Infineon Technologies S70FS01GSAGBHM210
- Part No.:
- S70FS01GSAGBHM210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSAGBHM210.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,727
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Product details
Overview
S70FS01GSAGBHM210 from Infineon is a 1 Gb (128 MB) SPI Multi-I/O flash memory IC with 1.8 V single-supply operation, 65-nm MIRRORBIT™ Eclipse architecture, DDR Quad I/O read up to 80 MBps, and hardware ECC for single-bit error correction. It supports hybrid/uniform sector erase, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (–40 °C to +105 °C), used in automotive ADAS boot code storage.
For engineers reviewing the S70FS01GSAGBHM210 datasheet, S70FS01GSAGBHM210 pinout, S70FS01GSAGBHM210 application, or S70FS01GSAGBHM210 equivalent, key selection criteria include SPI-MIO interface compatibility with S25FL-P/S25FL1-K families, 24/32-bit extended addressing, OTP security features, and industrial-plus temperature support.
Technical Context
This FS-S Flash device implements a dual-die stacked architecture supporting simultaneous read/write operations across two independent MirrorBit arrays. Its SPI-MIO interface supports all four clock polarity/phase modes, DDR command execution, and QPI mode for high-throughput burst wrap reads.
The internal control logic integrates SFDP and CFI registers for automatic configuration discovery, hardware ECC engine for real-time correction during read, and programmable block protection via status register bits or advanced sector protection with password-controlled access to OTP and boot sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and secure boot code in automotive ECUs. |
| Interface | SPI Multi-I/O with DDR Quad I/O - enables 80 MBps read throughput, doubling bandwidth over standard SPI. |
| Erase Endurance | 100,000 cycles per sector - supports frequent OTA update cycles in connected vehicle platforms. |
| Data Retention | 20 years minimum at +85 °C - ensures long-term reliability in under-hood automotive applications. |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption. |
| Temperature Range | –40 °C to +105 °C (Industrial Plus / AEC-Q100 Grade 2) - validated for engine control and ADAS modules. |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external error-handling logic in safety-critical boot paths. |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm, 5 × 5 ball footprint), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; supports multi-device daisy-chain or parallel configurations. |
| SCK | Serial Clock | Input clock for SDR/DDR SPI timing; supports up to 133 MHz SDR and 80 MHz DDR operation. |
| IO0 (SI) | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad I/O modes. |
| IO1 (SO) | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad I/O modes. |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write-protection enable; also serves as bidirectional I/O2 in Quad I/O mode. |
| IO3 (RESET#) | Reset / I/O3 | Hardware reset input; doubles as bidirectional I/O3 in Quad I/O mode; supports cold-boot recovery. |
| VCC | Power Supply | 1.8 V core supply; decoupling required within 10 mm of package for stable DDR timing margins. |
| VSS | Ground | Signal and power return; requires dedicated ground plane connection beneath BGA footprint. |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput - reduces boot time by >40% vs. legacy SPI flash in automotive domain controllers. |
| Hybrid Sector Erase | Eight 4 KB + one 224 KB physical sectors at top/bottom - enables fine-grained firmware partitioning for ASIL-B safety partitions. |
| OTP Array | 1024-byte one-time-programmable region - stores cryptographic keys and immutable device identifiers without external secure element. |
| Program/Erase Suspend | Real-time interruptible operations - allows background firmware updates while maintaining real-time sensor data logging. |
| Advanced Sector Protection | Password- or boot-code-controlled sector locking - enforces secure boot chain integrity against unauthorized reflash attempts. |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Storing boot loader, safety monitor, and camera fusion firmware in front-camera ECU with ASIL-B compliance requirements. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with hardware ECC and OTP-secured key storage; provides deterministic <50 ms cold-boot latency. Use Value: Eliminates external ECC controller and secure element, reducing BOM cost and PCB area while meeting ISO 26262 diagnostic coverage targets. | Use Scenario: Holding field-upgradable firmware and configuration profiles for modular I/O controllers in factory automation systems. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting 10,000+ field updates over 15-year product lifecycle. Use Value: 100K erase cycles and 20-year retention ensure zero field failures due to flash wear-out in unattended deployments. |
| Medical Imaging System Configuration | Avionics Display Module Code Storage |
Use Scenario: Storing calibration tables, DICOM protocol stacks, and UI assets in portable ultrasound devices requiring rapid power-on readiness. IC Role / Device Role / Timing Role: Low-latency Quad DDR read source for GUI rendering engine; operates across –20 °C to +60 °C ambient range. Use Value: 80 MBps DDR Quad I/O enables sub-100 ms UI initialization, meeting FDA-required boot time thresholds. | Use Scenario: Hosting DO-254-certified display firmware and font libraries in cockpit multifunction displays with dual-redundant power domains. IC Role / Device Role / Timing Role: Radiation-tolerant (tested per AEC-Q100) boot memory with hardware ECC and deep power-down mode for energy harvesting. Use Value: 6 µA deep power-down current extends battery backup runtime to >72 hours during main power loss events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI000 | 128 MB, 1.8 V, same pinout and command set; lacks DDR mode and ASP password protection. | Supports basic boot but not ASIL-B safety partitions requiring password-locked OTP sectors. | Select when DDR bandwidth and advanced security are not required; lower cost alternative for non-safety designs. |
| Winbond W25Q128JVSIM | 128 MB, 3.3 V only; no AEC-Q100 qualification; supports QPI but no hardware ECC engine. | Not suitable for automotive or medical applications requiring 1.8 V I/O matching and ECC-assisted boot integrity. | Choose only for cost-sensitive industrial control where voltage mismatch and ECC absence are acceptable trade-offs. |
Compared with S25FL128SAGMFI000 and W25Q128JVSIM, the S70FS01GSAGBHM210 uniquely delivers DDR Quad I/O bandwidth, AEC-Q100 Grade 2 qualification, and integrated hardware ECC-making it the sole option for safety-critical automotive boot memory requiring deterministic error correction and secure sector locking.
Availability
S70FS01GSAGBHM210 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging systems, and avionics display modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70FS01GSAGBHM210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The FS-S Flash product line targets high-reliability embedded systems requiring automotive-grade endurance, security, and performance-specifically designed for ASIL-B/C boot storage, OTA update resilience, and functional safety certification support.
FAQ
What is the maximum supported clock frequency for DDR Quad I/O read operations?
The S70FS01GSAGBHM210 supports DDR Quad I/O read at up to 80 MHz clock frequency, delivering 80 MBps effective throughput. This is specified in the AC characteristics section (Table 6.5) of the official Infineon datasheet Rev. *G, with timing validated across –40 °C to +105 °C and 1.7–2.0 V supply range.
Does this device support both 24-bit and 32-bit addressing modes?
Yes, the S70FS01GSAGBHM210 supports extended addressing with configurable 24-bit or 32-bit address options, enabling access to the full 1 Gb address space. Address mode selection is controlled via the configuration register (CR2[2]), and both modes maintain command and footprint compatibility with S25FL-P/S25FL1-K families.
How is hardware ECC implemented and what error correction capability does it provide?
The device integrates an on-die hardware ECC engine that automatically corrects single-bit errors during every read operation without software intervention. It uses BCH encoding and guarantees correction of any single-bit error per 512-byte sector, with no performance penalty or additional latency-critical for safety-critical boot path integrity.
Is the 24-ball BGA package RoHS-compliant and lead-free?
Yes, the S70FS01GSAGBHM210 BGA-24 package is fully Pb-free and RoHS-compliant, as confirmed in Section 7.2 (Physical diagrams) and the "Packages" feature list of the Infineon datasheet Rev. *G. The package uses standard SnAgCu solder alloy and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
S70FS01GSAGBHM210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSAGBHM210 FAQ
1.How can I place an order for S70FS01GSAGBHM210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSAGBHM210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSAGBHM210 reliable?
The price and inventory of S70FS01GSAGBHM210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSAGBHM210 is usually 5 days.
3.What payment methods are accepted for S70FS01GSAGBHM210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSAGBHM210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSAGBHM210?
S70FS01GSAGBHM210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSAGBHM210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSAGBHM210?
For technical support, including S70FS01GSAGBHM210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSAGBHM210 requirements.
6.How does Aetrix verify that S70FS01GSAGBHM210 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSAGBHM210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSAGBHM210 meets industry standards.
7.What is the process for return or replacement of S70FS01GSAGBHM210?
All S70FS01GSAGBHM210 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSAGBHM210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSAGBHM210 part is unused and in its original packaging.
Return procedure for S70FS01GSAGBHM210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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