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Infineon Technologies S70FS01GSAGBHB213

Part No.:
S70FS01GSAGBHB213
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS70FS01GSAGBHB213.pdf
Description:
IC FLASH 1GBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,963

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Product details

Overview

S70FS01GSAGBHB213 from Infineon is a 1 Gb (128 MB) SPI Multi-I/O Flash memory IC with FS-S architecture, operating at 1.8 V nominal supply, supporting DDR Quad I/O read up to 80 MBps, 100,000 program-erase cycles, and 20-year data retention. It implements hardware ECC, hybrid/uniform sector erase, and OTP-based security for boot code protection in automotive and industrial embedded systems.

For engineers reviewing the S70FS01GSAGBHB213 datasheet, S70FS01GSAGBHB213 pinout, S70FS01GSAGBHB213 application, or S70FS01GSAGBHB213 equivalent, key selection considerations include 1.7–2.0 V single-supply operation, AEC-Q100 Grade 2 qualification (–40 °C to +105 °C), BGA-24 6×8 mm package, SPI-MIO command compatibility with S25FL-P/S25FL1-K families, and SFDP/CFI configuration support.

Technical Context

This device uses Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-die SRAM/MirrorBit array organization, enabling high-density nonvolatile storage with deterministic latency for boot code and firmware image storage. Its SPI-MIO interface supports four I/O modes (Normal, Dual, Quad, DDR Quad) and extended addressing (24-/32-bit), allowing flexible integration into resource-constrained microcontroller host systems.

The internal control logic implements automatic ECC correction (single-bit), program/erase suspend-resume, and configurable block protection via status register bits or advanced sector protection (ASP) with password-controlled read access. Sector layout options-hybrid (eight 4 KB + one 224 KB sectors) or uniform (256 KB)-support both fine-grained and bulk update requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 Gb (128 MB) - sufficient for full firmware images and secure boot partitions in automotive ECUs
Supply Voltage1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption
Max Read Throughput80 MBps (DDR Quad I/O) - enables fast boot execution and OTA firmware load times
Erase Endurance100,000 cycles per sector - supports frequent field updates in telematics and ADAS modules
Data Retention20 years minimum at 85 °C - meets long-lifecycle requirements for automotive and industrial deployments
Temperature Range–40 °C to +105 °C (AEC-Q100 Grade 2) - qualified for under-hood and engine-control applications
PackageBGA-24, 6 × 8 mm, 5 × 5 ball footprint - compact surface-mount solution for space-constrained PCBs

Pinout & Package

Package: BGA-24, 6 × 8 mm body, 5 × 5 ball array, Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be asserted before clocking any instruction
SCKSerial Clock InputProvides timing reference for all SPI transfers; supports modes 0 and 3, up to 133 MHz SDR or 80 MHz DDR
IO0 (SI)Serial Input / I/O0Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes
IO1 (SO)Serial Output / I/O1Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes
IO2 (WP#)Write Protect / I/O2Hardware write protection when asserted low; also serves as bidirectional I/O2 in multi-I/O protocols
IO3 (RESET#)Reset Input / I/O3Resets internal state and exits DPD mode when pulsed low; doubles as I/O3 in Quad/DDR modes
VCCPower Supply1.7–2.0 V core and I/O supply; decoupling required within 10 mm of package
VSSGroundSignal and power return path; multiple VSS balls ensure low-impedance grounding

Key Features

FeatureDesign Value
Hardware ECCSingle-bit error correction implemented in silicon - eliminates need for external error-handling firmware overhead
Program/Erase SuspendAllows host to pause ongoing flash operations to service higher-priority interrupts - critical for real-time automotive tasks
Advanced Sector Protection (ASP)Password-protected individual sector locking - enables secure partitioning of boot code vs. application firmware
SFDP & CFI SupportStandardized parameter tables accessible via SPI - enables automatic driver initialization without hard-coded timing constants
Hybrid Sector ArchitectureMixed 4 KB and 224 KB physical sectors at address boundaries - optimizes small-parameter storage and large-firmware updates

Applications

Automotive Engine Control Unit (ECU)Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in an AEC-Q100 Grade 2 qualified environment.

IC Role / Device Role / Timing Role: Nonvolatile boot memory with deterministic read latency and ECC-protected execution path.

Use Value: Ensures safe, certified startup under extreme thermal cycling and EMI conditions while supporting over-the-air calibration updates.

Use Scenario: Holding firmware images and configuration data for programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: High-reliability serial flash with uniform 256 KB erase blocks for predictable firmware upgrade timing.

Use Value: Enables zero-downtime field updates via suspend-resume erase and verified 20-year data retention at 85 °C ambient.

Telematics Control Unit (TCU)Medical Imaging System Boot Memory

Use Scenario: Secure storage of cellular modem firmware, GNSS stack, and encrypted vehicle identity keys.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-based secure silicon region and password-locked ASP sectors.

Use Value: Prevents unauthorized firmware modification and supports cryptographic key isolation using dedicated 1024-byte OTP array.

Use Scenario: Hosting boot loader and safety-critical diagnostic firmware in FDA-regulated imaging equipment requiring long-term data integrity.

IC Role / Device Role / Timing Role: Radiation-tolerant, high-endurance flash with hardware ECC and 100K-cycle endurance for periodic calibration updates.

Use Value: Meets IEC 62304 software lifecycle requirements through guaranteed 20-year retention and built-in error detection/correction.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S25FL128SAGMFI000128 MB, 3.0 V supply, SOIC-16 package, no DDR mode, max Quad Read = 40 MBpsLacks AEC-Q100 qualification and DDR performance; suited for legacy industrial designs with 3.3 V railsSelect only if voltage compatibility and cost outweigh speed/security needs
S70FS01GSAGBHI010Identical die and features, but in 16-lead SOIC 300-mil package (not BGA); same AEC-Q100 Grade 2 ratingPreferred where manual rework or legacy PCB footprints constrain BGA adoptionChoose for prototyping or low-volume production where SOIC handling is preferred

Compared with S25FL128SAGMFI000, the S70FS01GSAGBHB213 delivers 100% higher DDR read bandwidth and automotive-grade reliability; versus S70FS01GSAGBHI010, it trades SOIC ease-of-use for BGA density and thermal performance in high-temperature zones.

Availability

S70FS01GSAGBHB213 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and telematics control unit development requiring stable component supply across extended product lifecycles.

Supply support for S70FS01GSAGBHB213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical applications.

The S70FS01GS belongs to Infineon's FS-S Flash family, designed specifically for automotive and industrial systems demanding AEC-Q100 qualification, hardware ECC, and robust multi-I/O SPI interfaces for secure boot and firmware storage.

FAQ

What is the maximum supported SPI clock frequency for DDR Quad I/O mode?

The S70FS01GSAGBHB213 supports up to 80 MHz DDR clock frequency in Quad I/O mode, delivering 80 MBps effective read throughput. This is specified under AC characteristics section 6.5 of the datasheet, with defined setup/hold timing relative to SCK edges and validated across –40 °C to +105 °C.

Does this device support 32-bit addressing for >16 MB memory spaces?

Yes, the S70FS01GSAGBHB213 supports both 24-bit and 32-bit extended addressing modes, enabling full access to its 128 MB capacity without bank switching. The mode is selected via configuration register bit CR3[1], and is compatible with JEDEC JESD216 SFDP v1.6 descriptors.

How is the 1024-byte OTP array used in secure boot implementations?

The OTP array stores immutable cryptographic keys, device identifiers, and boot policy flags. Once programmed, it cannot be erased or rewritten. In secure boot flows, the ROM bootloader validates firmware signatures using keys stored here, and ASP password hashes may also reside in this region for runtime authentication.

Is the BGA-24 package lead-free and RoHS-compliant?

Yes, the S70FS01GSAGBHB213 BGA-24 package is fully Pb-free and RoHS-compliant per EU Directive 2011/65/EU, with matte tin surface finish on all solder balls and halogen-free molding compound. Compliance documentation is available in Infineon's material declaration report 002-03833 Rev. *G.

S70FS01GSAGBHB213 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FS-S
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S70FS01GSAGBHB213 FAQ

1.How can I place an order for S70FS01GSAGBHB213 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70FS01GSAGBHB213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70FS01GSAGBHB213 reliable?

The price and inventory of S70FS01GSAGBHB213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSAGBHB213 is usually 5 days.

3.What payment methods are accepted for S70FS01GSAGBHB213?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSAGBHB213 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70FS01GSAGBHB213?

S70FS01GSAGBHB213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70FS01GSAGBHB213 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70FS01GSAGBHB213?

For technical support, including S70FS01GSAGBHB213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSAGBHB213 requirements.

6.How does Aetrix verify that S70FS01GSAGBHB213 is sourced from the original manufacturer or authorized distributors?

All S70FS01GSAGBHB213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSAGBHB213 meets industry standards.

7.What is the process for return or replacement of S70FS01GSAGBHB213?

All S70FS01GSAGBHB213 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSAGBHB213, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70FS01GSAGBHB213 part is unused and in its original packaging.

Return procedure for S70FS01GSAGBHB213:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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