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Infineon Technologies S70GL02GS11FHI013
- Part No.:
- S70GL02GS11FHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHI013.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,907
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Product details
Overview
S70GL02GS11FHI013 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ process, featuring 110 ns random access time, 25 ns page access time, and 512-byte programming buffer. It integrates two S29GL01GS dies in a single 64-ball Fortified-BGA package and operates from 2.7 V to 3.6 V supply, targeting embedded boot code storage in industrial controllers and automotive ECUs.
For engineers reviewing the S70GL02GS11FHI013 datasheet, S70GL02GS11FHI013 pinout, S70GL02GS11FHI013 application, or S70GL02GS11FHI013 equivalent, key selection criteria include uniform 128-KB sector erase capability, AEC-Q100 Grade 2/3 qualification, Versatile I/O™ support (1.65 V–VCC), Ready/Busy status signaling, and OTP array with dual lockable regions.
Technical Context
This device implements a dual-die stacked architecture where two independent 1-Gb S29GL01GS dies share address/data bus and control signals via external A26 bit selection. Each die supports CFI-compliant autoselect, status register polling, and hardware reset with dedicated RY/BY# output for real-time operation monitoring.
It uses CMOS 3.0 V core with separate VIO supply enabling flexible interface voltage scaling, supports suspend/resume during program/erase, and provides advanced sector protection (volatile/non-volatile) plus 1024-byte one-time-programmable (OTP) array with two independently lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gbit (256 MB), realized as dual 1-Gb die stack for scalable capacity without bus widening |
| Access time | 110 ns random access, enabling direct XIP execution from flash in real-time embedded systems |
| Programming buffer | 512-byte page buffer, reducing effective programming time by ~10× vs. byte-wise writes |
| Sector size | Uniform 128 KB sectors (2048 total), simplifying firmware partitioning and OTA update management |
| Endurance & retention | 100,000 erase cycles per sector and 20-year data retention at 85°C, meeting industrial lifecycle requirements |
| Temperature grade | AEC-Q100 Grade 2 (–40°C to +105°C) and Grade 3 (–40°C to +85°C), qualified for under-hood automotive use |
| Supply range | Single VCC 2.7–3.6 V for read/program/erase; VIO 1.65 V–VCC enables mixed-voltage host interfacing |
Pinout & Package
Package: 64-ball LSH Fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A26 | Dual-die select | High selects second die; enables full 2-Gb addressing across two stacked 1-Gb devices |
| DQ15–DQ0 | Data I/O bus | 16-bit bidirectional data path supporting x16 mode; no x8/x16 configuration pins required |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard parallel NOR control signals; CE# gating reduces standby current to 200 µA |
| RY/BY# | Status indicator | Active-low open-drain output signaling active erase/program; eliminates need for software polling loops |
| WP# | Hardware write protect | Protects first/last sector regardless of ASP settings; supports both protection and programming acceleration modes |
| VIO | I/O voltage reference | Independent supply pin allowing interface voltage scaling down to 1.65 V while maintaining core functionality |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Two S29GL01GS dies in single footprint deliver 2-Gb density without increasing PCB area or signal count |
| Versatile I/O™ | VIO pin decouples I/O voltage from core VCC, enabling seamless integration with 1.8 V or 3.3 V host processors |
| Suspend/resume | Allows interrupting long erase/program operations to service higher-priority tasks, critical for real-time OS environments |
| Advanced sector protection | Volatile and non-volatile locking per sector prevents accidental firmware corruption during field updates |
| OTP array | 1024-byte factory-programmable region with two lockable sections for secure key storage or calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive Powertrain ECU Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP-capable read performance and sector-level update isolation. Use Value: 110 ns access time enables deterministic boot timing; 100K-cycle endurance supports frequent firmware validation cycles. | Use Scenario: Holding calibrated engine control maps and bootloader in diesel/gasoline powertrain ECUs exposed to under-hood thermal stress. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash providing reliable code storage with hardware write protection. Use Value: +105°C rating ensures operation at peak under-hood temperatures; WP# pin safeguards against unintended reprogramming during diagnostics. |
| Medical Imaging System Configuration | Avionics Display Unit Boot ROM |
Use Scenario: Retaining FPGA configuration bitstreams and calibration profiles in portable ultrasound and MRI subsystems requiring long-term data integrity. IC Role / Device Role / Timing Role: High-reliability configuration store with 20-year data retention and OTP-secured calibration constants. Use Value: Non-volatile OTP array stores device-specific calibration data; sector protection prevents overwrite during field service. | Use Scenario: Hosting certified boot firmware in DO-178C-compliant cockpit display units where deterministic startup and tamper resistance are mandatory. IC Role / Device Role / Timing Role: Safety-certifiable parallel flash with hardware reset, RY/BY# status signaling, and sector-level write lock. Use Value: RY/BY# output enables precise timing of boot sequence verification; suspend/resume supports diagnostic interrupt handling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1-Gb version in identical 64-ball Fortified-BGA package; lacks A26 dual-die select and half the capacity | Suitable for cost-sensitive designs where 1-Gb density suffices and dual-die complexity is unnecessary | Select when board layout must remain unchanged but full 2-Gb capacity is not required |
| MX29GL256FHTI-90G | 2-Gb parallel NOR from Macronix; 90 ns random access, no AEC-Q100 qualification, different CFI command set | Applicable in commercial-grade industrial systems where automotive qualification is not mandated | Choose for non-automotive applications prioritizing lower unit cost over extended temperature and qualification compliance |
Compared with S29GL01GS11FHIV10, the S70GL02GS11FHI013 doubles density via dual-die stacking without changing footprint; versus MX29GL256FHTI-90G, it delivers AEC-Q100 Grade 2 reliability and tighter 110 ns access timing at the cost of vendor-specific command compatibility.
Availability
S70GL02GS11FHI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive powertrain ECU boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GS11FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical applications.
The GL-S series targets embedded systems needing robust, high-density parallel NOR flash with automotive qualification, fast XIP performance, and long-term data retention-designed specifically for boot code and firmware storage in harsh environments.
FAQ
What is the function of the A26 pin on S70GL02GS11FHI013?
A26 serves as the dual-die select signal: logic high accesses the second 1-Gb die, while logic low selects the first die. This enables full 2-Gb addressing using standard 1-Gb-compatible host interfaces without additional address lines or multiplexing logic.
Does S70GL02GS11FHI013 support both 1.8 V and 3.3 V I/O interfaces?
Yes-the Versatile I/O™ feature allows VIO to be set between 1.65 V and VCC. When VCC = 3.3 V, VIO can be independently supplied at 1.8 V to interface directly with 1.8 V microcontrollers, eliminating level-shifter components in mixed-voltage designs.
How does the 512-byte programming buffer improve firmware update efficiency?
The buffer enables up to 512 bytes to be loaded before initiating internal programming, reducing overhead from repeated command sequences. Measured performance shows 1.5 MBps effective write rate-approximately 10× faster than single-word programming-cutting OTA update time significantly in field-deployed systems.
Is the OTP array accessible after device initialization?
Yes-the 1024-byte OTP array is mapped into the main address space and remains readable throughout operation. Its two lockable regions can be permanently secured via dedicated CFI commands; once locked, contents are immutable and resistant to accidental overwrite or erase commands.
S70GL02GS11FHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHI013 FAQ
1.How can I place an order for S70GL02GS11FHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHI013 reliable?
The price and inventory of S70GL02GS11FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHI013 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHI013?
S70GL02GS11FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHI013?
For technical support, including S70GL02GS11FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHI013 requirements.
6.How does Aetrix verify that S70GL02GS11FHI013 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHI013 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHI013?
All S70GL02GS11FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHI013 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GS11FHI013 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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