; no dual-die stack; identical SOIC-16 pinout and command set | Limited to 128 Mbyte density; lacks AutoBoot and ASP features; suitable for cost-sensitive non-automotive designs | Select when full 1 Gbit density and AEC-Q100 Grade 2 are unnecessary |
| MX25L1G45GMI-12G | 1 Gbit single-die SPI flash; supports octal DTR mode; different pinout (8-pin WSON); no CS2# or dual-die management | Higher bandwidth (120 MHz DTR) but incompatible addressing model; no independent die control or CFI support | Select for space-constrained designs needing higher throughput, not dual-die consistency or automotive qualification |
Compared with S25FL128SAGMFI000, the S70FL01GSDSMFB010 provides 8× density and automotive qualification but requires explicit dual-die command sequencing; versus MX25L1G45GMI-12G, it offers pin-compatible SOIC-16 upgrade path and robust sector protection, at the cost of lower peak bandwidth.
Availability
S70FL01GSDSMFB010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and medical imaging system production requiring stable component supply with AEC-Q100 Grade 2 qualification and long-term lifecycle support.
Supply support for S70FL01GSDSMFB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions, with global manufacturing and quality certifications including IATF 16949.
The FL-S family targets high-reliability embedded systems requiring SPI flash with extended temperature operation, security features, and automotive qualification - designed specifically for boot code, firmware, and configuration storage in safety-critical applications.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSDSMFB010?
CS1# and CS2# are independent active-low chip select inputs that enable access to the first and second 512 Mbit die respectively. Both cannot be asserted simultaneously; each die operates autonomously with its own status register, configuration register, and sector protection settings. This dual-select architecture allows seamless 1 Gbit addressing while maintaining die-level isolation for reliability.
Does the S70FL01GSDSMFB010 support true 32-bit addressing across both dies?
No - the device uses two independent 27-bit address spaces (128 Mbyte each), mapped separately under CS1# and CS2#. Sequential reads across die boundaries require explicit switching between chip selects; there is no hardware-assisted wraparound or unified 32-bit linear address bus. The CFI reports total density but does not enable transparent cross-die addressing.
Can the OTP array be reprogrammed after initial programming?
No - the 2048-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses; bits can only be changed from '1' to '0', and no erase mechanism exists. It is intended for immutable data such as cryptographic keys, device identifiers, or calibration constants that must survive field updates and power cycles.
Is VIO pin functional on the S70FL01GSDSMFB010?
No - the VIO pin is marked RFU (Reserved for Future Use) and has no internal connection. The device operates solely from VCC (2.7–3.6 V) for core and I/O functions; all I/O pins are 1.65–3.6 V tolerant. Designers must leave VIO unconnected or tie it to VSS per Infineon's recommendation - it must not be driven by external circuitry.
S70FL01GSDSMFB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSDSMFB010 FAQ
1.How can I place an order for S70FL01GSDSMFB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSDSMFB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSDSMFB010 reliable?
The price and inventory of S70FL01GSDSMFB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSDSMFB010 is usually 5 days.
3.What payment methods are accepted for S70FL01GSDSMFB010?
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S70FL01GSDSMFB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSDSMFB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSDSMFB010?
For technical support, including S70FL01GSDSMFB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSDSMFB010 requirements.
6.How does Aetrix verify that S70FL01GSDSMFB010 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSDSMFB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSDSMFB010 meets industry standards.
7.What is the process for return or replacement of S70FL01GSDSMFB010?
All S70FL01GSDSMFB010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSDSMFB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSDSMFB010 part is unused and in its original packaging.
Return procedure for S70FL01GSDSMFB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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