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Infineon Technologies S70FL01GSDSMFV013
- Part No.:
- S70FL01GSDSMFV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL01GSDSMFV013.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,392
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Product details
Overview
S70FL01GSDSMFV013 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase architecture. It implements two stacked S25FL512S dies, supports Quad DDR read modes up to 133 MHz, and delivers 1.5 Mbytes/s programming and 0.5 Mbytes/s erase throughput. Used in industrial embedded controllers requiring high-density nonvolatile storage with AEC-Q100 Grade 2 qualification.
For engineers reviewing the S70FL01GSDSMFV013 datasheet, S70FL01GSDSMFV013 pinout, S70FL01GSDSMFV013 application, or S70FL01GSDSMFV013 equivalent, key selection criteria include dual-die addressing behavior, independent CS1#/CS2# control, OTP array size, sector protection granularity, and VIO pin deprecation in this variant.
Technical Context
The S70FL01GSDSMFV013 integrates two independent 512 Mbit S25FL512S dies in a single package, each with dedicated chip select (CS1#, CS2#), status/configuration registers, and block protection logic. No cross-die sequential reads or bulk erase commands are supported - all operations must be issued per die.
It supports SPI modes 0 and 3, DDR timing, 32-bit extended addressing, and CFI-compliant configuration data. The VIO pin is RFU (not connected internally), and I/O voltage range is fixed to 1.65–3.6 V referenced to VCC only - no separate I/O rail.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with support for Normal/Fast/Dual/Quad/DDR read modes |
| Erase granularity | Uniform 256-kbyte sectors; no full-chip bulk erase - requires separate sector erase per die |
| Endurance | 100,000 program-erase cycles minimum per sector |
| Data retention | 20 years minimum at +85°C |
| Operating temperature | Industrial Plus grade: −40°C to +105°C |
| Supply voltage | VCC = 2.7–3.6 V; VIO not supported - I/O referenced to VCC only |
Pinout & Package
Package: 16-lead SOIC (300 mils), Pb-free, industrial plus temperature grade (−40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to issue commands to Die #1 |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to issue commands to Die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; used for command/address/data input in all modes |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; used for data output in all read modes |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; becomes IO2 in Quad mode |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer; becomes IO3 in Quad mode |
| SCK | Serial Clock | Drives clock for all SPI transactions; supports up to 133 MHz in DDR mode |
| RESET# | Hardware Reset | Asynchronous active-low reset; internal pull-up allows floating if unused |
| VCC | Core Power Supply | 2.7–3.6 V supply powering core logic and memory array |
| VSS | Ground | Reference ground for all signals and power domains |
| NC | No Connect | Unbonded pin; safe for PCB routing but must not exceed VCC voltage |
| DNU | Do Not Use | Reserved for test; internal pull-down; must remain unconnected in host system |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent S25FL512S dies enable 1 Gbit density while maintaining pin compatibility with 512 Mbit family |
| Independent die control | Separate CS1#/CS2#, status/config registers, and block protection per die prevent unintended cross-die operation |
| Quad DDR read capability | Enables 133 MHz effective clock rate and >266 MB/s peak read bandwidth using double-data-rate on four I/O lines |
| OTP security array | 2048-byte one-time-programmable area for secure boot keys or calibration data, isolated from main array |
| Advanced sector protection | Configurable top/bottom sector locking via TBPROT/BPNV bits and freeze-enabled permanent lock per die |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Image |
|---|---|
Use Scenario: Stores boot firmware and safety-critical configuration for radar processing units in AEC-Q100 Grade 2 ADAS ECUs. IC Role / Device Role / Timing Role: Nonvolatile boot memory accessed during cold start; supports AutoBoot from preselected address on power-up. Use Value: Dual-die isolation ensures firmware integrity across die boundaries; 20-year retention meets automotive lifecycle requirements. | Use Scenario: Holds field-upgradable firmware and real-time task scheduler code in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Primary code storage executing from XIP-capable SPI interface; leverages Quad DDR mode for low-latency instruction fetch. Use Value: 100K-cycle endurance supports frequent firmware updates; industrial plus temperature rating ensures reliability in cabinet environments up to +105°C. |
| Medical Imaging System Configuration | Telecom Baseband Processor Code |
Use Scenario: Stores calibration profiles, sensor compensation tables, and regulatory compliance metadata in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure parameter storage with OTP array for immutable calibration keys; uses block protection to prevent accidental overwrite. Use Value: 2048-byte OTP space enables cryptographic key binding; ASP and password-controlled sector locking enforce HIPAA-aligned data integrity. | Use Scenario: Hosts baseband processor microcode and protocol stack binaries in 5G small cell radio units operating in outdoor enclosures. IC Role / Device Role / Timing Role: High-bandwidth code execution memory interfaced via SPI Multi-I/O; relies on simultaneous die read optimization for burst loading. Use Value: 1.5 Mbytes/s programming speed reduces field upgrade time; dual-die architecture provides redundancy path for critical boot images. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI000 | Single 512 Mbit die; no CS2# pin; identical command set and timing | Lacks dual-die capacity and independent die control; unsuitable for 1 Gbit contiguous image storage | Select when density requirement ≤512 Mbit and board layout lacks space for dual-CS routing |
| S70FL01GSAGMFI001 | Same dual-die architecture but in BGA-24 (ZSA024) package; identical electrical specs | Different mechanical footprint and thermal profile; no SOIC pinout compatibility | Select when PCB design targets BGA packaging and higher I/O density is needed for routing efficiency |
Compared with S25FL512SAGMFI000, the S70FL01GSDSMFV013 doubles density and adds die-select isolation; compared with S70FL01GSAGMFI001, it offers SOIC manufacturability and thermal performance suited for convection-cooled industrial modules.
Availability
S70FL01GSDSMFV013 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply with AEC-Q100 Grade 2 qualification and long-term data retention.
Supply support for S70FL01GSDSMFV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and R&D infrastructure.
The FL-S SPI flash product line targets high-reliability embedded systems requiring fast read speeds, robust security features, and automotive-grade qualification - optimized for code storage and XIP execution in resource-constrained environments.
FAQ
Is S70FL01GSDSMFV013 pin-compatible with S25FL512S series devices?
Yes, it shares the same 16-lead SOIC footprint and signal mapping, including SI/IO0, SO/IO1, WP#/IO2, HOLD#/IO3, CS1#, and SCK. However, CS2# is an additional dedicated pin for the second die, and NC/DNU pins differ in placement per datasheet Figure 1. Board-level compatibility requires verification of CS2# routing and DNU pin isolation.
Does this device support true single-command 1 Gbit bulk erase?
No. Due to its dual-die construction, bulk erase must be executed separately on each 512 Mbit die using CS1# and CS2#. There is no hardware mechanism to trigger simultaneous erase across both dies with one command - software must sequence two independent bulk erase operations.
What is the function of the VIO pin on this part?
The VIO pin is marked RFU (Reserved for Future Use) and is not connected internally. Section 7 of the datasheet confirms VIO is unsupported in S70FL01GS devices. All I/O signaling references VCC only, and the pin must be left unconnected or tied to VSS per DNU handling guidelines - it does not provide independent I/O voltage control.
Can AutoBoot execute from addresses spanning both dies?
No. AutoBoot initiates a Normal or Quad read from a single preselected address within one die's address space. Because sequential reads across die boundaries are unsupported, AutoBoot cannot span the 512 Mbyte boundary between Die #1 (0x00000000–0x07FFFFFF) and Die #2 (0x08000000–0x0FFFFFFF); boot code must reside entirely within one die.
S70FL01GSDSMFV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL01GSDSMFV013 FAQ
1.How can I place an order for S70FL01GSDSMFV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSDSMFV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSDSMFV013 reliable?
The price and inventory of S70FL01GSDSMFV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSDSMFV013 is usually 5 days.
3.What payment methods are accepted for S70FL01GSDSMFV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSDSMFV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSDSMFV013?
S70FL01GSDSMFV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSDSMFV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSDSMFV013?
For technical support, including S70FL01GSDSMFV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSDSMFV013 requirements.
6.How does Aetrix verify that S70FL01GSDSMFV013 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSDSMFV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSDSMFV013 meets industry standards.
7.What is the process for return or replacement of S70FL01GSDSMFV013?
All S70FL01GSDSMFV013 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSDSMFV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSDSMFV013 part is unused and in its original packaging.
Return procedure for S70FL01GSDSMFV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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