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Infineon Technologies S70FL256P0XMFI003
- Part No.:
- S70FL256P0XMFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FL256P0XMFI003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,900
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Product details
Overview
S70FL256P0XMFI003 from Cypress Semiconductor is a 256-Mbit dual-die stacked SPI flash memory operating from 2.7–3.6 V, featuring uniform 64 kB and 256 kB sectors, 256-byte page programming (1.5 ms typ), and quad I/O FAST_READ at 80 MHz (40 MB/s effective). It supports simultaneous die-select via CS1# and CS2#, and includes OTP area, CFI compliance, and JEDEC-standard device ID for embedded boot and firmware storage applications.
For engineers reviewing the S70FL256P0XMFI003 datasheet, S70FL256P0XMFI003 pinout, S70FL256P0XMFI003 application, or S70FL256P0XMFI003 equivalent, key selection considerations include dual-die addressing constraints, sector protection granularity (4/64/256 kB), W#/ACC acceleration voltage (9 V), deep power-down current (6 µA typ), and migration path to S25FL256S.
Technical Context
The S70FL256P implements a dual-die stack of two S25FL129P Flash dies, each independently controlled via dedicated chip selects (CS1# and CS2#). No cross-die sequential reads or bulk erase are supported - all operations (program, erase, status/config register access) must be issued per die.
It uses MirrorBit® 0.09 µm process technology and supports SPI-compatible serial interface modes: standard (40 MHz), FAST_READ (104 MHz), DUAL I/O (20 MB/s), and QUAD I/O (40 MB/s). Memory protection relies on per-die Status Register BP2–BP0 bits and W#/ACC pin assertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (dual 128-Mbit die stack) |
| Supply Voltage | 2.7–3.6 V - enables direct integration with 3.3 V logic without level shifting |
| Page Program Time | 1.5 ms typical - defines minimum write latency per 256-byte page |
| Quad I/O Read Rate | 80 MHz clock / 40 MB/s effective - doubles bandwidth vs dual I/O in firmware fetch |
| Deep Power-Down Current | 6 µA typical - critical for battery-backed systems requiring ultra-low standby drain |
| Cycling Endurance | 100,000 program/erase cycles per sector - determines field lifetime for firmware update partitions |
| Data Retention | 20 years typical - qualifies for long-lifecycle industrial control and medical firmware storage |
Pinout & Package
Available in two industry-standard packages: 16-pin SO (300-mil body width) and 24-ball BGA (6 × 8 mm, 5 × 5 pin configuration). Pin functions are identical across packages; ball/pin numbering differs per mechanical layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1#, CS2# | Dual Die Chip Selects | Selects first or second 128-Mbit die independently; required for all commands |
| SO/IO1, SI/IO0 | Serial I/O (Dual/Quad Mode) | Bi-directional data lines; support single/dual/quad I/O read/write protocols |
| W#/ACC/IO2 | Write Protect / Acceleration Input | Enables hardware block protection when low; accepts 9 V for accelerated programming |
| HOLD#/IO3 | Communication Hold / Quad I/O | Pauses ongoing transfers without deselecting; functions as IO3 in quad mode |
| SCK | Serial Clock Input | Drives timing for command/address/data latching (rising edge) and output (falling edge) |
| VCC, VSS | Power Supply / Ground | Single 2.7–3.6 V supply; no separate I/O voltage required |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Die Stack Architecture | Two independent S25FL129P dies sharing one package - enables 256 Mbit density while retaining 128-Mbit die-level command compatibility |
| Flexible Sector Protection | Per-die BP2–BP0 bits + W#/ACC pin allow selective locking of 4 kB sub-sectors, 64 kB sectors, or 256 kB sectors |
| Accelerated Programming | 9 V applied to W#/ACC pin reduces page program time - critical for high-throughput firmware updates |
| OTP Identification Area | Factory- or customer-programmable one-time programmable region per die - supports secure device binding and traceability |
| CFI Compliance | Common Flash Interface tables enable automatic host detection and configuration - simplifies bootloader portability across flash vendors |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Code |
|---|---|
Use Scenario: Storing firmware images and configuration data in programmable logic controllers with extended temperature operation and long service life. IC Role / Device Role / Timing Role: Non-volatile boot memory providing reliable code execution after cold start and brown-out recovery. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over 15+ years of unattended operation. | Use Scenario: Holding boot loader and safety-critical OS kernel in head unit ECUs where fast read performance and security are mandatory. IC Role / Device Role / Timing Role: Primary SPI flash for secure, authenticated boot sequence with quad I/O acceleration. Use Value: 40 MB/s quad read rate reduces boot time by >35% vs standard SPI; OTP area enables cryptographic key binding. |
| Medical Imaging System Configuration | Network Router Firmware Repository |
Use Scenario: Storing calibration profiles, user preferences, and regulatory-compliant audit logs in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Parameter and configuration store with tamper-resistant protection via BP bits and W#/ACC hardware lock. Use Value: Sub-sector (4 kB) erase capability allows granular updates without disturbing adjacent clinical settings or calibration data. | Use Scenario: Hosting multiple firmware versions and fail-safe recovery images in enterprise-grade routers requiring zero-downtime upgrades. IC Role / Device Role / Timing Role: Dual-die architecture enables parallel firmware partitioning - one die for active image, second for staging/rollback. Use Value: Independent CS1#/CS2# control allows atomic swap between images without external buffering or host-side complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256S | Successor device with enhanced reliability, higher speed (133 MHz FAST_READ), and updated CFI table structure | Designed for new designs; requires minor software changes per AN98592 | Recommended for all new projects; offers extended lifecycle and improved AC specs |
| S25FL128S | Single-die 128-Mbit variant with identical pinout and command set, but half capacity and no CS2# | Lacks dual-die features (no CS2#, no independent die erase); suitable for space-constrained legacy replacements | Only viable if system firmware fits in 128 Mbit and dual-die functionality is unused |
Compared with S70FL256P0XMFI003, the S25FL256S delivers faster read throughput and longer manufacturer support, while the S25FL128S sacrifices density and dual-die flexibility for simpler integration where full 256 Mbit is unnecessary.
Availability
S70FL256P0XMFI003 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, and medical imaging system configuration requiring stable component supply despite end-of-life status.
Supply support for S70FL256P0XMFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets.
The S70FL256P belongs to the FL-Series SPI flash product line, engineered specifically for high-reliability embedded boot and firmware storage where dual-die density and CFI interoperability are essential.
FAQ
Is S70FL256P0XMFI003 still in production?
No - Cypress explicitly states this part is "not recommended for new and current designs." It has been superseded by the S25FL256S. Aetrix Electronics maintains limited legacy stock for existing production continuity, but no new manufacturing runs are planned.
Can S70FL256P0XMFI003 be used as a drop-in replacement for S25FL128P?
No - although both use the same underlying S25FL129P die, the S70FL256P integrates two dies with dual chip selects (CS1#/CS2#). Using it in place of a single-die part risks undefined behavior unless firmware explicitly manages both dies and avoids cross-die address wraparound.
What is the function of the W#/ACC pin beyond write protection?
The W#/ACC pin serves dual roles: when pulled low at standard VCC, it enables hardware write protection; when driven to 9 V (VHH), it activates accelerated programming mode, reducing page program time. This dual-voltage operation requires external circuitry capable of generating 9 V during programming sequences.
Does S70FL256P0XMFI003 support XIP (eXecute-In-Place)?
Yes - its FAST_READ and QUAD I/O modes deliver sufficient bandwidth (up to 40 MB/s) for direct code execution from flash in microcontrollers with appropriate prefetch buffers and cache. However, XIP performance depends on host controller support for continuous read commands and latency tolerance - not all SPI hosts implement full XIP capability.
S70FL256P0XMFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FL256P0XMFI003 FAQ
1.How can I place an order for S70FL256P0XMFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL256P0XMFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL256P0XMFI003 reliable?
The price and inventory of S70FL256P0XMFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL256P0XMFI003 is usually 5 days.
3.What payment methods are accepted for S70FL256P0XMFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL256P0XMFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL256P0XMFI003?
S70FL256P0XMFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL256P0XMFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL256P0XMFI003?
For technical support, including S70FL256P0XMFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL256P0XMFI003 requirements.
6.How does Aetrix verify that S70FL256P0XMFI003 is sourced from the original manufacturer or authorized distributors?
All S70FL256P0XMFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL256P0XMFI003 meets industry standards.
7.What is the process for return or replacement of S70FL256P0XMFI003?
All S70FL256P0XMFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL256P0XMFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL256P0XMFI003 part is unused and in its original packaging.
Return procedure for S70FL256P0XMFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FL256P0XMFI003 Tags
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M24C02-WMN6TP
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