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Infineon Technologies S70FL01GSDSMFB013
- Part No.:
- S70FL01GSDSMFB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSDSMFB013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,379
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Product details
Overview
S70FL01GSDSMFB013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O Flash memory with 3.0 V core supply, uniform 256-kbyte sectors, and support for Normal/Fast/Dual/Quad/DDR read modes. It implements two independent S25FL512S die stacked in one package, each with dedicated CS#1/CS#2, enabling discrete die addressing in embedded boot and firmware storage applications.
For engineers reviewing the S70FL01GSDSMFB013 datasheet, S70FL01GSDSMFB013 pinout, S70FL01GSDSMFB013 application, or S70FL01GSDSMFB013 equivalent, key selection considerations include dual-die address management, sector erase independence per die, Quad I/O timing compliance, and AEC-Q100 Grade 2 (−40°C to +105°C) automotive qualification.
Technical Context
The device uses Infineon's 65 nm MirrorBit® Flash technology with Eclipse™ architecture and features two physically separate FL512S dies sharing a single BGA-24 or SOIC-16 package. Each die has independent status/configuration registers, bank address control, and block protection logic, requiring separate command issuance via CS#1 or CS#2.
It supports extended 32-bit addressing, AutoBoot from preselected address on power-up/reset, and Common Flash Interface (CFI) data for runtime configuration discovery. VIO is RFU - I/O voltage is tied to VCC (2.7–3.6 V), eliminating need for dual-supply routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Quad and DDR modes; compatible with S25FL-P family footprint |
| Read speed | Up to Quad DDR mode; supports sequential reads only within same die |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance & retention | 100,000 program-erase cycles; 20-year data retention at max operating temperature |
| Supply voltage | VCC = 2.7–3.6 V; no VIO supply required (VIO/RFU pin unused) |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C); industrial and automotive qualified |
Pinout & Package
Package: 24-ball BGA (ZSA024), 8 × 6 mm, 5 × 5 ball array, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; must be asserted to access Die #1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; must be asserted to access Die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; internal pull-up enabled |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; internal pull-up enabled |
| WP#/IO2 | Write Protect / IO2 | Hardware write protect in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Edge-triggered clock input; supports SDR and DDR timing modes |
| RESET# | Hardware Reset | Active-low reset with internal pull-up; returns device to standby state |
| VCC | Core Power Supply | 2.7–3.6 V supply for core and I/O; no separate VIO required |
| VSS | Ground | Reference ground for all signals and power domains |
| DNU pins (A1, A2, B1, B2, C1, C2, D1, D2, E1, E2) | Do Not Use | Reserved for test; internal pull-down; must not connect to host signals or PCB traces |
| RFU pins (B3, C3, D3) | Reserved for Future Use | No internal connection; avoid routing PCB traces to preserve future compatibility |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies in one package, each with dedicated CS#, enabling scalable firmware partitioning |
| AutoBoot execution | Executes Normal or Quad Read automatically at power-up/reset from user-configurable address, reducing boot latency |
| OTP security array | 2048-byte One-Time-Programmable area for secure keys or calibration data, isolated from main array |
| Advanced Sector Protection (ASP) | Individual sector lock via boot code or password; FREEZE bit prevents accidental unlock until power-on-reset |
| CFI-compliant identification | Standardized RDID response with manufacturer ID, device ID, and geometry table (byte 27h = 1Bh) |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Stores boot code, GUI assets, and calibration tables in digital dashboards requiring AEC-Q100 Grade 2 operation. IC Role / Device Role / Timing Role: Primary nonvolatile firmware storage with AutoBoot execution at power-on and Quad DDR read for fast UI rendering. Use Value: Dual-die isolation allows concurrent firmware update of one die while running from the other, minimizing system downtime. |
Use Scenario: Holds field-upgradable ladder logic, I/O mapping, and safety-critical configuration in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability code storage with 100K-cycle endurance and 20-year retention under thermal cycling. Use Value: Independent sector erase per die enables atomic firmware updates without interrupting real-time control execution. |
| Medical Imaging Boot Loader | Avionics Data Recorder |
|
Use Scenario: Stores certified boot loader and diagnostic firmware in FDA-regulated imaging equipment with strict data integrity requirements. IC Role / Device Role / Timing Role: Secure boot source with OTP key storage and ASP-enabled sector locking for regulatory compliance. Use Value: FREEZE bit prevents unauthorized modification of protected sectors until full power cycle, satisfying traceability mandates. |
Use Scenario: Captures flight telemetry and stores black-box logs in DO-160 qualified avionics systems operating across −40°C to +105°C. IC Role / Device Role / Timing Role: Radiation-tolerant, high-endurance flash for cyclic logging with deterministic erase timing (0.5 Mbytes/s). Use Value: Uniform 256-kbyte sectors enable precise wear leveling across 1 Gbit capacity, extending service life in high-write environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | Single-die 128 Mbyte SPI Flash; no dual-CS architecture or AutoBoot; lower density (128 Mbyte vs 128 Mbyte total but split) | Lacks die-level isolation; unsuitable for concurrent read/write or fail-safe firmware swap | Select when simpler single-die interface suffices and dual-die coordination adds unnecessary complexity |
| MX25L1G45GM2I-12G | Monolithic 1 Gbit SPI Flash; supports octal DTR mode; no dual-die management; different CFI layout and OTP structure | Higher bandwidth potential but no built-in redundancy or independent die erase capability | Select when maximum sequential read throughput is prioritized over firmware update safety and sector-level flexibility |
Compared with S25FL128SAGMFI000 and MX25L1G45GM2I-12G, the S70FL01GSDSMFB013 uniquely delivers die-isolated command execution, enabling safe in-field firmware upgrades without halting operation - a critical advantage in automotive and industrial safety systems.
Availability
S70FL01GSDSMFB013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics data recorders requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for S70FL01GSDSMFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The S70FL01GSDSMFB013 belongs to Infineon's FL-S SPI Flash product line, designed specifically for automotive and industrial applications demanding AEC-Q100 qualification, dual-die redundancy, and deterministic firmware update behavior.
FAQ
What is the function of CS1# and CS2# on the S70FL01GSDSMFB013?
CS1# and CS2# are independent chip select inputs that activate Die #1 and Die #2 respectively. Each die operates as a separate 512 Mbit SPI Flash device - commands issued with CS1# low affect only Die #1, and those with CS2# low affect only Die #2. This enables discrete addressing, independent erase/program operations, and simultaneous die management in firmware update schemes.
Does the S70FL01GSDSMFB013 support true 1 Gbit sequential reads across both dies?
No. Sequential reads crossing the boundary between Die #1 and Die #2 are not supported. The device requires explicit switching between CS1# and CS2# to read data spanning both dies. Reads must be segmented: first complete all reads from Die #1 using CS1#, then switch to CS2# for Die #2. This architectural constraint ensures die-level isolation but requires host firmware awareness.
Is VIO required for operation of the S70FL01GSDSMFB013?
No. VIO is marked RFU (Reserved for Future Use) in this device. All I/O signaling operates from the VCC supply (2.7–3.6 V). The VIO/RFU pin must not be connected to any voltage source or signal; it may be left floating or tied to VSS per board layout best practices. This simplifies power design by eliminating dual-supply routing.
How does Advanced Sector Protection (ASP) work on this dual-die device?
ASP operates independently per die. Each die maintains its own ASP register, password register, and PPB lock/access registers. To ensure consistent protection, Infineon recommends identical ASP configuration across both dies. The FREEZE bit, once set to 1, locks protection until a full power-on-reset occurs on that specific die - preventing accidental unlock during runtime.
S70FL01GSDSMFB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSDSMFB013 FAQ
1.How can I place an order for S70FL01GSDSMFB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSDSMFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSDSMFB013 reliable?
The price and inventory of S70FL01GSDSMFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSDSMFB013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSDSMFB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSDSMFB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSDSMFB013?
S70FL01GSDSMFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSDSMFB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSDSMFB013?
For technical support, including S70FL01GSDSMFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSDSMFB013 requirements.
6.How does Aetrix verify that S70FL01GSDSMFB013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSDSMFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSDSMFB013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSDSMFB013?
All S70FL01GSDSMFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSDSMFB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSDSMFB013 part is unused and in its original packaging.
Return procedure for S70FL01GSDSMFB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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