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Infineon Technologies S70GL02GS11FHB010
- Part No.:
- S70GL02GS11FHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHB010.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,014
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Product details
Overview
S70GL02GS11FHB010 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GS devices in a single 64-ball Fortified-BGA package. It delivers 110 ns random access time, 25 ns page access time, and supports 512-byte buffer programming for embedded boot code storage in industrial controllers, automotive ECUs, and network equipment.
For engineers reviewing the S70GL02GS11FHB010 datasheet, S70GL02GS11FHB010 pinout, S70GL02GS11FHB010 application, or S70GL02GS11FHB010 equivalent, key selection factors include uniform 128-KB sector erase architecture, Versatile I/O™ supporting 1.65 V–3.6 V VIO, AEC-Q100 Grade 2/3 qualification, CFI compliance, and OTP array with dual lockable regions.
Technical Context
This device implements a dual-die parallel NOR architecture where address line A26 selects between two 1-Gb die, enabling contiguous 2-Gb addressing. Each die mirrors the S29GL01GS specification, sharing common control signals (CE#, OE#, WE#, RESET#) while maintaining independent status reporting via RY/BY#.
It uses CMOS 3.0 V core with Versatile I/O™, allowing independent VCC (2.7–3.6 V) and VIO (1.65–VCC) supply rails. Programming employs a 512-byte write buffer with page-multiple alignment, and sector erase targets uniform 128-KB sectors-2048 total-with suspend/resume capability for both program and erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gbit (256 MB), implemented as dual 1-Gb die stacked in single package |
| Access time | 110 ns random access; enables fast instruction fetch in boot ROM applications |
| Page access time | 25 ns; reduces latency during sequential read from page buffer |
| Programming buffer | 512 bytes; allows single-command multi-word writes, improving effective throughput to 1.5 MBps |
| Sector size & count | Uniform 128 KB × 2048 sectors; simplifies firmware partitioning and OTA update management |
| Data retention | 20 years typical; ensures long-term reliability in unpowered storage |
| Erase endurance | 100,000 cycles per sector; supports frequent field firmware updates |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive use |
Pinout & Package
Package: 64-ball LSH Fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad exposed on bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A26–A0 | Address inputs | A26 selects top/bottom 1-Gb die; A25–A0 provide 26-bit addressing for full 2-Gb space |
| DQ15–DQ0 | Data I/O bus | 16-bit bidirectional data path; supports x16 mode only (no x8/x32 configuration) |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard parallel NOR control trio; CE# must be low for any operation |
| RY/BY# | Ready/Busy output | Active-low open-drain signal indicating ongoing program/erase; used for polling or interrupt |
| WP# | Write Protect input | Hardware sector protection override: VIL locks outermost sectors; VHH enables unlock-bypass acceleration |
| RESET# | Hardware reset | Asynchronous active-low reset; returns device to read mode and clears internal state |
| VCC / VIO / VSS | Power supplies | VCC = 2.7–3.6 V core; VIO = 1.65–VCC I/O; VSS = common ground reference |
| RFU / DNU / NC | Reserved/Do Not Use/No Connect | Balls F7/G1 (RFU), E1 (DNU), and A1/A8/C1/D1/H1/H8 (NC) must not be routed or driven |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Single-package 2-Gb capacity without external interconnect; eliminates board routing complexity and timing skew |
| Versatile I/O™ | Independent VIO rail allows direct interfacing with 1.8 V or 3.3 V host processors without level shifters |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector; prevents accidental firmware overwrite during field updates |
| OTP array | 1024-byte one-time-programmable region split into two lockable blocks; stores secure keys or calibration data |
| CFI support | Standard Common Flash Interface enables automatic driver detection and configuration in U-Boot/Linux systems |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, safety-critical firmware, and calibration maps in engine management systems. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with AEC-Q100 Grade 2 qualification and 105°C operation. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity over vehicle lifetime without refresh. | Use Scenario: Holding real-time OS kernel, ladder logic programs, and I/O configuration in programmable logic controllers. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic <110 ns instruction fetch for hard real-time execution. Use Value: Uniform 128-KB sectors simplify firmware partitioning and enable atomic OTA updates with sector-level rollback. |
| Telecom Base Station Boot ROM | Medical Imaging System Configuration |
Use Scenario: Hosting boot code and FPGA configuration bitstreams in 5G radio units requiring rapid cold start. IC Role / Device Role / Timing Role: High-speed parallel interface delivering 1.5 MBps buffered programming for fast field upgrades. Use Value: 25 ns page access time minimizes boot latency; CFI compatibility ensures plug-and-play integration with standard BIOS. | Use Scenario: Storing DICOM metadata templates, sensor calibration profiles, and regulatory compliance flags in MRI/CT scanners. IC Role / Device Role / Timing Role: Secure nonvolatile storage with OTP array for immutable medical device identifiers and audit logs. Use Value: Dual-lockable OTP regions prevent unauthorized modification of FDA-required traceability data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1 Gbit version; identical 65-nm process, same pinout but no A26 die-select function | Lacks dual-die density; suitable only where <2 Gb storage suffices and board layout accommodates separate die | Select when cost sensitivity outweighs density need and A26 routing can be omitted |
| MX29GL256FHT2I-90G | 2 Gbit Macronix device; 90 ns random access, no Versatile I/O™, requires fixed 3.3 V I/O, no OTP array | Lower performance, no 1.8 V interface support, no hardware-based secure storage capability | Choose only if legacy 3.3 V-only system design precludes VIO flexibility and OTP is unnecessary |
Compared with S29GL01GS11FHIV10, this part doubles density in same footprint and adds die-select control; versus MX29GL256FHT2I-90G, it offers faster access, wider I/O voltage range, and integrated OTP security-critical for automotive and medical use cases.
Availability
S70GL02GS11FHB010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and telecom base station manufacturing requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70GL02GS11FHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
This device belongs to the GL-S family of parallel NOR flash products, designed specifically for mission-critical embedded applications demanding AEC-Q100 qualification, deterministic timing, and long-term data integrity in harsh environments.
FAQ
What is the purpose of the A26 address line on S70GL02GS11FHB010?
A26 serves as the die-select signal in this dual-die stacked device: when A26 = 0, the lower 1-Gb die (addresses 0x0000000–0x07FFFFFF) is accessed; when A26 = 1, the upper 1-Gb die (0x08000000–0x0FFFFFFF) responds. This enables seamless 2-Gb addressing without external multiplexing or glue logic, preserving standard NOR interface timing.
Does S70GL02GS11FHB010 support x8 data bus mode?
No. The device is strictly x16-configured with DQ15–DQ0 as the sole data interface. There is no x8 mode support, no byte-enable pins, and no internal data width configuration register. Systems requiring x8 interfaces must use level-shifting or external demultiplexing, which is not recommended due to timing and reliability constraints specified in the datasheet.
How does the Versatile I/O™ feature affect PCB design?
Versatile I/O™ decouples VIO from VCC, allowing VIO to operate from 1.65 V to VCC. This permits direct connection to 1.8 V or 3.3 V host processors without external level shifters. PCB layout must maintain separate VIO and VCC power planes with local decoupling, and VIO must never exceed VCC. The feature eliminates signal integrity risks associated with voltage translation circuits.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is physically one-time programmable: once a bit is set to '0', it cannot be reverted to '1'. Each of the two lockable regions can be permanently locked via dedicated status bits, preventing further writes. This ensures cryptographic keys or regulatory IDs remain immutable after factory programming, meeting ISO 26262 ASIL-B and IEC 62304 Class C requirements.
S70GL02GS11FHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHB010 FAQ
1.How can I place an order for S70GL02GS11FHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHB010 reliable?
The price and inventory of S70GL02GS11FHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHB010 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHB010?
S70GL02GS11FHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHB010?
For technical support, including S70GL02GS11FHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHB010 requirements.
6.How does Aetrix verify that S70GL02GS11FHB010 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHB010 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHB010?
All S70GL02GS11FHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHB010 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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