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Infineon Technologies S70GL02GS11FHI010
- Part No.:
- S70GL02GS11FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHI010.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,942
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Product details
Overview
S70GL02GS11FHI010 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ technology, featuring 128-KB uniform sectors, 110 ns random access time, and 25 ns page access time. It operates from a single 2.7–3.6 V supply, supports Versatile I/O™ with 1.65–VCC VIO range, and integrates dual S29GL01GS die in one package for embedded boot code and firmware storage in automotive and industrial controllers.
For engineers reviewing the S70GL02GS11FHI010 datasheet, S70GL02GS11FHI010 pinout, S70GL02GS11FHI010 application, or S70GL02GS11FHI010 equivalent, key selection criteria include sector erase endurance (100,000 cycles), data retention (20 years), AEC-Q100 Grade 2/3 qualification, 512-byte programming buffer throughput (1.5 MBps), and Fortified-BGA 64-ball mechanical compatibility.
Technical Context
This device implements a dual-die stacked architecture-two independent 1-Gb S29GL01GS dies sharing address/data bus and control signals-with dedicated A26 address bit enabling inter-die selection. It uses MIRRORBIT™ charge-trap technology to achieve high density and reliability without floating-gate scaling limitations.
The memory supports three sector protection modes (volatile/non-volatile ASP), hardware write protection via WP#, suspend/resume for program/erase operations, and status monitoring via Ready/Busy pin, Status Register, and data polling-enabling robust firmware update and fail-safe boot execution in real-time systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gbit (256 MB), dual-die stack of two 1-Gb S29GL01GS devices |
| Access Time | 110 ns random access, 25 ns page access - enables fast instruction fetch in MCU boot ROM |
| Sector Size | 128 KB uniform sectors (2048 total) - simplifies firmware partitioning and OTA update management |
| Programming Buffer | 512-byte page buffer - reduces effective programming time vs. byte/word writes |
| Erase Endurance | 100,000 cycles per sector - supports frequent field firmware updates in industrial gateways |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended edge devices |
| Supply Range | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows flexible I/O voltage matching with host SoC interfaces |
Pinout & Package
Package: 64-ball LSH Fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad and reinforced solder joint structure for automotive-grade thermal cycling reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A26 | Address Inputs | A26 selects between upper/lower 1-Gb die; A0–A25 address within selected die |
| DQ0–DQ15 | Data I/O Bus | 16-bit bidirectional data path for instruction/code read and firmware write operations |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard parallel NOR control signals; support asynchronous read/write timing |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating active erase/program operation |
| WP# | Hardware Write Protect | Protects outermost sectors regardless of ASP settings; prevents accidental firmware corruption |
| RESET# | Hardware Reset | Forces device into reading array mode; used during power-on initialization or error recovery |
| VCC / VIO / VSS | Power Supplies | VCC powers core logic; VIO sets I/O voltage level independently for mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Single-package 2-Gb capacity using two 1-Gb S29GL01GS dies - eliminates multi-chip routing complexity |
| Versatile I/O™ | VIO range 1.65 V to VCC - enables direct interface with 1.8 V, 2.5 V, or 3.3 V host processors |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 128-KB sector - supports secure bootloader and application partitioning |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data |
| CFI Support | Common Flash Interface compliant - enables automatic detection and configuration by BIOS/bootloader |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver-assist firmware, and boot code in digital dashboards. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary boot ROM and persistent firmware store. Use Value: AEC-Q100 Grade 2 rating (–40°C to +105°C) and 20-year data retention ensure reliability across vehicle lifetime. | Use Scenario: Holding ladder logic programs, configuration parameters, and safety-critical firmware in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile memory for deterministic boot and runtime firmware execution. Use Value: 100,000 erase cycles and suspend/resume capability allow safe field updates without system downtime. |
| Medical Imaging Boot Loader | Telecom Base Station Control Code |
Use Scenario: Hosting secure boot firmware and FPGA configuration images in MRI/CT subsystem controllers. IC Role / Device Role / Timing Role: Trusted code storage with hardware write protection and OTP key storage. Use Value: WP# and sector-level ASP prevent unauthorized modification; OTP region stores asymmetric keys for secure boot validation. | Use Scenario: Storing baseband processor microcode, calibration tables, and protocol stacks in 4G/5G radio units. IC Role / Device Role / Timing Role: High-reliability parallel flash for carrier-grade firmware persistence. Use Value: 110 ns random access and 1.5 MBps buffer programming meet strict boot latency and update bandwidth requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1-Gb version; identical 64-ball Fortified BGA footprint and pinout | Lacks dual-die stacking; half capacity; same timing and voltage specs | Select when 128 MB suffices and board layout must reuse same footprint |
| MX29GL256FHT2I-90G | 2-Gb Macronix parallel NOR; 90 ns max tACC; no AEC-Q100 qualification | Not automotive-qualified; lacks OTP array and dual-die interleave capability | Consider for cost-sensitive industrial applications where AEC-Q100 is not required |
Compared with S29GL01GS11FHIV10, this part doubles density without footprint change; versus MX29GL256FHT2I-90G, it adds automotive qualification, OTP security, and superior endurance-critical for safety-critical firmware storage.
Availability
S70GL02GS11FHI010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, and medical imaging subsystems requiring stable component supply, long lifecycle support, and AEC-Q100 compliance.
Supply support for S70GL02GS11FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical systems.
The GL-S series targets automotive and industrial embedded applications requiring AEC-Q100-qualified, high-endurance parallel NOR flash for boot code, firmware, and secure configuration storage.
FAQ
What temperature grades are supported by S70GL02GS11FHI010?
This device is qualified for Industrial (–40°C to +85°C) and Automotive AEC-Q100 Grade 2 (–40°C to +105°C) and Grade 3 (–40°C to +85°C) operation. The "H" in the part number denotes Grade 2 qualification, confirmed in the official Infineon ordering information table.
Does S70GL02GS11FHI010 support Common Flash Interface (CFI)?
Yes, it fully supports CFI per JEDEC JESD68 standard. The device responds to CFI query commands with valid vendor, device, and geometry information, enabling automatic detection and configuration by UEFI BIOS, Linux MTD drivers, and embedded bootloaders without hard-coded timing parameters.
How is dual-die addressing implemented in S70GL02GS11FHI010?
A26 functions as the die-select address line: when A26 = 0, the lower 1-Gb die (addresses 0x0000000–0x07FFFFFF) is accessed; when A26 = 1, the upper 1-Gb die (0x08000000–0x0FFFFFFF) is selected. Both dies share CE#, OE#, WE#, and DQ0–DQ15, enabling seamless 2-Gb linear addressing.
What is the purpose of the RFU and DNU balls in the 64-ball BGA package?
RFU (Reserved for Future Use) balls like F7 and G1 have no internal connection today but may support future features; DNU (Do Not Use) ball E1 connects internally to test circuitry and must not be routed on PCB. NC (No Connect) balls such as A1 and H8 are unconnected and may be used for routing-per Infineon's handling instructions in the datasheet.
S70GL02GS11FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHI010 FAQ
1.How can I place an order for S70GL02GS11FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHI010 reliable?
The price and inventory of S70GL02GS11FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHI010 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHI010?
S70GL02GS11FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHI010?
For technical support, including S70GL02GS11FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHI010 requirements.
6.How does Aetrix verify that S70GL02GS11FHI010 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHI010 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHI010?
All S70GL02GS11FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHI010 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GS11FHI010 Tags
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