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Infineon Technologies S70GL02GS11FHB013
- Part No.:
- S70GL02GS11FHB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHB013.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,554
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Product details
Overview
S70GL02GS11FHB013 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ process, featuring 110 ns random access time, 25 ns page access time, and uniform 128-KB sectors across 2048 sectors. It operates from a single 2.7–3.6 V supply, supports 1.65–VCC versatile I/O voltage, and integrates a 512-byte programming buffer for accelerated write operations in embedded automotive and industrial control systems.
For engineers reviewing the S70GL02GS11FHB013 datasheet, S70GL02GS11FHB013 pinout, S70GL02GS11FHB013 application, or S70GL02GS11FHB013 equivalent, key selection criteria include sector erase granularity (128 KB), AEC-Q100 Grade 2/3 qualification, Fortified-BGA 64-ball package compatibility, and CFI-compliant interface for boot code storage and firmware update in safety-critical platforms.
Technical Context
This dual-die stacked device combines two S29GL01GS 1-Gb dies in a single package, enabling 2-Gb density while retaining discrete die architecture-address lines A0–A25 serve both dies, with A26 selecting between them. Memory mapping uses uniform 128-KB sectors (64 Kwords), supporting full CFI compliance for host system auto-configuration and status monitoring via RY/BY#, data polling, and Status Register reads.
The device implements Advanced Sector Protection (ASP) with volatile/non-volatile locking per sector, plus a dedicated 1024-byte OTP array split into two lockable regions. Write acceleration and hardware write protection are controlled via WP# at VHH/VIL, independent of ASP settings, ensuring robust firmware integrity during field updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gbit (256 MB), realized as dual 1-Gb S29GL01GS dies stacked in one package |
| Access Time | 110 ns random access, 25 ns page access - enables fast instruction fetch in boot ROM applications |
| Supply Voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage SoC interfacing without level shifters |
| Sector Size | Uniform 128 KB (64 Kwords) - simplifies firmware partitioning and OTA update management |
| Endurance & Retention | 100,000 erase cycles per sector; 20-year data retention - meets long-life requirements in automotive ECUs |
| Temperature Range | Industrial (–40°C to +85°C) and AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood use |
| Programming Buffer | 512-byte page buffer - reduces effective programming time by >5× vs. byte-wise writes |
Pinout & Package
Package: 64-ball LSH Fortified BGA, 13 mm × 11 mm, RoHS-compliant, with special handling requirements (no ultrasonic cleaning; max 150°C exposure).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Input | 26-bit address bus for 64-MB addressing space per die; A26 selects top/bottom die |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports x16 mode only - no x8/x32 fallback |
| CE#, OE#, WE# | Control Inputs | Standard parallel flash control signals; CE# enables chip, OE# gates output, WE# initiates write/erase |
| RY/BY# | Status Output | Open-drain ready/busy indicator - low during active program/erase, high-Z when idle |
| WP# | Protection Input | Hardware write protect: VIL locks outermost sectors; VHH enables unlock-bypass programming acceleration |
| RESET# | Asynchronous Reset | Pulls device into reading state; required for recovery after power-on or error conditions |
| VCC / VIO / VSS | Power & Ground | VCC powers core logic; VIO sets I/O voltage domain; separate VSS pins reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Two fully independent S29GL01GS dies in single BGA footprint - doubles density without increasing PCB area |
| Versatile I/O™ | VIO range 1.65 V to VCC - eliminates external level shifters when interfacing with 1.8 V or 3.3 V controllers |
| Advanced Sector Protection | Volatile and non-volatile locking per 128-KB sector - enables secure bootloader and parameter storage zones |
| OTP array | 1024-byte one-time-programmable memory with two lockable regions - stores calibration data or security keys permanently |
| Suspend/Resume | Interruptible program and erase operations - allows real-time response to higher-priority CPU tasks |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated engine maps in diesel/gasoline ECU modules requiring AEC-Q100 Grade 2 operation up to +105°C. IC Role / Device Role / Timing Role: Primary non-volatile boot ROM and firmware image storage with deterministic 110 ns read latency for real-time instruction fetch. Use Value: 20-year data retention and 100K erase cycles ensure functional safety compliance over vehicle lifetime without field recalls. | Use Scenario: Holding firmware, configuration tables, and diagnostic logs in modular programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Parallel NOR flash used for XIP (eXecute-In-Place) execution of control logic and persistent storage of user-defined ladder logic. Use Value: Uniform 128-KB sectors simplify firmware delta updates; suspend/resume enables deterministic response during I/O interrupt servicing. |
| Medical Imaging System Boot Memory | Avionics Data Recorder |
Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in CT/MRI subsystems where radiation tolerance and long-term reliability are critical. IC Role / Device Role / Timing Role: High-reliability boot memory with CFI support for automatic initialization by host processor during cold start. Use Value: Dual-die architecture provides redundancy margin; OTP array stores device-specific calibration coefficients securely. | Use Scenario: Recording flight-critical telemetry and sensor logs in black box recorders operating across –40°C to +85°C with extended shelf life. IC Role / Device Role / Timing Role: Non-volatile storage for cyclic overwrite buffers and permanent event markers using sector-erase granularity. Use Value: 128-KB sector size aligns with aviation data packet boundaries; AEC-Q100 Grade 3 qualification ensures DO-160 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1 Gbit version in same 64-ball Fortified BGA; identical timing, voltage, and feature set except density | Used where 128 MB suffices and cost-per-bit optimization is prioritized over future scalability | Select when board layout rework is prohibited and density headroom is not required |
| MX29GL256FHT2I-90G | Macronix 256-MB parallel NOR; 90 ns access time, 3.0 V only (no VIO flexibility), no AEC-Q100 qualification | Suitable for commercial-grade industrial gateways but not automotive or avionics | Choose only for cost-sensitive non-automotive designs lacking temperature or qualification requirements |
Compared with S29GL01GS11FHIV10, the S70GL02GS11FHB013 delivers double density in identical footprint and thermal envelope; versus MX29GL256FHT2I-90G, it adds AEC-Q100 Grade 2, VIO flexibility, and dual-die reliability-critical for safety-certified systems.
Availability
S70GL02GS11FHB013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and medical imaging system boot memory applications requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GS11FHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
The GL-S series targets automotive and industrial embedded applications requiring AEC-Q100 qualification, long data retention, and deterministic parallel NOR performance for boot code and firmware storage.
FAQ
What is the function of the A26 address line on S70GL02GS11FHB013?
A26 serves as the die select signal in this dual-die stacked device. When A26 = 0, the lower 1-Gb die (S29GL01GS) is accessed; when A26 = 1, the upper 1-Gb die is selected. This enables contiguous 2-Gb addressing across both dies using standard parallel flash protocol without external multiplexing.
Does S70GL02GS11FHB013 support x8 data bus mode?
No. The device is strictly x16-only: DQ0–DQ15 form a fixed 16-bit bidirectional data bus. There is no x8 mode support, no BYTE# pin, and no internal data width configuration register. System design must allocate a full 16-bit data path and handle 16-bit aligned accesses.
How does the WP# pin operate in S70GL02GS11FHB013?
WP# has three operational states: at VIL (≤0.4 V), it disables program/erase in outermost sectors regardless of ASP settings; at VHH (≈VCC+2 V, applied via external circuit), it enables unlock-bypass mode for accelerated programming; at VIH (≥0.7×VCC), it is inactive and ASP controls protection. No pull-up/pull-down is internal-external biasing is required.
Is the 64-ball Fortified BGA package reflow-compatible with standard lead-free profiles?
Yes-the LSH064 package is qualified for JEDEC J-STD-020D-compliant lead-free reflow, with peak temperature ≤260°C for ≤60 seconds. However, ultrasonic cleaning is strictly prohibited post-reflow, and prolonged exposure above 150°C (e.g., during conformal coating cure) may compromise data integrity or solder joint reliability.
S70GL02GS11FHB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHB013 FAQ
1.How can I place an order for S70GL02GS11FHB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHB013 reliable?
The price and inventory of S70GL02GS11FHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHB013 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHB013?
S70GL02GS11FHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHB013?
For technical support, including S70GL02GS11FHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHB013 requirements.
6.How does Aetrix verify that S70GL02GS11FHB013 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHB013 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHB013?
All S70GL02GS11FHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHB013 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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