Infineon Technologies S70FS01GSDSBHI213
- Part No.:
- S70FS01GSDSBHI213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSDSBHI213.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,139
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S70FS01GSDSBHI213 from Infineon is a 1 Gb (128 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V single-supply operation, and industrial temperature range (–40 °C to +85 °C). It supports DDR Quad I/O read at 80 MHz (80 MBps), 256/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options for embedded boot and firmware storage.
For engineers reviewing the S70FS01GSDSBHI213 datasheet, S70FS01GSDSBHI213 pinout, S70FS01GSDSBHI213 application, or S70FS01GSDSBHI213 equivalent, key selection criteria include SPI-MIO timing compliance, 24-/32-bit addressing support, SFDP/CFI configuration capability, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-die SRAM-based control logic and mirrored bit-line array for high endurance and data retention. It executes serial command protocols across SPI clock modes 0 and 3, supports QPI mode for burst wrap reads, and integrates dedicated ECC circuitry correcting single-bit errors on-the-fly during read operations.
The flash supports both hybrid sector layout (eight 4 KB + one 224 KB sectors at top/bottom) and uniform 256 KB block erase, with program/erase suspend-resume functionality and OTP-based secure silicon region. Configuration is managed via Status Register, Configuration Register, and SFDP tables accessible over SPI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and parameter storage in automotive ECUs and industrial controllers. |
| Interface | SPI Multi-I/O with DDR Quad I/O - enables 80 MBps read throughput using four bidirectional data lines and double-data-rate clocking. |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces power consumption in always-on subsystems. |
| Erase Endurance | 100,000 cycles per sector - ensures long-term reliability for field-updatable firmware partitions subject to frequent reprogramming. |
| Data Retention | 20 years minimum - guarantees nonvolatile storage integrity across product lifecycle without refresh in automotive and industrial environments. |
| Temperature Range | –40 °C to +85 °C (Industrial) - validated for under-hood ECU and factory automation controller deployment. |
| Package | 16-lead SOIC 300 mil - surface-mount compatible with standard PCB assembly processes and legacy footprint reuse. |
Pinout & Package
16-lead SOIC (300 mil) package with standard SPI-MIO pin assignment and dedicated RESET#/IO3 and WP#/IO2 dual-function terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction. |
| SCK | Serial Clock | Input clock driving all SPI transfers; supports up to 133 MHz SDR and 80 MHz DDR modes. |
| SI / IO0 | Serial Input / I/O0 | Primary input for command/address/data in single-I/O mode; functions as bidirectional data lane in multi-I/O modes. |
| SO / IO1 | Serial Output / I/O1 | Primary output for read data in single-I/O mode; bidirectional in dual/quad I/O configurations. |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection; also serves as second bidirectional I/O line in multi-I/O mode. |
| RESET# / IO3 | Reset Input / I/O3 | Asynchronous reset of internal state machine; doubles as third bidirectional I/O line in quad/DDR modes. |
| VCC | Power Supply | 1.7–2.0 V core and I/O supply; decoupling required within 10 mm of pin per datasheet layout guidelines. |
| VSS | Ground | Signal and power return reference; separate analog/digital ground not required due to integrated ECC and noise-tolerant design. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty during read operations. |
| Hybrid Sector Erase | Flexible partitioning with eight 4 KB sectors plus one 224 KB sector at address boundaries-ideal for bootloader + application code separation. |
| SFDP & CFI Support | Standardized parameter discovery enabling automatic driver initialization without hard-coded timing or configuration values. |
| OTP Array (1024 B) | Immutable storage for cryptographic keys, calibration data, or device-specific identifiers resistant to field reprogramming. |
| Program/Erase Suspend | Allows background erase or program to pause and service high-priority read requests-critical for real-time system responsiveness. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic logs, and OTA update payloads in AEC-Q100 grade 3 qualified module. IC Role / Device Role / Timing Role: Primary nonvolatile firmware repository with deterministic read latency and secure boot verification via OTP. Use Value: 20-year data retention and 100K erase cycles ensure functional safety compliance over vehicle lifetime without wear leveling firmware. | Use Scenario: Holding ladder logic programs, I/O configuration tables, and firmware updates in programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: High-reliability code storage with hybrid sector layout enabling independent update of runtime vs. configuration partitions. Use Value: DDR Quad I/O read at 80 MBps accelerates boot time and reduces PLC startup delay in time-critical automation sequences. |
| Medical Imaging System Boot Memory | Networking Equipment Configuration Storage |
Use Scenario: Hosting boot loader and FPGA configuration bitstreams for MRI and CT scanner subsystems requiring traceable firmware history. IC Role / Device Role / Timing Role: Secure boot source with Advanced Sector Protection (ASP) enforcing password-controlled access to calibration parameters. Use Value: 1024-byte OTP array stores cryptographic signatures and device identity, preventing unauthorized firmware substitution. | Use Scenario: Storing switch/router configuration profiles, MAC address tables, and feature license keys in carrier-grade Ethernet equipment. IC Role / Device Role / Timing Role: Persistent configuration store with hardware write protection and SFDP-driven driver auto-configuration. Use Value: Block protection via Status Register bits prevents accidental overwrite during remote firmware upgrades over management interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI000 | 128 MB density, 1.8 V, SOIC-16, but lacks DDR Quad I/O and hybrid sector option; max Quad Read = 66 MBps. | Supports basic SPI and QPI but not DDR timing; requires software ECC handling. | Select when DDR performance and hardware ECC are not required, and legacy Cypress driver compatibility is prioritized. |
| Winbond W25Q128JVSIM | 128 MB, 3 V supply, SOIC-8; supports Quad I/O and SFDP but no DDR mode or OTP array; 1.8 V operation not supported. | Not AEC-Q100 qualified; limited to commercial temperature range (0 °C to +70 °C). | Choose only for cost-sensitive consumer applications where voltage and qualification requirements are relaxed. |
Compared with S25FL128SAGMFI000 and W25Q128JVSIM, the S70FS01GSDSBHI213 uniquely delivers DDR Quad I/O throughput, integrated hardware ECC, AEC-Q100 grade 3 qualification, and OTP-based security-all in a drop-in SOIC-16 package.
Availability
S70FS01GSDSBHI213 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging systems, and networking equipment requiring stable component supply and long-term lifecycle support.
Supply support for S70FS01GSDSBHI213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The S70FS01GSDSBHI213 belongs to Infineon's FS-S Flash family, engineered for high-reliability embedded systems demanding AEC-Q100 qualification, extended data retention, and robust security features in constrained form factors.
FAQ
Does S70FS01GSDSBHI213 support 32-bit addressing mode?
Yes, it supports both 24-bit and 32-bit extended addressing modes via the Extended Address Register (EAR), enabling access to the full 1 Gb address space beyond the traditional 16 MB limit. This is essential for large firmware images and multi-application partitioning in modern ECUs and industrial controllers.
What is the function of the RESET#/IO3 pin during normal operation?
During active SPI communication, RESET#/IO3 operates as IO3 - the third bidirectional data line in Quad I/O and DDR Quad I/O modes. Its reset function is only active when driven low asynchronously; otherwise, it participates in high-speed data transfer without interrupting ongoing transactions.
How does hardware ECC impact system-level error handling?
Hardware ECC corrects single-bit errors transparently during every read operation, eliminating the need for software-based error detection and correction routines. This reduces CPU load, avoids read latency spikes, and ensures deterministic behavior in safety-critical applications such as automotive ASIL-B systems.
Is the 16-lead SOIC package RoHS-compliant and lead-free?
Yes, the S70FS01GSDSBHI213 uses a Pb-free (lead-free) 16-lead SOIC package compliant with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), requiring bake conditioning only if exposed to ambient >60% RH for >168 hours prior to reflow.
S70FS01GSDSBHI213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 2ms
- Access Time:
- 6 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSDSBHI213 FAQ
1.How can I place an order for S70FS01GSDSBHI213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSDSBHI213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSDSBHI213 reliable?
The price and inventory of S70FS01GSDSBHI213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSDSBHI213 is usually 5 days.
3.What payment methods are accepted for S70FS01GSDSBHI213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSDSBHI213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSDSBHI213?
S70FS01GSDSBHI213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSDSBHI213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSDSBHI213?
For technical support, including S70FS01GSDSBHI213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSDSBHI213 requirements.
6.How does Aetrix verify that S70FS01GSDSBHI213 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSDSBHI213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSDSBHI213 meets industry standards.
7.What is the process for return or replacement of S70FS01GSDSBHI213?
All S70FS01GSDSBHI213 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSDSBHI213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSDSBHI213 part is unused and in its original packaging.
Return procedure for S70FS01GSDSBHI213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FS01GSDSBHI213 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

