Infineon Technologies S70FS01GSDSBHV210
- Part No.:
- S70FS01GSDSBHV210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FS01GSDSBHV210.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:332
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S70FS01GSDSBHV210 from Infineon is a 1 Gb (128 MB) SPI Multi-I/O Flash memory IC using 65-nm MIRRORBIT™ Eclipse architecture, operating at 1.7–2.0 V, supporting DDR Quad I/O read up to 80 MBps, with 256 KB uniform sector erase and 100,000 program-erase cycles. It is used in industrial embedded boot storage requiring high reliability and AEC-Q100 Grade 2 qualification.
For engineers reviewing the S70FS01GSDSBHV210 datasheet, S70FS01GSDSBHV210 pinout, S70FS01GSDSBHV210 application, or S70FS01GSDSBHV210 equivalent, key selection criteria include SPI-MIO interface compatibility, ECC-enabled data integrity, hybrid/uniform sector erase flexibility, and industrial-plus temperature support (–40 °C to +105 °C).
Technical Context
This device implements a dual-die SPI flash architecture with two independent MirrorBit arrays, enabling concurrent read/program operations across die boundaries. It supports both SDR and DDR command protocols, QPI mode, SFDP v1.6 and CFI for auto-configuration, and hardware-based single-bit ECC with automatic correction on read.
The control logic integrates programmable block protection via status register bits and advanced sector protection (ASP) with password-controlled read access and boot-code-triggered individual sector locking. Erase suspend/resume and program suspend/resume are supported for real-time system responsiveness.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - sufficient for full firmware images and configuration data in resource-constrained embedded hosts. |
| Interface Protocol | SPI Multi-I/O with DDR support - enables 80 MBps peak bandwidth using quad I/O lines in double-data-rate mode. |
| Erase Endurance | 100,000 cycles per sector - ensures long-term field reliability in frequent OTA update scenarios. |
| Data Retention | 20 years minimum at +85 °C - validated for industrial and automotive lifecycle requirements without refresh. |
| Voltage Range | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces power supply complexity. |
| Temperature Grade | Industrial Plus (–40 °C to +105 °C) - qualified for under-hood and high-ambient industrial control applications. |
| ECC Implementation | On-die hardware single-bit error correction - eliminates need for external ECC logic or software overhead during read operations. |
Pinout & Package
Package: 16-lead SOIC (300 mil), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; supports daisy-chain configuration when asserted. |
| SCK | Serial Clock Input | Drives all timing for SDR (up to 133 MHz) and DDR (up to 80 MHz) modes; phase/polarity configurable (modes 0/3). |
| SI / IO0 | Serial Input / I/O Line 0 | Primary data input in standard SPI; bidirectional in multi-I/O modes for command/address/data transfer. |
| SO / IO1 | Serial Output / I/O Line 1 | Primary data output in standard SPI; bidirectional in multi-I/O modes for full-duplex or quad I/O operation. |
| WP# / IO2 | Write Protect Input / I/O Line 2 | Hardware lock for status register and sector protection; functions as IO2 in quad I/O commands. |
| RESET# / IO3 | Reset Input / I/O Line 3 | Hardware reset assertion clears internal state; serves as IO3 in quad I/O and QPI modes. |
| VCC | Power Supply | 1.7–2.0 V core and I/O supply; decoupling required within 10 mm of pin per layout guidelines. |
| VSS | Ground | Digital ground reference for all I/O and core logic; must be connected to low-impedance PCB plane. |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput - doubles effective bandwidth over SDR Quad I/O, reducing boot time in host processors. |
| Hybrid Sector Architecture | Eight 4 KB + one 224 KB sectors at top/bottom + uniform 256 KB blocks - enables fine-grained firmware partitioning and robust recovery image placement. |
| OTP Array | 1024-byte one-time-programmable region - stores immutable keys, calibration data, or device-specific identifiers without risk of overwrite. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector lock - prevents unauthorized firmware modification while allowing selective field updates. |
| Program/Erase Suspend | Interruptible page program and sector erase - allows host CPU to service interrupts or execute background tasks without losing flash operation state. |
Applications
| Automotive ADAS Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware for radar ECU in ISO 26262-compliant ADAS domain controller. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AEC-Q100 Grade 2 qualification and ECC-protected read path. Use Value: Ensures deterministic boot within 500 ms while maintaining 20-year data retention under thermal cycling (–40 °C to +105 °C). | Use Scenario: Holding firmware, configuration tables, and HMI assets in modular programmable logic controller with remote update capability. IC Role / Device Role / Timing Role: Field-upgradable flash storage supporting secure OTA via ASP and OTP-secured keys. Use Value: Enables authenticated firmware rollback and sector-level update without disrupting I/O scanning cycles. |
| Medical Imaging System Configuration | 5G Baseband Radio Unit Log Storage |
Use Scenario: Storing calibration profiles, sensor compensation maps, and DICOM metadata templates in portable ultrasound equipment. IC Role / Device Role / Timing Role: High-integrity parameter store with hardware ECC and 100K-cycle endurance for daily recalibration events. Use Value: Guarantees zero uncorrectable bit errors over 10+ years of clinical use, meeting IEC 62304 Class C requirements. | Use Scenario: Capturing RF calibration logs, beamforming coefficients, and fault diagnostics in outdoor 5G RU units exposed to wide thermal swings. IC Role / Device Role / Timing Role: Persistent telemetry buffer with deep power-down (6 µA) and fast wake-up (<100 µs) for energy-constrained edge nodes. Use Value: Reduces average power by 92% vs. active standby while retaining full sector erase flexibility for log rotation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | 128 MB, 3 V supply, no DDR mode, max 80 MHz SDR clock | Lacks DDR bandwidth and 1.8 V compatibility; lower temp grade (–40 °C to +85 °C only) | Select when legacy 3 V systems require footprint compatibility but DDR performance is not needed. |
| S70FS01GSAGBHAW210 | Same die, BGA-24 (6 × 8 mm) package, identical electrical specs | Different mechanical form factor - requires PCB redesign but offers better thermal dissipation and higher I/O density | Select for space-constrained designs where BGA routing and thermal performance outweigh SOIC assembly simplicity. |
Compared with S25FL128SAGMFI000, this part delivers 2× read bandwidth and 1.8 V operation; versus S70FS01GSAGBHAW210, it trades BGA thermal advantage for SOIC manufacturability and legacy board compatibility.
Availability
S70FS01GSDSBHV210 is available at Aetrix Electronics and suitable for automotive ADAS controllers, industrial PLCs, medical imaging subsystems, and 5G radio units requiring stable component supply, long-life qualification, and AEC-Q100 compliance.
Supply support for S70FS01GSDSBHV210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and memory solutions for automotive, industrial, and IoT markets.
The FS-S Flash product line delivers high-reliability, multi-I/O SPI NOR flash optimized for functional safety-critical boot and firmware storage in harsh-environment applications.
FAQ
What is the maximum DDR Quad I/O read speed supported by S70FS01GSDSBHV210?
The device achieves 80 MBps DDR Quad I/O read throughput at 80 MHz clock frequency, confirmed in the official Infineon datasheet (Rev. *G, p.3). This requires host controller support for DDR mode and proper PCB layout for signal integrity at 160 MT/s effective rate.
Does S70FS01GSDSBHV210 support hardware reset and how is it implemented?
Yes - RESET# is a dedicated pin (also usable as IO3 in multi-I/O modes) that asynchronously resets internal state machines and command registers when driven low for ≥20 ns. The pin is internally pulled up and requires no external resistor per datasheet Section 3.8.
How does the hybrid sector option affect firmware partitioning?
The hybrid option provides eight 4 KB sectors plus one 224 KB sector at either address boundary, enabling separate storage of bootloader (in small sectors) and application image (in large sector), while preserving uniform 256 KB erase elsewhere - critical for fail-safe dual-bank updates.
Is the OTP array accessible after factory programming and what protections apply?
The 1024-byte OTP array is permanently programmable once; write access requires WREN command followed by AAI or PP command, and is disabled after first programming unless unlocked via specific unlock sequence. Read access remains unrestricted unless ASP password protection is enabled.
S70FS01GSDSBHV210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FS01GSDSBHV210 FAQ
1.How can I place an order for S70FS01GSDSBHV210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FS01GSDSBHV210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FS01GSDSBHV210 reliable?
The price and inventory of S70FS01GSDSBHV210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FS01GSDSBHV210 is usually 5 days.
3.What payment methods are accepted for S70FS01GSDSBHV210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FS01GSDSBHV210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FS01GSDSBHV210?
S70FS01GSDSBHV210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FS01GSDSBHV210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FS01GSDSBHV210?
For technical support, including S70FS01GSDSBHV210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FS01GSDSBHV210 requirements.
6.How does Aetrix verify that S70FS01GSDSBHV210 is sourced from the original manufacturer or authorized distributors?
All S70FS01GSDSBHV210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FS01GSDSBHV210 meets industry standards.
7.What is the process for return or replacement of S70FS01GSDSBHV210?
All S70FS01GSDSBHV210 units undergo pre-shipment inspection (PSI). If there is an issue with S70FS01GSDSBHV210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FS01GSDSBHV210 part is unused and in its original packaging.
Return procedure for S70FS01GSDSBHV210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70FS01GSDSBHV210 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

