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Infineon Technologies S70GL02GS11FHI023
- Part No.:
- S70GL02GS11FHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHI023.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,198
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Product details
Overview
S70GL02GS11FHI023 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ process, featuring 110 ns random access time, 25 ns page access time, and a 512-byte programming buffer. It integrates two S29GL01GS dies in a single 64-ball Fortified-BGA package and supports 1.65 V–3.6 V I/O voltage range for embedded boot code and firmware storage applications.
For engineers reviewing the S70GL02GS11FHI023 datasheet, S70GL02GS11FHI023 pinout, S70GL02GS11FHI023 application, or S70GL02GS11FHI023 equivalent, key selection criteria include uniform 128-KB sector erase capability, AEC-Q100 Grade 2/3 automotive qualification, Versatile I/O™ compatibility, and CFI-compliant interface for legacy system integration.
Technical Context
This device implements dual-die stacking architecture with independent address mapping per 1-Gb die, enabling seamless 2-Gb contiguous addressing via A26 as die select. Sector erase and program operations are fully autonomous with suspend/resume support and status reporting via RY/BY# pin, data polling, or Status Register read.
It uses CMOS 3.0 V core with separate VIO supply (1.65 V–VCC), supporting mixed-voltage host interfaces. The ×16 data bus, 16-word read buffer, and OTP array with two lockable 1024-byte regions provide secure firmware partitioning and boot integrity control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gbit (256 MB) total capacity, realized as dual 1-Gb S29GL01GS die stack |
| Access time | 110 ns random access time at 3.0 V, enabling direct CPU memory-mapped execution |
| Programming buffer | 512-byte write buffer allowing burst programming at 1.5 MBps effective rate |
| Erase granularity | Uniform 128-KB sectors (2048 total), no boot-block or variable-size sectors |
| Endurance & retention | 100,000 erase cycles per sector, 20-year data retention at +85°C |
| Operating temperature | Industrial (–40°C to +85°C) and AEC-Q100 Grade 2 (–40°C to +105°C) |
| VIO range | 1.65 V to VCC (2.7 V–3.6 V), enabling interoperability with 1.8 V/2.5 V/3.3 V controllers |
Pinout & Package
Package: 64-ball LSH Fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad exposed on bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A26–A0 | Address inputs | A26 selects top/bottom die; A0–A25 address within selected 1-Gb die |
| DQ15–DQ0 | Data I/O bus | ×16 bidirectional data path; supports byte/word writes and CFI queries |
| CE#, OE#, WE# | Control enables | Standard parallel flash control signals; CE# active-low chip select |
| RY/BY#, RESET#, WP# | Status & control | RY/BY# indicates active erase/program; RESET# forces read mode; WP# protects outermost sectors |
| VCC, VIO, VSS | Power supplies | VCC = 2.7–3.6 V core; VIO = 1.65–VCC I/O; VSS = ground reference |
| NC, RFU, DNU | No-connect terminals | A1/A8/C1/D1/H1/H8 = NC; F7/G1 = RFU; E1 = DNU (test-only, internal pull-down) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Two 1-Gb S29GL01GS dies in single footprint, delivering 2-Gb density without board layout change |
| Versatile I/O™ | Independent VIO supply allows direct interface to 1.8 V, 2.5 V, or 3.3 V host processors |
| Advanced sector protection | Volatile and non-volatile locking per 128-KB sector, including OTP-based secure boot region |
| Suspend/resume capability | Interrupt erase or program to service high-priority reads, then resume without data loss |
| CFI compliance | Common Flash Interface support enables automatic detection and configuration by BIOS/bootloader |
Applications
| Automotive Instrument Clusters | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, firmware updates, and driver behavior profiles in digital dashboards. IC Role / Device Role / Timing Role: Nonvolatile boot memory mapped directly to MCU address space for fast startup and over-the-air update staging. Use Value: AEC-Q100 Grade 2 rating ensures reliable operation at +105°C ambient; 100K-cycle endurance supports frequent field updates. | Use Scenario: Holding ladder logic firmware, I/O configuration tables, and safety-critical runtime parameters in programmable logic controllers. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic read latency (<110 ns) for real-time scan cycle execution. Use Value: Uniform 128-KB sectors simplify firmware partitioning; suspend/resume enables background updates without interrupting control loops. |
| Medical Imaging Boot ROM | Avionics Display System Memory |
Use Scenario: Storing certified boot loader, FPGA configuration bitstreams, and DICOM protocol stacks in ultrasound/MRI subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware storage with OTP lockable regions for regulatory compliance. Use Value: Two independent 1024-byte OTP arrays allow separation of bootloader keys and calibration data with hardware-enforced write protection. | Use Scenario: Hosting display firmware, font assets, and ARINC-661 widget definitions in cockpit multifunction displays. IC Role / Device Role / Timing Role: High-reliability parallel flash with RY/BY# status signaling for deterministic boot sequence timing. Use Value: 20-year data retention meets DO-160E environmental lifetime requirements; CFI support simplifies avionics BIOS integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single 1-Gb die, identical 64-ball Fortified-BGA package, same timing and feature set | Half capacity; suitable when 128 MB suffices and cost-per-bit optimization is critical | Select for lower density requirement or where dual-die stacking introduces unnecessary complexity |
| MX29GL256FHTI-90G | 256-MB (2-Gb) parallel NOR, 90 ns access time, 1.8 V/3.3 V I/O, different pinout (56-pin TSOP) | TSOP package only; lacks AEC-Q100 qualification and Versatile I/O flexibility | Choose for cost-sensitive industrial designs where BGA assembly is unavailable or thermal constraints favor TSOP |
Compared with S29GL01GS11FHIV10, the S70GL02GS11FHI023 doubles density in identical footprint; versus MX29GL256FHTI-90G, it offers automotive qualification, superior 110 ns access, and flexible VIO but requires BGA reflow capability.
Availability
S70GL02GS11FHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging boot ROM requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70GL02GS11FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and R&D centers.
The GL-S series targets high-reliability embedded systems requiring AEC-Q100 qualified parallel NOR flash for boot code, firmware, and configuration storage in harsh environments.
FAQ
What is the function of the A26 pin on S70GL02GS11FHI023?
A26 serves as the die-select signal in the dual-die stack architecture. When high, it enables the upper 1-Gb die; when low, it enables the lower 1-Gb die. This allows contiguous 2-Gb addressing while maintaining full compatibility with existing 1-Gb S29GL01GS software drivers and memory maps.
Does S70GL02GS11FHI023 support hardware reset recovery after power loss during programming?
Yes. The device includes an internal power-on reset circuit and automatic write-erase abort recovery. If VCC drops below the reset threshold during programming or erase, the operation halts cleanly and the Status Register reflects the incomplete state, preventing partial writes or sector corruption.
Can the OTP array be used for storing cryptographic keys in secure boot implementations?
Yes. The 1024-byte OTP array is divided into two independently lockable regions. Once locked, each region becomes permanently read-only, making it suitable for storing immutable root-of-trust keys, certificate hashes, or bootloader signature verification parameters required by IEC 62443 or ISO/SAE 21434.
Is the 64-ball Fortified-BGA package compatible with standard PCB reflow profiles?
Yes. The LSH064 package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C, 60-second duration). However, ultrasonic cleaning must be avoided post-assembly to prevent internal delamination or data corruption.
S70GL02GS11FHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHI023 FAQ
1.How can I place an order for S70GL02GS11FHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHI023 reliable?
The price and inventory of S70GL02GS11FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHI023 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHI023?
S70GL02GS11FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHI023?
For technical support, including S70GL02GS11FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHI023 requirements.
6.How does Aetrix verify that S70GL02GS11FHI023 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHI023 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHI023?
All S70GL02GS11FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHI023 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GS11FHI023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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