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Infineon Technologies S70FL256P0XMFI001
- Part No.:
- S70FL256P0XMFI001
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL256P0XMFI001.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,523
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Product details
Overview
S70FL256P0XMFI001 from Cypress Semiconductor is a 256-Mbit (32 MB) dual-die stacked SPI flash memory operating from 2.7–3.6 V, featuring uniform 64 kB and 256 kB sectors, 256-byte page programming, and Quad I/O FAST_READ at 80 MHz (40 MB/s effective). It supports simultaneous die-select via CS1# and CS2#, and includes OTP area, CFI compliance, and JEDEC-standard device ID for system identification in embedded boot code storage.
For engineers reviewing the S70FL256P0XMFI001 datasheet, S70FL256P0XMFI001 pinout, S70FL256P0XMFI001 application, or S70FL256P0XMFI001 equivalent, key selection considerations include dual-die addressing constraints, sector/sub-sector erase command mapping per die, W#/ACC voltage acceleration support, and migration path to S25FL256S for new designs.
Technical Context
The S70FL256P implements a dual-die stack of two S25FL129P Flash dies sharing a common SPI interface but requiring independent chip select (CS1# and CS2#) activation. Each die maintains its own Status Register, Configuration Register, and Block Protection bits - no cross-die sequential read or bulk erase is supported.
It supports four I/O modes: standard single I/O, Dual I/O (20 MB/s), Quad I/O (40 MB/s), and Quad Page Programming. Memory protection relies on BP2–BP0 bits plus W#/ACC pin assertion, and factory-programmable OTP space enables secure device identification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB), implemented as two independent 128-Mbit dies |
| Supply Voltage | 2.7–3.6 V - supports wide-input industrial power rails without external regulation |
| Read Speed | Quad I/O FAST_READ: 80 MHz clock → 40 MB/s effective throughput |
| Page Program Time | 1.5 ms typical per 256-byte page - defines minimum write latency per page |
| Erase Granularity | 4 kB sub-sectors (for 64 kB uniform sectors), 64 kB/256 kB sectors, and per-die bulk erase |
| Cycling Endurance | 100,000 program/erase cycles per sector - determines field lifetime in firmware update scenarios |
| Data Retention | 20 years typical at 25°C - qualifies for long-life industrial and automotive control applications |
Pinout & Package
Available in two industry-standard packages: 16-pin SOIC (300-mil body width) and 24-ball BGA (6 × 8 mm, 5 × 5 pin configuration). Pin functions are identical across packages; DNC pins are reserved and must remain unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1#, CS2# | Dual Chip Select Inputs | Selects first or second Flash die independently; both must be managed separately in software |
| SO/IO1, SI/IO0 | Serial I/O Bidirectional Pins | Support single/dual/quad I/O modes; IO0/IO1 become bidirectional in multi-I/O configurations |
| W#/ACC/IO2 | Write Protect / Acceleration Input / Quad I/O | Enables 9V ACC programming when pulled high; provides hardware write lock and quad-mode data path |
| HOLD#/IO3 | Communication Hold / Quad I/O | Pauses ongoing SPI transfer without deselecting device; serves as fourth I/O in quad mode |
| SCK | Serial Clock Input | Drives all timing-critical operations: latches input on rising edge, outputs data on falling edge |
| VCC, VSS | Power Supply and Ground | Single 2.7–3.6 V supply; decoupling required per JEDEC layout guidelines for stable high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Die Stack Architecture | Two independent S25FL129P dies sharing one SPI bus - doubles density without increasing interface count |
| Quad I/O FAST_READ | 40 MB/s effective bandwidth - enables fast boot image loading and real-time firmware streaming |
| Per-Die Status & Config Registers | Independent register sets per die - requires explicit software management for consistent behavior across both dies |
| Factory-Programmable OTP Area | One-time programmable space per die - supports secure serial number, calibration data, or cryptographic key storage |
| CFI Compliance | JEDEC-standard Common Flash Interface - allows host bootloader to auto-detect geometry and command set |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Code |
|---|---|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped via SPI; accessed during cold start and OTA updates. Use Value: 20-year data retention and 100K-cycle endurance ensure reliable operation over 15+ year equipment lifetimes. | Use Scenario: Holding boot loader and safety-critical display firmware in digital instrument clusters compliant with ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: Primary SPI flash for secure boot ROM execution and signed firmware validation. Use Value: CFI compliance enables automatic geometry detection by bootloader; OTP area stores immutable root-of-trust keys. |
| Medical Imaging System Parameter Tables | Networking Equipment Configuration Storage |
Use Scenario: Persisting calibrated sensor parameters and user-defined imaging profiles in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power configuration store accessed intermittently during device initialization and profile switching. Use Value: Deep power-down current of 6 µA minimizes standby drain in battery-backed systems. | Use Scenario: Storing switch/router configuration, MAC address tables, and firmware overlays in enterprise Ethernet switches. IC Role / Device Role / Timing Role: High-reliability SPI flash supporting concurrent read/write via dual-die addressing during failover events. Use Value: Independent CS1#/CS2# control enables parallel access to separate configuration partitions without bus contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256S | Successor device with enhanced security features, higher speed (133 MHz FAST_READ), and updated CFI structure | Designed for new designs requiring longer product lifecycle and extended qualification | Select for all new projects; migration requires minor register and timing adjustments per AN98592 |
| S25FL128S | Single-die 128-Mbit variant with identical command set and pinout, but half capacity and no dual-CS architecture | Used where density requirements are lower and die-stacking complexity is unnecessary | Choose when cost sensitivity outweighs need for 256-Mbit density and dual-die flexibility |
Compared with S70FL256P0XMFI001, the S25FL256S offers higher performance and active lifecycle support, while the S25FL128S simplifies design by removing dual-die management overhead - both eliminate obsolescence risk present in the discontinued S70FL256P series.
Availability
S70FL256P0XMFI001 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot code, medical imaging parameter tables, and networking equipment configuration storage requiring stable component supply despite end-of-life status.
Supply support for S70FL256P0XMFI001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets.
The S70FL256P belongs to the FL-Series SPI flash product line, engineered for high-density, low-power, and CFI-compliant embedded boot and firmware storage in resource-constrained systems.
FAQ
Is S70FL256P0XMFI001 still recommended for new designs?
No. Cypress explicitly states this part is "Not Recommended for New Design" and designates S25FL256S as the factory-recommended migration path. The S25FL256S offers improved speed, security, and ongoing lifecycle support, with migration guidance provided in Application Note AN98592.
How does dual-die operation affect firmware update routines?
Firmware updates require explicit per-die management: sector erase, page program, and status polling must be issued separately to CS1# and CS2#. Sequential reads across die boundaries are not supported - software must handle die boundary crossing manually by switching chip selects.
What is the function of the W#/ACC pin beyond write protection?
The W#/ACC pin enables 9V acceleration voltage for faster programming (reducing page program time). When driven high at 8.5–9.5 V, it activates accelerated programming mode. In Quad I/O mode, it also serves as IO2, expanding data path width to four lines.
Can the OTP area be reprogrammed after initial programming?
No. The OTP (One-Time Programmable) area is permanently locked after programming. Each die contains its own OTP space, and once programmed and locked - either at factory or by the customer - the contents cannot be altered or erased, ensuring immutable identification or security keys.
S70FL256P0XMFI001 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL256P0XMFI001 FAQ
1.How can I place an order for S70FL256P0XMFI001 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL256P0XMFI001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL256P0XMFI001 reliable?
The price and inventory of S70FL256P0XMFI001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL256P0XMFI001 is usually 5 days.
3.What payment methods are accepted for S70FL256P0XMFI001?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL256P0XMFI001 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL256P0XMFI001?
S70FL256P0XMFI001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL256P0XMFI001 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL256P0XMFI001?
For technical support, including S70FL256P0XMFI001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL256P0XMFI001 requirements.
6.How does Aetrix verify that S70FL256P0XMFI001 is sourced from the original manufacturer or authorized distributors?
All S70FL256P0XMFI001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL256P0XMFI001 meets industry standards.
7.What is the process for return or replacement of S70FL256P0XMFI001?
All S70FL256P0XMFI001 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL256P0XMFI001, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL256P0XMFI001 part is unused and in its original packaging.
Return procedure for S70FL256P0XMFI001:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FL256P0XMFI001 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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