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Infineon Technologies S70GL02GS11FHI020
- Part No.:
- S70GL02GS11FHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHI020.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:344
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Product details
Overview
S70GL02GS11FHI020 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ process, featuring 110 ns random access time, 25 ns page access time, and a 512-byte programming buffer. It integrates two S29GL01GS die in a single 64-ball Fortified-BGA package and supports industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) operation for embedded boot code storage.
For engineers reviewing the S70GL02GS11FHI020 datasheet, S70GL02GS11FHI020 pinout, S70GL02GS11FHI020 application, or S70GL02GS11FHI020 equivalent, key selection criteria include uniform 128-KB sector erase capability, Versatile I/O™ support (1.65 V to VCC), CFI compliance, WP#-based sector protection, and dual-die stack architecture with second-die access control.
Technical Context
This device implements a dual-die stacked architecture where each 1-Gb S29GL01GS die occupies half the address space, accessed via A26 address line toggling. Sector erase and program operations are executed independently per die, with shared control signals (CE#, WE#, OE#) and common status reporting via RY/BY#.
The 64-ball LSH Fortified-BGA package enables high-density PCB layout while supporting 16-bit data bus width (DQ0–DQ15), single 3.0 V supply (2.7–3.6 V), and wide I/O voltage range (1.65–VCC). OTP array (1024 bytes, two lockable regions) and ASP provide secure firmware storage and field-upgrade protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gbit (256 MB), dual-die stack of two 1-Gb S29GL01GS devices |
| Access time | 110 ns random access, 25 ns page access - enables fast instruction fetch in boot ROM applications |
| Programming buffer | 512-byte buffer - reduces effective programming time by up to 256× vs. byte-wise writes |
| Sector size & count | Uniform 128 KB sectors × 2048 - simplifies firmware partitioning and OTA update management |
| Endurance & retention | 100,000 erase cycles per sector, 20-year data retention - meets long-life industrial controller requirements |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs |
| I/O voltage range | VIO = 1.65 V to VCC - interoperable with mixed-voltage SoC interfaces without level shifters |
Pinout & Package
Package: 64-ball LSH Fortified-BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad (VSSQ) and dedicated VIO supply for I/O voltage flexibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25, A26 | Address inputs | A26 selects between top/bottom 1-Gb die; A0–A25 address within selected die (26-bit addressing) |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path for read/write/erase commands and data transfer |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard parallel NOR control signals; CE# active-low chip select enables device operation |
| RY/BY# | Ready/Busy output | Open-drain signal indicating active erase/program (low) or ready state (high-Z) |
| WP# | Write Protect input | Hardware lock for outermost sectors; low = protection enabled, high = accelerated programming mode |
| VCC, VIO, VSS, VSSQ | Power supplies | VCC = core logic (2.7–3.6 V); VIO = I/O interface (1.65–VCC); VSS/VSSQ = separate analog/digital grounds |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Two independent 1-Gb S29GL01GS dies in one BGA footprint - doubles density without increasing board area |
| Versatile I/O™ | VIO range 1.65 V to VCC - eliminates external level shifters when interfacing with 1.8 V or 3.3 V host processors |
| Advanced sector protection | Volatile/non-volatile locking per sector - prevents accidental firmware corruption during field updates |
| OTP array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data securely |
| CFI compliance | Common Flash Interface v1.3 support - enables OS-agnostic flash drivers and standardized initialization sequences |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and real-time control algorithms in engine management systems requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary non-volatile boot ROM with deterministic 110 ns read latency and 128 KB sector erase for safe firmware patching. Use Value: Enables certified over-the-air (OTA) updates with hardware-based sector locking and 100K-cycle endurance for 15+ year vehicle lifecycles. | Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Parallel NOR flash used as execution-in-place (XIP) memory for deterministic real-time task startup and watchdog recovery. Use Value: Supports rapid 477 KBps sector erase and 1.5 MBps buffered programming - cuts firmware update downtime by >60% vs. legacy serial flash. |
| Telecom Base Station Boot Memory | Medical Imaging System Configuration Storage |
Use Scenario: Hosting bootloader and FPGA bitstreams in 5G radio units operating across extended industrial temperature ranges. IC Role / Device Role / Timing Role: High-reliability parallel interface flash with CFI support for multi-vendor BIOS compatibility and secure boot chain anchoring. Use Value: Dual-die architecture allows redundant firmware partitions; OTP array stores root-of-trust keys for secure boot verification. | Use Scenario: Storing calibration profiles, safety-critical configuration parameters, and diagnostic logs in MRI and CT scanner control modules. IC Role / Device Role / Timing Role: Non-volatile configuration store with 20-year data retention and hardware write protection (WP#) for regulatory compliance (IEC 62304). Use Value: Advanced sector protection prevents unauthorized modification during maintenance; 128 KB uniform sectors simplify FDA audit-ready firmware versioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1 Gbit variant, identical 64-ball LSH BGA package and pinout, same 110 ns access time | Lacks dual-die stacking; halved capacity limits use in full-image storage for complex bootloaders | Select when system memory map requires only 128 MB and cost sensitivity outweighs density needs |
| MX29GL256FHT2I-90G | 2 Gbit Macronix device, 90 ns random access, 48-pin TSOP package, no AEC-Q100 qualification | TSOP packaging increases PCB footprint; lacks automotive qualification and OTP array | Choose for cost-sensitive industrial designs where AEC-Q100 is not required and board space permits larger package |
Compared with S29GL01GS11FHIV10, this part delivers double density in identical footprint; versus MX29GL256FHT2I-90G, it offers automotive qualification, smaller BGA form factor, and integrated OTP security - critical for safety-certified systems.
Availability
S70GL02GS11FHI020 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot memory, and telecom base station configuration requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 compliance.
Supply support for S70GL02GS11FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.
The GL-S series targets high-reliability embedded applications demanding AEC-Q100 qualification, deterministic timing, and secure firmware storage - optimized for boot code, FPGA configuration, and safety-critical parameter retention.
FAQ
What is the function of the A26 address line in S70GL02GS11FHI020?
A26 serves as the die-select signal: when low, it accesses the lower 1-Gb die (addresses 0x0000000–0x3FFFFFF); when high, it selects the upper 1-Gb die (0x4000000–0x7FFFFFF). This enables seamless dual-die operation using standard parallel NOR interface timing without external multiplexing.
Does S70GL02GS11FHI020 support execute-in-place (XIP) operation?
Yes - its 110 ns random access time and parallel 16-bit interface enable direct code execution from flash without copying to RAM. The device supports standard NOR read commands and CFI query modes required by XIP-capable bootloaders and RTOS kernels.
How is write protection implemented on S70GL02GS11FHI020?
Hardware write protection is controlled by the WP# pin: pulling WP# low disables program/erase in the first and last 128 KB sectors. Additional software-controlled Advanced Sector Protection (ASP) allows volatile or non-volatile locking of any individual sector, independent of WP# state.
What is the purpose of the VIO supply pin?
VIO sets the I/O buffer voltage level independently from VCC, supporting 1.65–3.6 V operation. This allows direct interfacing with 1.8 V microcontrollers or 3.3 V FPGAs without external level shifters, reducing BOM count and signal integrity risk in mixed-voltage systems.
S70GL02GS11FHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHI020 FAQ
1.How can I place an order for S70GL02GS11FHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHI020 reliable?
The price and inventory of S70GL02GS11FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHI020 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHI020?
S70GL02GS11FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHI020?
For technical support, including S70GL02GS11FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHI020 requirements.
6.How does Aetrix verify that S70GL02GS11FHI020 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHI020 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHI020?
All S70GL02GS11FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHI020 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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