Infineon Technologies S70FS01GSAGBHI210
- Part No.:
- S70FS01GSAGBHI210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSAGBHI210.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S70FS01GSAGBHI210 from Infineon is a 1 Gb (128 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It supports DDR Quad I/O read up to 80 MBps, features hardware ECC for single-bit error correction, 100,000 program-erase cycles, and 20-year data retention. Used in industrial and automotive boot code storage where high reliability and fast configuration reads are required.
For engineers reviewing the S70FS01GSAGBHI210 datasheet, S70FS01GSAGBHI210 pinout, S70FS01GSAGBHI210 application, or S70FS01GSAGBHI210 equivalent, key selection factors include SPI-MIO timing compliance, hybrid/uniform sector erase flexibility, OTP security configuration, AEC-Q100 Grade 2 qualification, and 65-nm MirrorBit™ process reliability.
Technical Context
This device implements Infineon's Eclipse architecture with dual-die stacking (S25FS512S ×2) enabling 1 Gb density while maintaining SPI command compatibility with legacy S25FL families. It supports both 24-bit and 32-bit addressing modes, SFDP v1.6 and CFI for auto-configuration, and QPI mode for high-throughput instruction execution.
The internal control logic integrates dedicated ECC circuitry that operates transparently during read/program/erase, plus programmable block protection via status register bits and advanced sector protection (ASP) with password-controlled access. Erase suspend/resume and program suspend/resume enable real-time system responsiveness during flash operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and secure boot partitions in modern microcontrollers. |
| Interface | SPI Multi-I/O (Quad/DDR) - enables 80 MBps read throughput in DDR Quad I/O mode, reducing boot time vs standard SPI. |
| Voltage Range | 1.7 V to 2.0 V - compatible with low-power 1.8 V system rails and reduces I/O power consumption vs 3.3 V flash. |
| Erase Endurance | 100,000 cycles per sector - supports frequent field firmware updates in industrial gateways and telematics units. |
| Data Retention | 20 years minimum at +85 °C - ensures long-term reliability in unattended infrastructure equipment. |
| Temperature Range | –40 °C to +105 °C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and outdoor telecom base stations. |
| ECC | Internal hardware single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical applications. |
Pinout & Package
Package: 24-ball BGA, 6 mm × 8 mm, 0.8 mm pitch, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before clocking any instruction. |
| SCK | Serial Clock | Input clock for SDR (up to 133 MHz) or DDR (up to 80 MHz) operation; phase/polarity configurable per SPI mode 0/3. |
| IO0 (SI) | Serial Input / I/O0 | Primary data input in standard SPI; bidirectional in multi-I/O modes for address/data transfer. |
| IO1 (SO) | Serial Output / I/O1 | Primary data output in standard SPI; bidirectional in multi-I/O modes for quad/DDR reads. |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write protection enable; also functions as second I/O line in Quad I/O mode. |
| IO3 (RESET#) | Reset / I/O3 | Hardware reset input; doubles as third I/O line in Quad I/O and fourth in DDR Quad I/O configurations. |
| VCC | Power Supply | 1.7–2.0 V core and I/O supply; decoupling required per Infineon layout guidelines to maintain signal integrity. |
| VSS | Ground | Signal and power ground reference; separate VSS pins support low-noise operation in mixed-signal systems. |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read Mode | 80 MBps throughput - cuts boot time by >2× vs standard Fast Read in high-performance MCU boot loaders. |
| Hybrid Sector Erase Option | Eight 4 KB + one 224 KB sectors at top/bottom - enables fine-grained update of boot code while preserving large application partitions. |
| OTP Array (1024 bytes) | Immutable storage for cryptographic keys, calibration data, or unique device identifiers - immune to accidental overwrite or erase commands. |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking - prevents unauthorized firmware modification in certified automotive ECUs without disabling entire flash array. |
| Automatic Hardware ECC | Transparent single-bit correction on every read - eliminates soft-error-induced crashes in mission-critical industrial controllers. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver-assist UI assets, and fail-safe boot code in AEC-Q100 Grade 2 qualified instrument clusters. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing deterministic <50 ms cold-start load time via DDR Quad I/O read. Use Value: 20-year data retention and hardware ECC ensure display integrity over vehicle lifetime without field recalls. | Use Scenario: Holding firmware, configuration tables, and runtime logs in DIN-rail mounted programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability configuration store supporting 100,000+ field firmware updates across 15+ year product lifecycle. Use Value: Hybrid sector erase allows independent update of logic engine vs HMI modules without full flash reprogramming. |
| 5G Small Cell Baseband | Medical Imaging System Boot Memory |
Use Scenario: Loading FPGA bitstreams and DSP firmware in outdoor 5G small cell radios operating at –40 °C to +105 °C ambient. IC Role / Device Role / Timing Role: Dual-die stacked NOR flash delivering 80 MBps DDR Quad reads to meet tight 100 ms boot window. Use Value: AEC-Q100 Grade 2 qualification and 65-nm MirrorBit™ process ensure stable operation under thermal cycling stress. | Use Scenario: Securing boot loader, regulatory-compliant diagnostics, and calibration constants in FDA-cleared MRI and CT scanner control subsystems. IC Role / Device Role / Timing Role: Trusted boot memory with OTP-based key storage and ASP password enforcement for HIPAA/FDA audit trails. Use Value: 1024-byte OTP and hardware ECC prevent tampering or corruption of life-critical diagnostic routines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI000 | 128 MB, 3.0 V supply, no DDR mode, max 80 MHz SDR clock, no hardware ECC | Limited to non-automotive industrial use due to voltage and reliability constraints | Select only if system uses 3.3 V I/O and does not require DDR throughput or ECC assurance |
| Winbond W25Q128JVSIM | 128 MB, 3.3 V, supports Quad I/O but not DDR, 1.8 V option requires separate part number (W25Q128JVSIM) | Lower temperature grade (–40 °C to +85 °C only), no AEC-Q100 qualification | Consider for cost-sensitive consumer applications where automotive/industrial qualification is unnecessary |
Compared with S25FL128SAGMFI000 and W25Q128JVSIM, the S70FS01GSAGBHI210 uniquely delivers DDR-capable 1.8 V operation, integrated ECC, and AEC-Q100 Grade 2 qualification-enabling single-part qualification across automotive, industrial, and medical platforms without design re-spin.
Availability
S70FS01GSAGBHI210 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, 5G small cell basebands, and medical imaging systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FS01GSAGBHI210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems requiring fast, secure, and long-life non-volatile storage-designed specifically for automotive boot code, industrial firmware, and safety-critical configuration data.
FAQ
What is the maximum supported clock frequency in DDR Quad I/O mode?
The S70FS01GSAGBHI210 supports up to 80 MHz DDR clock frequency in DDR Quad I/O mode, delivering 80 MBps effective read bandwidth. This is specified in the AC characteristics section (Table 6.5) of the datasheet and validated across the full –40 °C to +105 °C operating range with proper PCB layout and termination.
Does this device support both 24-bit and 32-bit addressing?
Yes, the S70FS01GSAGBHI210 supports extended addressing with configurable 24-bit or 32-bit address modes. The mode is selected via the Extended Address Register (EAR), enabling access to the full 1 Gb address space beyond the legacy 16 MB limit of 24-bit addressing.
Is hardware reset (RESET#) required for reliable initialization?
Hardware reset via the IO3/RESET# pin is recommended for deterministic initialization, especially after power-on or deep power-down exit. While software reset commands exist, the hardware reset ensures all internal state machines and registers return to known defaults, critical for safety-certified systems.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed using JEDEC-standard One Time Program commands (0x4B, 0x42). Once programmed, bits cannot be erased. Protection is enforced by status register lock bits and ASP password mechanisms-preventing accidental or unauthorized writes without explicit unlock sequences verified in the datasheet's Section 10.7.
S70FS01GSAGBHI210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSAGBHI210 FAQ
1.How can I place an order for S70FS01GSAGBHI210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSAGBHI210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSAGBHI210 reliable?
The price and inventory of S70FS01GSAGBHI210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSAGBHI210 is usually 5 days.
3.What payment methods are accepted for S70FS01GSAGBHI210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSAGBHI210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSAGBHI210?
S70FS01GSAGBHI210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSAGBHI210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSAGBHI210?
For technical support, including S70FS01GSAGBHI210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSAGBHI210 requirements.
6.How does Aetrix verify that S70FS01GSAGBHI210 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSAGBHI210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSAGBHI210 meets industry standards.
7.What is the process for return or replacement of S70FS01GSAGBHI210?
All S70FS01GSAGBHI210 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSAGBHI210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSAGBHI210 part is unused and in its original packaging.
Return procedure for S70FS01GSAGBHI210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FS01GSAGBHI210 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

