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Infineon Technologies S70FS01GSDSBHM213
- Part No.:
- S70FS01GSDSBHM213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSDSBHM213.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,091
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Product details
Overview
S70FS01GSDSBHM213 from Infineon is a 1 Gb (128 MB) FS-S Flash memory IC supporting SPI Multi-I/O interface, 1.8 V single-supply operation, and industrial temperature range (–40 °C to +85 °C). It features DDR Quad I/O read rates up to 80 MBps, hardware ECC for single-bit error correction, and hybrid/uniform sector erase options with 100,000 program-erase cycles and 20-year data retention.
For engineers reviewing the S70FS01GSDSBHM213 datasheet, S70FS01GSDSBHM213 pinout, S70FS01GSDSBHM213 application, or S70FS01GSDSBHM213 equivalent, key selection criteria include SPI-MIO timing compliance, SFDP/CFI configuration support, ECC-enabled reliability in embedded boot storage, and AEC-Q100 grade 3 qualification for automotive infotainment systems.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-die stacking (S25FS512S ×2), enabling 1 Gb density in a compact BGA-24 package. It supports both SDR and DDR SPI protocols across clock polarity modes 0 and 3, with configurable 24-/32-bit addressing and QPI burst wrap mode.
The control logic integrates dedicated SRAM latches for command buffering, on-die ECC encoding/decoding, and programmable protection registers including OTP (1024 bytes), status register-based block protection, and password-controlled Advanced Sector Protection (ASP) for secure boot code partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and parameter storage in automotive ECUs and industrial controllers. |
| Interface | SPI Multi-I/O with DDR support - enables high-throughput boot loading and firmware updates without parallel bus overhead. |
| Read Throughput | 80 MBps (DDR Quad I/O @ 80 MHz) - reduces boot time by >3× vs. standard SPI Fast Read in real-time systems. |
| Erase Endurance | 100,000 cycles per sector - supports frequent field firmware upgrades in connected IoT gateways. |
| Data Retention | 20 years minimum at +85 °C - ensures long-term reliability in unattended infrastructure equipment. |
| Voltage Range | 1.7 V to 2.0 V - compatible with low-power 1.8 V I/O domains in modern SoC designs. |
| Temperature Grade | Industrial (–40 °C to +85 °C) - validated for deployment in factory automation PLCs and motor drives. |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm, 5 × 5 ball footprint), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction. |
| SCK | Serial Clock | Input clock for SDR/DDR SPI; supports modes 0 and 3 with configurable polarity and phase. |
| IO0 / SI | Serial Input / I/O0 | Primary data input in single/dual I/O modes; bidirectional in quad I/O and QPI modes. |
| IO1 / SO | Serial Output / I/O1 | Primary data output in single/dual I/O; bidirectional in quad I/O and QPI for full-duplex operation. |
| IO2 / WP# | Write Protect / I/O2 | Hardware write protection enable; also functions as quad I/O line when WP# disabled via status register. |
| IO3 / RESET# | Reset / I/O3 | Asynchronous reset input; doubles as quad I/O line in non-reset contexts per SPI-MIO protocol. |
| VCC | Power Supply | 1.7–2.0 V core and I/O supply; decoupling required within 5 mm of VCC/VSS pair per layout guidelines. |
| VSS | Ground | Signal and power ground reference; multiple VSS balls ensure low-impedance return path for high-speed I/O switching. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-die single-bit error correction with automatic detection and correction during read - eliminates need for external error-handling firmware layers. |
| Hybrid Sector Erase | Mixed 4 KB + 224 KB physical sectors at address boundaries - enables fine-grained parameter updates while preserving large firmware blocks. |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking - prevents unauthorized modification of bootloader or calibration data in safety-critical applications. |
| SFDP & CFI Support | Standardized parameter tables accessible via JEDEC JESD216 and Intel CFI - enables automatic driver initialization without hard-coded timing or configuration values. |
| Program/Erase Suspend | Interruptible page programming and sector erase - allows real-time system response during flash operations without timeout failures. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, firmware updates, and vehicle-specific configuration data in digital dashboards. IC Role / Device Role / Timing Role: Primary boot flash with AEC-Q100 grade 3 qualification and ECC-protected read integrity during cold-start sequences. Use Value: Ensures zero boot corruption after 100,000+ ignition cycles and maintains display fidelity over 15-year vehicle lifetime. | Use Scenario: Holding ladder logic programs, I/O mapping tables, and firmware patches in programmable logic controllers deployed in manufacturing lines. IC Role / Device Role / Timing Role: Nonvolatile program memory with hybrid sector erase enabling incremental logic updates without full reflash downtime. Use Value: Reduces maintenance window from hours to seconds by allowing live patching of control logic while machine remains operational. |
| Medical Imaging Boot Loader | Smart Energy Meter Calibration Data |
Use Scenario: Securing boot code and DICOM image processing firmware in portable ultrasound and X-ray units requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Trusted boot storage with OTP-based secure silicon region and ASP-locked bootloader partition. Use Value: Prevents tampering with diagnostic algorithms and satisfies IEC 62304 traceability requirements for firmware integrity verification. | Use Scenario: Storing metrology calibration constants, tariff tables, and firmware signatures in ANSI C12.22-compliant smart meters operating in outdoor substations. IC Role / Device Role / Timing Role: High-reliability parameter storage with 20-year data retention and ECC correction against cosmic-ray-induced bit flips. Use Value: Eliminates field recalibration visits by guaranteeing accuracy drift < ±0.1% over full product lifecycle under thermal cycling stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | 128 MB density, same 1.8 V supply, but lacks DDR mode and has lower max Quad Read rate (40 MBps vs. 80 MBps). | No DDR support limits boot speed in high-performance SoCs requiring fast firmware load. | Select when DDR is unnecessary and cost sensitivity outweighs throughput needs. |
| MX25L1G45GM2I-12G | 1 Gb density, 1.8 V, supports DDR Quad I/O, but only 50,000 erase cycles and no integrated ECC. | Requires external error-checking logic and has half the endurance for frequent OTA updates. | Choose where ECC is handled in software and update frequency is low (<1000 cycles/year). |
Compared with S25FL128SAGMFI000 and MX25L1G45GM2I-12G, the S70FS01GSDSBHM213 delivers superior boot performance via DDR Quad I/O, guaranteed ECC correction without host intervention, and double the endurance-making it optimal for automotive and industrial systems demanding long-term field reliability and rapid firmware deployment.
Availability
S70FS01GSDSBHM213 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging boot loader applications requiring stable component supply across extended product lifecycles.
Supply support for S70FS01GSDSBHM213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The FS-S Flash product line targets high-reliability embedded systems requiring secure, high-speed, and long-life nonvolatile storage-specifically designed for automotive ECU boot, industrial controller firmware, and medical device code execution.
FAQ
What is the maximum supported SPI clock frequency for DDR Quad I/O mode?
The S70FS01GSDSBHM213 supports DDR Quad I/O operation at up to 80 MHz SCK frequency, delivering 80 MBps effective read throughput. This is specified in the AC characteristics section (Table 6.5) of the official Infineon datasheet 002-03833 Rev. *G, with timing validated across the full industrial temperature range.
Does this device require external hardware for ECC correction?
No. The S70FS01GSDSBHM213 includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during every read operation. No external circuitry or host CPU intervention is needed-the correction occurs transparently within the flash die's control logic.
Can the hybrid sector erase option be configured dynamically during operation?
Yes. Hybrid sector erase behavior is determined by the physical layout of the memory array and is fixed at manufacture, but the device allows runtime selection between hybrid and uniform erase commands (0x20 vs. 0xD8) via standard SPI instructions. Sector protection settings do not affect erase mode selection.
Is the BGA-24 package compatible with standard reflow profiles for lead-free assembly?
Yes. The S70FS01GSDSBHM213 uses a Pb-free, RoHS-compliant BGA-24 package qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 3. It supports standard lead-free reflow profiles with peak temperatures up to 260 °C and is compatible with Type 3 solder paste and standard stencil thicknesses.
S70FS01GSDSBHM213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSDSBHM213 FAQ
1.How can I place an order for S70FS01GSDSBHM213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSDSBHM213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSDSBHM213 reliable?
The price and inventory of S70FS01GSDSBHM213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSDSBHM213 is usually 5 days.
3.What payment methods are accepted for S70FS01GSDSBHM213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSDSBHM213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSDSBHM213?
S70FS01GSDSBHM213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSDSBHM213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSDSBHM213?
For technical support, including S70FS01GSDSBHM213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSDSBHM213 requirements.
6.How does Aetrix verify that S70FS01GSDSBHM213 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSDSBHM213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSDSBHM213 meets industry standards.
7.What is the process for return or replacement of S70FS01GSDSBHM213?
All S70FS01GSDSBHM213 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSDSBHM213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSDSBHM213 part is unused and in its original packaging.
Return procedure for S70FS01GSDSBHM213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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