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Infineon Technologies S70FS01GSAGBHM213
- Part No.:
- S70FS01GSAGBHM213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSAGBHM213.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,498
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Product details
Overview
S70FS01GSAGBHM213 from Infineon is a 1 Gb (128 MB) SPI Multi-I/O serial flash memory with 1.8 V single-supply operation, 65-nm MIRRORBIT™ Eclipse architecture, and support for DDR Quad I/O read up to 80 MBps. It features hardware ECC, hybrid/uniform sector erase options, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (–40 °C to +105 °C). Used in automotive ADAS boot code storage and industrial firmware image retention.
For engineers reviewing the S70FS01GSAGBHM213 datasheet, S70FS01GSAGBHM213 pinout, S70FS01GSAGBHM213 application, or S70FS01GSAGBHM213 equivalent, key selection criteria include SPI-MIO timing compliance, ECC coverage scope, sector protection granularity, SFDP/CFI configurability, and automotive temperature grade validation.
Technical Context
This device implements a dual-die stacked architecture supporting extended 32-bit addressing and QPI mode for high-throughput instruction fetch. Its control logic integrates dedicated SRAM latches for page programming and on-the-fly ECC encoding/decoding across all read paths.
The SPI-MIO interface supports four I/O lines (IO0–IO3) with configurable polarity/phase (modes 0 and 3), DDR clocking, and command subsets compatible with S25FL1-K, S25FL-P, and S25FL-S families-enabling drop-in migration in existing SPI flash designs without PCB rework.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) total capacity, mapped as uniform 256 KB sectors or hybrid 4 KB + 224 KB top/bottom configuration |
| Interface | SPI Multi-I/O with 4-line quad mode, DDR support, and QPI command set for burst wrap reads |
| Read Throughput | 80 MBps maximum via DDR Quad I/O at 80 MHz clock; enables sub-100 ms full firmware load from cold boot |
| ECC Implementation | On-die hardware ECC correcting single-bit errors per 512-byte sector; no host CPU overhead required |
| Endurance & Retention | 100,000 program-erase cycles minimum per sector; 20-year data retention at 85 °C |
| Supply Voltage | 1.7 V to 2.0 V single supply; compatible with 1.8 V FPGA/SoC I/O banks without level shifting |
| Temperature Range | Industrial Plus (–40 °C to +105 °C) and AEC-Q100 Grade 2 qualified; validated for under-hood automotive use |
Pinout & Package
Package: 24-ball BGA, 6 × 8 mm, 0.8 mm pitch, Pb-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for command/address/data transfer; must be deasserted between commands to reset internal state machine |
| SCK | Serial Clock | Input clock for SDR/DDR modes; supports up to 133 MHz SDR or 80 MHz DDR; phase/polarity configurable per SPI mode |
| IO0 (SI) | Serial Input / I/O Line 0 | Primary input for commands, addresses, and program data; bidirectional in multi-I/O modes |
| IO1 (SO) | Serial Output / I/O Line 1 | Primary output for read data; bidirectional in multi-I/O modes; supports dual/quad DDR reads |
| IO2 (WP#) | Write Protect / I/O Line 2 | Hardware write protection enable; active-low; also functions as quad I/O line when WP# disabled via status register |
| IO3 (RESET#) | Reset / I/O Line 3 | Hardware reset input; active-low; also serves as fourth I/O line in quad mode when RESET# disabled via status register |
| VCC | Power Supply | 1.7–2.0 V core and I/O supply; decoupling capacitor required within 5 mm of ball |
| VSS | Ground | Digital ground reference; separate VSS balls provided for signal integrity in high-speed DDR operation |
Key Features
| Feature | Design Value |
|---|---|
| Hybrid Sector Erase | Enables fast 4 KB sector erase for parameter updates while retaining large 224 KB blocks for firmware binaries |
| OTP Array | 1024-byte one-time-programmable region for secure keys, calibration data, or unique device identifiers |
| Advanced Sector Protection (ASP) | Password-controlled individual sector locking prevents unauthorized firmware modification or readout |
| SFDP & CFI Support | Self-describing configuration via JEDEC JESD216 allows automatic driver initialization without hard-coded timing parameters |
| Program/Erase Suspend | Allows interrupting long erase operations to service time-critical reads, improving real-time system responsiveness |
Applications
| Automotive ADAS Boot Storage | Industrial PLC Firmware Image |
|---|---|
Use Scenario: Stores boot code and safety-critical firmware for radar ECU requiring AEC-Q100 Grade 2 compliance and <100 ms cold-boot latency. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to ARM Cortex-R5F MCU via Quad SPI with DDR timing. Use Value: Hardware ECC ensures bit-error resilience in electrically noisy vehicle environments; hybrid erase supports incremental OTA patching without full image reload. | Use Scenario: Holds field-upgradable firmware for modular I/O controllers operating continuously in factory automation cabinets at 70 °C ambient. IC Role / Device Role / Timing Role: Standalone SPI flash providing deterministic 256 KB sector erase and 80 MBps DDR read for rapid firmware validation after power cycle. Use Value: 20-year data retention guarantees firmware integrity over equipment lifetime; ASP password lock prevents tampering during maintenance access. |
| Medical Imaging System Configuration | Avionics Display Module Storage |
Use Scenario: Stores calibrated sensor profiles and UI assets for portable ultrasound devices requiring traceable configuration history and secure update signing. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys; SFDP enables auto-negotiated read mode based on host controller capability. Use Value: 1024-byte OTP provides immutable root-of-trust; ECC correction eliminates need for external CRC checks in safety-critical data paths. | Use Scenario: Retains certified display firmware and font assets for DO-178C Level A avionics displays operating in extended temperature ranges. IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 qualified variant used with redundant read verification; uniform 256 KB erase aligns with DO-178C partitioning requirements. Use Value: 125 °C operation margin ensures reliability at cockpit mounting locations; block protection bits prevent accidental overwrite during in-flight software updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | 128 MB density, same 1.8 V supply, but 40 MHz max Quad Read (vs. 80 MBps DDR); no DDR mode support | Limited to legacy SPI controllers lacking DDR capability; lower bandwidth for large firmware loads | Select when host lacks DDR SPI support or cost sensitivity outweighs throughput needs |
| MX25L1G45GM2I-12G | 1 Gb density, 3 V supply only; no AEC-Q100 qualification; 10-year retention (vs. 20 years) | Restricted to commercial/industrial use; unsuitable for automotive or long-lifecycle deployments | Select only for non-automotive applications where 3 V supply and shorter retention are acceptable |
Compared with S25FL128SAGMFI000 and MX25L1G45GM2I-12G, the S70FS01GSAGBHM213 delivers double read bandwidth via DDR Quad I/O, automotive-grade reliability, and longer data retention-making it optimal for safety-critical, high-throughput embedded boot systems.
Availability
S70FS01GSAGBHM213 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial programmable logic controllers, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S70FS01GSAGBHM213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted security solutions.
The FS-S Flash family targets high-reliability embedded systems needing robust non-volatile storage with automotive qualification, hardware ECC, and scalable SPI-MIO performance-designed specifically for boot code, firmware, and configuration data in safety-critical applications.
FAQ
What is the maximum supported clock frequency for DDR Quad I/O read operations?
The S70FS01GSAGBHM213 supports DDR Quad I/O read at up to 80 MHz clock frequency, delivering 80 MBps effective throughput. This is verified in the datasheet's DDR AC characteristics table (Section 6.5) and requires proper impedance-controlled routing and VCC decoupling per layout guidelines in Section 7.2.
Does this device support both 24-bit and 32-bit addressing modes?
Yes, the device supports extended addressing with configurable 24-bit or 32-bit address space via status register bit EXTADD. In 32-bit mode, the full 1 Gb address range is accessible; in 24-bit mode, only the lower 16 MB is usable. Mode selection is non-volatile and persists across power cycles.
How is hardware ECC applied-per page, per sector, or per read transaction?
ECC is applied per 512-byte sector during every read operation, with single-bit error correction performed automatically in hardware. The ECC engine operates transparently-no host intervention or additional timing overhead is required-and corrected data is delivered directly to the I/O bus.
Can the OTP array be programmed multiple times, or is it truly one-time programmable?
The 1024-byte OTP array is physically one-time programmable: each bit can be changed from '1' to '0' only once. Programming is irreversible and requires specific unlock sequences and voltage conditions. Once written, OTP contents remain valid across all temperature grades and retain data for ≥20 years.
S70FS01GSAGBHM213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSAGBHM213 FAQ
1.How can I place an order for S70FS01GSAGBHM213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSAGBHM213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSAGBHM213 reliable?
The price and inventory of S70FS01GSAGBHM213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSAGBHM213 is usually 5 days.
3.What payment methods are accepted for S70FS01GSAGBHM213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSAGBHM213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSAGBHM213?
S70FS01GSAGBHM213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSAGBHM213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSAGBHM213?
For technical support, including S70FS01GSAGBHM213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSAGBHM213 requirements.
6.How does Aetrix verify that S70FS01GSAGBHM213 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSAGBHM213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSAGBHM213 meets industry standards.
7.What is the process for return or replacement of S70FS01GSAGBHM213?
All S70FS01GSAGBHM213 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSAGBHM213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSAGBHM213 part is unused and in its original packaging.
Return procedure for S70FS01GSAGBHM213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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