My Inquiry
My Account
Infineon Technologies S70FS01GSAGMFI010
- Part No.:
- S70FS01GSAGMFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S70FS01GSAGMFI010.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,379
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S70FS01GSAGMFI010 from Infineon is a 1 Gb (128 MB) SPI Multi-I/O serial flash memory with 1.8 V single-supply operation, supporting DDR Quad I/O read up to 80 MBps, 256/512-byte page programming, and hybrid/uniform 256 KB sector erase. It integrates hardware ECC for single-bit error correction and supports AEC-Q100 Grade 2 automotive operation (–40 °C to +105 °C). Used in automotive ADAS boot code storage and industrial controller firmware.
For engineers reviewing the S70FS01GSAGMFI010 datasheet, S70FS01GSAGMFI010 pinout, S70FS01GSAGMFI010 application, or S70FS01GSAGMFI010 equivalent, key selection criteria include SPI-MIO interface compatibility with S25FL-P/S25FL1-K families, 100,000 program-erase cycles, OTP-based secure silicon region, SFDP/CFI configuration support, and industrial-plus temperature range compliance.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-die stacking (S25FS512S ×2), enabling 1 Gb density in a compact BGA-24 or SOIC-16 package. Its SPI-MIO interface supports all four clock polarity/phase modes, DDR command execution, and extended 24-/32-bit addressing for flexible memory mapping.
The control logic includes dedicated SRAM latches for command buffering, on-the-fly ECC encoding/decoding, and programmable block protection via status register bits or advanced sector protection (ASP) with password-controlled access. Erase suspend/resume and program suspend/resume are supported at both physical sector and uniform block levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - supports full firmware images for automotive microcontrollers and real-time OS kernels |
| Interface | SPI Multi-I/O with DDR support - enables 80 MBps read throughput using quad I/O lines and double-data-rate clocking |
| Erase Endurance | 100,000 cycles per sector - ensures long-term reliability in field-updatable embedded systems |
| Data Retention | 20 years minimum - validated across industrial-plus temperature range (–40 °C to +105 °C) |
| ECC | Internal hardware single-bit correction - eliminates need for external error-handling logic in safety-critical boot paths |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption |
| Temperature Range | AEC-Q100 Grade 2 (–40 °C to +105 °C) - qualified for engine bay and ADAS ECU deployment |
Pinout & Package
Available in Pb-free 16-lead SOIC (300 mil) and 24-ball BGA (6 × 8 mm, 5 × 5 ball footprint). Pin functions are identical across packages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock | Input clock driving SPI timing; supports up to 133 MHz SDR or 80 MHz DDR operation |
| SI / IO0 | Serial Input / I/O Line 0 | Primary data input in standard SPI; bidirectional in Quad I/O mode for address/data transfer |
| SO / IO1 | Serial Output / I/O Line 1 | Primary data output in standard SPI; bidirectional in Quad I/O mode for high-speed read bursts |
| WP# / IO2 | Write Protect / I/O Line 2 | Hardware lock for status register and sector protection; configurable as general-purpose I/O in multi-I/O mode |
| IO3 / RESET# | I/O Line 3 / Reset | Reset input resets internal state machines; repurposed as I/O line during normal operation |
| VCC | Power Supply | 1.7–2.0 V core supply; decoupling required within 10 mm of pin per layout guidelines |
| VSS | Ground | Signal and power return path; separate VSS pins provided for noise isolation in BGA package |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput - reduces boot time by >40% vs. legacy SPI flash in automotive ECUs |
| Hybrid Sector Architecture | Eight 4 KB + one 224 KB sectors at top/bottom - enables fine-grained OTA update partitioning without wasting space |
| OTP Array (1024 bytes) | Immutable secure silicon region - stores cryptographic keys and device-specific calibration data resistant to reprogramming |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking - prevents unauthorized firmware modification while allowing selective field updates |
| SFDP & CFI Support | Standardized parameter discovery - enables automatic driver initialization without hard-coded timing or geometry assumptions |
Applications
| Automotive ADAS Boot Storage | Industrial PLC Firmware |
|---|---|
Use Scenario: Storing boot code and safety monitor firmware for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary non-volatile boot memory mapped to MCU XIP interface; delivers deterministic <50 µs sector erase latency for fail-safe recovery. Use Value: Hardware ECC and ASP prevent corruption-induced boot failures; 20-year retention ensures lifetime reliability without field replacement. | Use Scenario: Holding firmware and configuration data for programmable logic controllers operating in factory automation environments. IC Role / Device Role / Timing Role: SPI-connected configuration store accessed during cold start and runtime parameter reload; supports hot-swappable module updates. Use Value: Hybrid sector layout allows independent update of I/O driver binaries (4 KB) and main kernel (224 KB); 100K-cycle endurance sustains daily reprogramming. |
| Medical Imaging System BIOS | Smart Grid Communication Module |
Use Scenario: Secure storage of diagnostic boot loader and regulatory-compliant calibration tables in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: Trusted execution root-of-trust component; OTP array holds asymmetric key pairs used for signature verification. Use Value: Password-locked ASP blocks unauthorized BIOS modification; SFDP enables plug-and-play driver compatibility across OEM platforms. | Use Scenario: Firmware storage for DLMS/COSEM-compliant smart meter communication modules deployed in outdoor substations. IC Role / Device Role / Timing Role: SPI flash interfaced to ARM Cortex-M4 host; supports remote firmware upgrades over RF mesh networks. Use Value: Deep power-down current (6 µA) extends battery life during network sleep cycles; industrial-plus temp rating ensures operation at 85 °C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI000 | 128 MB density, same 1.8 V supply and SOIC/BGA packaging; lacks DDR Quad I/O and ASP features | Supports basic SPI boot but not high-throughput ADAS firmware streaming or password-protected sector locking | Select when cost sensitivity outweighs DDR performance and advanced security requirements |
| Winbond W25Q128JVSIM | 128 MB, 3 V supply only; no AEC-Q100 qualification; supports QPI but not DDR mode | Limited to commercial/industrial use; incompatible with 1.8 V SoCs and automotive thermal profiles | Choose only for non-automotive designs where voltage and qualification constraints do not apply |
Compared with S25FL128SAGMFI000 and W25Q128JVSIM, the S70FS01GSAGMFI010 uniquely delivers DDR-enabled throughput, AEC-Q100 Grade 2 qualification, and hardware-enforced ASP-making it the sole option for safety-critical automotive boot storage requiring both speed and tamper resistance.
Availability
S70FS01GSAGMFI010 is available at Aetrix Electronics and suitable for automotive ADAS systems, industrial PLCs, medical imaging devices, and smart grid infrastructure requiring stable component supply, long lifecycle assurance, and AEC-Q100-compliant flash memory.
Supply support for S70FS01GSAGMFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FS-S Flash product line delivers high-reliability, feature-rich serial NOR flash targeting automotive boot code, industrial firmware, and secure configuration storage-with emphasis on AEC-Q100 qualification, ECC integrity, and SPI-MIO interoperability.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S70FS01GSAGMFI010 supports DDR Quad I/O operation at up to 80 MHz, delivering 80 MBps effective read throughput. This is specified under AC characteristics section 6.5 of the official datasheet (Rev. *G), with timing validated across the full industrial-plus temperature range and 1.7–2.0 V supply.
Does this part support 32-bit addressing for memory spaces larger than 16 MB?
Yes, the device supports extended 32-bit addressing via the Bank Address Register (BAR) and 4-byte address instructions, enabling full 1 Gb address space access. This capability is documented in Section 8.1 (Address Space Maps) and confirmed in Command Set Summary (Section 10.1) of the datasheet.
How is the 1024-byte OTP array protected from accidental overwrite?
The OTP array is write-locked after initial programming and cannot be erased or rewritten. Access requires issuing the proper One-Time Program command sequence with correct unlock keys; subsequent attempts without valid authentication return status register error flags, preventing unintended modification.
Can the WP# pin be used as a general-purpose I/O during normal operation?
Yes, WP# functions as IO2 in Multi-I/O mode and is fully bidirectional. When not actively asserting hardware write protection, it operates as a standard I/O line compatible with SPI-MIO command subsets. Configuration is controlled via Status Register bit SRWD and Configuration Register bits CR1[1:0].
S70FS01GSAGMFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S70FS01GSAGMFI010 FAQ
1.How can I place an order for S70FS01GSAGMFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSAGMFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSAGMFI010 reliable?
The price and inventory of S70FS01GSAGMFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSAGMFI010 is usually 5 days.
3.What payment methods are accepted for S70FS01GSAGMFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSAGMFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSAGMFI010?
S70FS01GSAGMFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSAGMFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSAGMFI010?
For technical support, including S70FS01GSAGMFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSAGMFI010 requirements.
6.How does Aetrix verify that S70FS01GSAGMFI010 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSAGMFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSAGMFI010 meets industry standards.
7.What is the process for return or replacement of S70FS01GSAGMFI010?
All S70FS01GSAGMFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSAGMFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSAGMFI010 part is unused and in its original packaging.
Return procedure for S70FS01GSAGMFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FS01GSAGMFI010 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
