My Inquiry
My Account
Infineon Technologies S70FS01GSAGBHI213
- Part No.:
- S70FS01GSAGBHI213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSAGBHI213.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,844
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S70FS01GSAGBHI213 from Infineon is a 1 Gb (128 MB) SPI Multi-I/O flash memory IC with 1.8 V single-supply operation, supporting DDR Quad I/O read up to 80 MBps, 256/512-byte page programming, and hybrid/uniform 256 KB sector erase. It integrates hardware ECC, SFDP/CFI support, and AEC-Q100 Grade 2 automotive qualification (–40 °C to +105 °C). Used in automotive ADAS boot code storage and industrial controller firmware.
For engineers reviewing the S70FS01GSAGBHI213 datasheet, S70FS01GSAGBHI213 pinout, S70FS01GSAGBHI213 application, or S70FS01GSAGBHI213 equivalent, this page delivers verified electrical specs, package mapping, real-world timing performance, security features (OTP, ASP), and validated alternative parts for automotive-grade flash migration.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-die SRAM-based control logic and mirrored bit-line array. It supports SPI clock modes 0 and 3, extended 24-/32-bit addressing, and QPI mode for burst wrap reads.
The flash integrates dedicated ECC circuitry correcting single-bit errors on-the-fly during read, plus program/erase suspend-resume capability and configurable block protection via status register bits or advanced sector protection with password-controlled access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) – sufficient for full firmware images and OTA update partitions in automotive ECUs. |
| Interface | SPI Multi-I/O with DDR Quad I/O – enables 80 MBps read throughput, reducing boot time vs. standard SPI. |
| Erase Endurance | 100,000 cycles per sector – supports frequent field updates in telematics and gateway modules. |
| Data Retention | 20 years minimum at +85 °C – meets long-life requirements for automotive infotainment and ADAS systems. |
| Supply Voltage | 1.7 V to 2.0 V – compatible with low-voltage SoC I/O rails and reduces system power consumption. |
| Temperature Range | –40 °C to +105 °C (AEC-Q100 Grade 2) – qualified for under-hood and transmission control unit deployment. |
| Package | BGA-24 (6 × 8 mm, 5 × 5 ball footprint) – compact surface-mount solution for space-constrained automotive PCBs. |
Pinout & Package
Package: BGA-24, 6 mm × 8 mm, 5 × 5 ball array, Pb-free, industrial and automotive qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command execution; must be asserted before SCK edge to initiate transaction. |
| SCK | Serial Clock Input | Drives all synchronous operations; supports up to 133 MHz for Fast/Dual/Quad Read, 80 MHz for DDR Quad I/O. |
| SI / IO0 | Serial Input / I/O Line 0 | Primary data input in standard SPI; bidirectional in multi-I/O modes for command/address/data transfer. |
| SO / IO1 | Serial Output / I/O Line 1 | Primary data output in standard SPI; bidirectional in multi-I/O modes for high-speed Quad/DDR reads. |
| WP# / IO2 | Write Protect Input / I/O Line 2 | Hardware lock for sector protection; also functions as third I/O line in Quad/DDR modes. |
| IO3 / RESET# | I/O Line 3 / Reset Input | Resets internal state when asserted low; doubles as fourth I/O line in Quad/DDR configurations. |
| VCC | Power Supply | 1.7–2.0 V core and I/O supply; decoupling required within 5 mm of package for stable DDR timing. |
| VSS | Ground | Signal and power return; requires low-inductance connection to minimize read noise and ECC error rate. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction during read, eliminating need for external error-handling firmware overhead. |
| Hybrid Sector Erase | Combines eight 4 KB sectors + one 224 KB sector at top/bottom address space-ideal for bootloader + application partitioning. |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking, enabling secure OTA update staging without exposing full memory map. |
| SFDP & CFI Support | Standardized parameter tables allow automatic driver configuration in Linux U-Boot and RTOS BSPs without hard-coded timing values. |
| Program/Erase Suspend | Allows background erase to pause while servicing high-priority read requests-critical for real-time diagnostics logging. |
Applications
| Automotive ADAS Camera Module | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated image processing firmware and runtime configuration for front-facing camera ECU. IC Role / Device Role / Timing Role: Boot-time serial flash providing deterministic <100 ms load latency via DDR Quad I/O read at 80 MBps. Use Value: AEC-Q100 Grade 2 rating ensures reliable operation at +105 °C near engine bay; OTP stores calibration keys immune to field reprogramming. | Use Scenario: Holding firmware, ladder logic, and I/O mapping tables for DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile memory with 100,000 erase cycles supporting weekly firmware updates over 10+ years. Use Value: Hybrid sector layout isolates boot loader (4 KB sectors) from application (256 KB blocks), preventing corruption during partial updates. |
| Telematics Control Unit (TCU) | Medical Imaging Gateway |
Use Scenario: Secure storage of cellular modem firmware, GNSS stack, and encrypted vehicle diagnostic logs. IC Role / Device Role / Timing Role: Dual-die architecture enables concurrent program/erase and read operations for seamless OTA patching. Use Value: ASP with password control restricts read access to sensitive log data while allowing signed firmware verification by host MCU. | Use Scenario: Storing DICOM protocol stacks and FPGA configuration bitstreams in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power Deep Power Down (6 µA) extends battery life between imaging sessions. Use Value: 20-year data retention guarantees integrity of regulatory-critical firmware across device lifecycle without refresh cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI101 | Same 128 MB density, 1.8 V, SOIC-16 package; lacks DDR Quad I/O and ASP; max read 66 MBps (Quad only). | Not AEC-Q100 qualified; limited to industrial temperature range (–40 °C to +85 °C). | Select only for cost-sensitive non-automotive designs where DDR speed and password-protected sectors are unnecessary. |
| Winbond W25Q128JVSIM | 128 MB, 3 V supply, SOIC-8; supports Quad I/O but no DDR mode; no integrated ECC or ASP. | Requires external ECC handling; no automotive qualification; incompatible voltage domain with 1.8 V SoCs. | Use only in legacy 3 V systems with simple firmware storage needs and no security or endurance requirements. |
Compared with S25FL128SAGMFI101 and W25Q128JVSIM, the S70FS01GSAGBHI213 delivers higher bandwidth (80 MBps DDR), automotive-grade reliability, and hardware-enforced security-making it the sole choice for safety-critical, high-throughput embedded boot storage.
Availability
S70FS01GSAGBHI213 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, telematics control units, and medical imaging gateways requiring stable component supply across extended product lifecycles.
Supply support for S70FS01GSAGBHI213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions.
The FS-S Flash family targets automotive and industrial applications demanding high reliability, embedded security, and fast boot performance-designed specifically for AEC-Q100-compliant ECU firmware storage and secure OTA update infrastructure.
FAQ
What is the maximum DDR Quad I/O read speed supported by S70FS01GSAGBHI213?
The device achieves 80 MBps DDR Quad I/O read throughput at 80 MHz SCK frequency, confirmed in the datasheet's Performance Summary table. This requires proper impedance-controlled PCB routing, matched trace lengths for IO0–IO3, and stable 1.8 V supply with ≤100 mV ripple to meet setup/hold timing margins.
Does S70FS01GSAGBHI213 support both 24-bit and 32-bit addressing modes?
Yes, the device supports extended addressing with selectable 24-bit or 32-bit address options, enabling access to the full 1 Gb address space. Configuration is controlled via the Configuration Register (CR), and the mode must be set before issuing read/program/erase commands that target addresses beyond the 16 MB boundary.
How does the Advanced Sector Protection (ASP) feature work in practice?
ASP allows individual sector locking using either boot code execution or a user-defined 8-byte password. Once enabled, protected sectors cannot be read or programmed without first issuing the correct password via the ASP Unlock command. Passwords are stored in OTP and enforced by on-die logic-no software intervention required for enforcement.
Is the BGA-24 package of S70FS01GSAGBHI213 compatible with standard reflow profiles?
Yes, the Pb-free BGA-24 package is qualified for IPC/JEDEC J-STD-020D reflow, with peak temperature up to 260 °C for ≤60 seconds. The 5 × 5 ball layout uses 0.5 mm pitch and requires stencil-applied solder paste with 0.12 mm thickness and Type 4 powder for reliable void-free joints under automotive thermal cycling conditions.
S70FS01GSAGBHI213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSAGBHI213 FAQ
1.How can I place an order for S70FS01GSAGBHI213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSAGBHI213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSAGBHI213 reliable?
The price and inventory of S70FS01GSAGBHI213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSAGBHI213 is usually 5 days.
3.What payment methods are accepted for S70FS01GSAGBHI213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSAGBHI213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSAGBHI213?
S70FS01GSAGBHI213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSAGBHI213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSAGBHI213?
For technical support, including S70FS01GSAGBHI213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSAGBHI213 requirements.
6.How does Aetrix verify that S70FS01GSAGBHI213 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSAGBHI213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSAGBHI213 meets industry standards.
7.What is the process for return or replacement of S70FS01GSAGBHI213?
All S70FS01GSAGBHI213 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSAGBHI213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSAGBHI213 part is unused and in its original packaging.
Return procedure for S70FS01GSAGBHI213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FS01GSAGBHI213 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
